wherein the active component for bonding is not the largest fraction of the interlayer

Industry

CPC
C04B2237/126

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

CCHEMISTRY METALLURGY C04Concrete, cement, ceramics C04BLIME, MAGNESIA SLAG CEMENTS COMPOSITIONS THEREOF C04B2237/00Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating

Current Industry

C04B2237/126wherein the active component for bonding is not the largest fraction of the interlayer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 12,128,494
- Issue date Oct 29, 2024
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper/ceramic joined body and insulating circuit substrate
- Patent number 12,125,765
- Issue date Oct 22, 2024
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical energy storage devices
- Patent number 11,909,004
- Issue date Feb 20, 2024
- AMBRI INC.
- David J. Bradwell
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor substrate support with multiple electrodes and method...
- Patent number 11,712,745
- Issue date Aug 1, 2023
- Watlow Electric Manufacturing Company
- Michael Parker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor processing equipment with high temperature resistant...
- Patent number 11,648,620
- Issue date May 16, 2023
- Watlow Electric Manufacturing Company
- Brent Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate support with multiple electrodes and method...
- Patent number 11,229,968
- Issue date Jan 25, 2022
- Watlow Electric Manufacturing Company
- Michael Parker
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Member for semiconductor manufacturing apparatus and method for pro...
- Patent number 11,205,584
- Issue date Dec 21, 2021
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature method for hermetically joining non-diffusing ceram...
- Patent number 11,091,397
- Issue date Aug 17, 2021
- Watlow Electric Manufacturing Company
- Alfred Grant Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic base material, metal-ceramic joint structure, method...
- Patent number 11,060,192
- Issue date Jul 13, 2021
- Tatsuta Electric Wire & Cable Co., Ltd.
- Masaki Hirano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Bonded body, power module substrate, method for manufacturing bonde...
- Patent number 11,062,974
- Issue date Jul 13, 2021
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Silica glass member, process for producing the same, and process fo...
- Patent number 10,916,687
- Issue date Feb 9, 2021
- COORSTEK KK
- Hiroaki Kobayashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting insert, cutting tool comprising such an insert and methods...
- Patent number 10,814,435
- Issue date Oct 27, 2020
- DIAMONDE
- Timothée Grunder
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body including ceramic member and metallic member and method...
- Patent number 10,814,436
- Issue date Oct 27, 2020
- NGK Insulators, Ltd.
- Tomoyuki Minami
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nuclear reactor fuel rod and fuel assembly having bundled same
- Patent number 10,796,807
- Issue date Oct 6, 2020
- Hitachi, Ltd.
- Ryou Ishibashi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonded substrate and method for manufacturing bonded substrate
- Patent number 10,784,182
- Issue date Sep 22, 2020
- NGK Insulators, Ltd.
- Makoto Tani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacture of a multi-layer plate device
- Patent number 10,646,941
- Issue date May 12, 2020
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit substrate and method for producing ceramic circuit...
- Patent number 10,485,112
- Issue date Nov 19, 2019
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a composite material
- Patent number 10,448,504
- Issue date Oct 15, 2019
- Rogers Germany GmbH
- Andreas Meyer
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic circuit board
- Patent number 10,424,529
- Issue date Sep 24, 2019
- DENKA COMPANY LIMITED
- Ryota Aono
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module substrate, power module substrate with heat sink, powe...
- Patent number 10,375,825
- Issue date Aug 6, 2019
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Active metal braze joint with stress relieving layer
- Patent number 10,363,624
- Issue date Jul 30, 2019
- Diamond Innovations, Inc.
- Thomas Easley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic milling cutter
- Patent number 10,322,457
- Issue date Jun 18, 2019
- Sandvik Intellectual Property AB
- Emmanuel David
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature method for hermetically joining non-diffusing ceram...
- Patent number 10,287,215
- Issue date May 14, 2019
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer plate device
- Patent number 10,213,858
- Issue date Feb 26, 2019
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-ceramic bonded body and power module substrate
- Patent number 10,103,035
- Issue date Oct 16, 2018
- Mitsubishi Materials Corporation
- Nobuyuki Terasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining ceramic to metal, and sealing structure thereof
- Patent number 10,103,410
- Issue date Oct 16, 2018
- General Electric Company
- Sundeep Kumar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly having at least two ceramic bodies joined with one another...
- Patent number 9,931,717
- Issue date Apr 3, 2018
- Endress + Hauser GmbH + Co. KG
- Andreas Rossberg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power-module substrate and manufacturing method thereof
- Patent number 9,862,045
- Issue date Jan 9, 2018
- Mitsubishi Materials Corporation
- Toshiyuki Nagase
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic pressure measuring cell and method for its manufacture
- Patent number 9,816,887
- Issue date Nov 14, 2017
- Endress + Hauser GmbH + Co. KG
- Andrea Berlinger
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining metal-ceramic substrates to metal bodies
- Patent number 9,790,130
- Issue date Oct 17, 2017
- IXYS Semiconductor GmbH
- Heiko Knoll
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD...
- Publication number 20220143726
- Publication date May 12, 2022
- WATLOW ELECTRIC MANUFACTURING COMPANY
- Michael PARKER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Joining Metal-Ceramic Substrates to Metal Bodies
- Publication number 20180002239
- Publication date Jan 4, 2018
- IXYS Semiconductor GmbH
- Heiko Knoll
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PROCESS FOR PRODUCING A HIGH-TEMPERATURE-RESISTANT COMPOSITE BODY
- Publication number 20140334606
- Publication date Nov 13, 2014
- Thomas Mueller
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CERAMIC/COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20140291699
- Publication date Oct 2, 2014
- Keiichi YANO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CUTTING INSERT
- Publication number 20140212233
- Publication date Jul 31, 2014
- TaeguTec, Ltd.
- Kwon Hee Park
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method For Manufacture Of A Multi-Layer Plate Device
- Publication number 20140197227
- Publication date Jul 17, 2014
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B32 - LAYERED PRODUCTS
Information Patent Application
LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY
- Publication number 20140134448
- Publication date May 15, 2014
- NHK Spring Co., Ltd.
- Yuichiro Yamauchi
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BRAZING MATERIAL, BRAZING MATERIAL PASTE, CERAMIC CIRCUIT SUBSTRATE...
- Publication number 20140126155
- Publication date May 8, 2014
- Hitachi Metals, Ltd.
- Hisayuki Imamura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
ACTIVE METAL BRAZING MATERIAL
- Publication number 20140037492
- Publication date Feb 6, 2014
- Tanaka Kikinzoku Kogyo K.K.
- Takaomi Kishimoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Hermetically Joined Ceramic Assemblies And Low Temperature Method F...
- Publication number 20130186940
- Publication date Jul 25, 2013
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B32 - LAYERED PRODUCTS
Information Patent Application
Hermetically Joined Plate And Shaft Devices
- Publication number 20130189022
- Publication date Jul 25, 2013
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-Layer Plate Device
- Publication number 20130180976
- Publication date Jul 18, 2013
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B32 - LAYERED PRODUCTS
Information Patent Application
Method For Hermetically Joining Plate And Shaft Devices Including C...
- Publication number 20130181038
- Publication date Jul 18, 2013
- Component Re-Engineering Company, Inc.
- Alfred Grant Elliot
- B32 - LAYERED PRODUCTS
Information Patent Application
Composite Material
- Publication number 20130029175
- Publication date Jan 31, 2013
- Tungaloy Corporation
- Takashi Umemura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUB...
- Publication number 20130010429
- Publication date Jan 10, 2013
- MITSUBISHI MATERIALS CORPORATION
- Hiroshi Tonomura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SPUTTERING TARGET-BACKING PLATE ASSEMBLY
- Publication number 20120318669
- Publication date Dec 20, 2012
- JX NIPPON MINING & METALS CORPORATION
- Yuki Ikeda
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Method of Joining Metal-Ceramic Substrates to Metal Bodies
- Publication number 20120305281
- Publication date Dec 6, 2012
- IXYS Semiconductor GmbH
- Heiko Knoll
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD OF MANUFACTURING POWER MODULE SUBSTRATE AND POWER MODULE SUB...
- Publication number 20120267149
- Publication date Oct 25, 2012
- MITSUBISHI MATERIALS CORPORATION
- Sotaro Oi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
METHOD FOR METALLIZING CERAMIC SURFACE AND METHOD FOR CONNECTING CE...
- Publication number 20120121896
- Publication date May 17, 2012
- TSINGHUA UNIVERSITY
- Xiaoshan Ning
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR JOINING STAINLESS STEEL PART AND SILICON CARBIDE CERAMI...
- Publication number 20120107641
- Publication date May 3, 2012
- HON HAI Precision Industry CO., LTD.
- HSIN-PEI CHANG
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
ALUMINUM NITRIDE SUBSTRATE, ALUMINUM NITRIDE CIRCUIT BOARD, SEMICON...
- Publication number 20120038038
- Publication date Feb 16, 2012
- Toshiba Materials Co., Ltd.
- Haruhiko Yamaguchi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
JOINING DEVICE
- Publication number 20120001421
- Publication date Jan 5, 2012
- SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN
- Christian His
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COMPLIANT MATERIAL
- Publication number 20120001417
- Publication date Jan 5, 2012
- SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN
- Christian His
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLUSH JOINT
- Publication number 20120001422
- Publication date Jan 5, 2012
- SAINT-GOBAIN CENTRE DE RECHERCHES ET D'ETUDES EUROPEEN
- Christian His
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SOLDER ALLOY
- Publication number 20110244252
- Publication date Oct 6, 2011
- AUTIUM PTE LTD
- Peng Chum Loh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE OBJECT AND METHOD FOR THE PRODUCTION THEREOF
- Publication number 20110151157
- Publication date Jun 23, 2011
- EMPA EIDGENOSSISCHE MATERIAL-PROFUNGS-UND FORSCHUN
- Matthias Koebel
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HERMETIC SEALING ASSEMBLY AND ELECTRICAL DEVICE INCLUDING THE SAME
- Publication number 20100327537
- Publication date Dec 30, 2010
- GENERAL ELECTRIC COMPANY
- Curtis Alan Johnson
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
MULTILAYER THERMAL PROTECTION SYSTEM AND METHOD FOR MAKING SAME
- Publication number 20100247953
- Publication date Sep 30, 2010
- ALSTOM Technology Ltd.
- Hans-Peter Bossmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY...
- Publication number 20090283309
- Publication date Nov 19, 2009
- KABUSHIKI KAISHA TOSHIBA
- Takayuki Naba
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ORIENTED FIBER CERAMIC MATRIX COMPOSITE ABRADABLE THERMAL BARRIER C...
- Publication number 20090060747
- Publication date Mar 5, 2009
- Christopher W. Strock
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES

wherein the active component for bonding is not the largest fraction of the interlayer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor processing equipment with high temperature resistant...

Copper/ceramic joined body and insulating circuit substrate

Electrochemical energy storage devices

Semiconductor substrate support with multiple electrodes and method...

Semiconductor processing equipment with high temperature resistant...

Semiconductor substrate support with multiple electrodes and method...

Member for semiconductor manufacturing apparatus and method for pro...

Low temperature method for hermetically joining non-diffusing ceram...

Metal-ceramic base material, metal-ceramic joint structure, method...

Bonded body, power module substrate, method for manufacturing bonde...

Silica glass member, process for producing the same, and process fo...

Cutting insert, cutting tool comprising such an insert and methods...

Joined body including ceramic member and metallic member and method...

Nuclear reactor fuel rod and fuel assembly having bundled same

Bonded substrate and method for manufacturing bonded substrate

Method for manufacture of a multi-layer plate device

Ceramic circuit substrate and method for producing ceramic circuit...

Method for producing a composite material

Ceramic circuit board

Power module substrate, power module substrate with heat sink, powe...

Active metal braze joint with stress relieving layer

Ceramic milling cutter

Low temperature method for hermetically joining non-diffusing ceram...

Multi-layer plate device

Copper-ceramic bonded body and power module substrate

Method for joining ceramic to metal, and sealing structure thereof

Assembly having at least two ceramic bodies joined with one another...

Power-module substrate and manufacturing method thereof

Ceramic pressure measuring cell and method for its manufacture

Method of joining metal-ceramic substrates to metal bodies

Patents Applicationslast 30 patents

SEMICONDUCTOR SUBSTRATE SUPPORT WITH MULTIPLE ELECTRODES AND METHOD...

Method of Joining Metal-Ceramic Substrates to Metal Bodies

PROCESS FOR PRODUCING A HIGH-TEMPERATURE-RESISTANT COMPOSITE BODY

CERAMIC/COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE

CUTTING INSERT

Method For Manufacture Of A Multi-Layer Plate Device

LAMINATED BODY AND METHOD OF MANUFACTURING LAMINATED BODY

BRAZING MATERIAL, BRAZING MATERIAL PASTE, CERAMIC CIRCUIT SUBSTRATE...

ACTIVE METAL BRAZING MATERIAL

Hermetically Joined Ceramic Assemblies And Low Temperature Method F...

Hermetically Joined Plate And Shaft Devices

Multi-Layer Plate Device

Method For Hermetically Joining Plate And Shaft Devices Including C...

Composite Material

METHOD FOR PRODUCING SUBSTRATE FOR POWER MODULE WITH HEAT SINK, SUB...

SPUTTERING TARGET-BACKING PLATE ASSEMBLY

Method of Joining Metal-Ceramic Substrates to Metal Bodies

METHOD OF MANUFACTURING POWER MODULE SUBSTRATE AND POWER MODULE SUB...

METHOD FOR METALLIZING CERAMIC SURFACE AND METHOD FOR CONNECTING CE...

PROCESS FOR JOINING STAINLESS STEEL PART AND SILICON CARBIDE CERAMI...

ALUMINUM NITRIDE SUBSTRATE, ALUMINUM NITRIDE CIRCUIT BOARD, SEMICON...

JOINING DEVICE

COMPLIANT MATERIAL

FLUSH JOINT

SOLDER ALLOY

COMPOSITE OBJECT AND METHOD FOR THE PRODUCTION THEREOF

HERMETIC SEALING ASSEMBLY AND ELECTRICAL DEVICE INCLUDING THE SAME

MULTILAYER THERMAL PROTECTION SYSTEM AND METHOD FOR MAKING SAME

CERAMIC-METAL BONDED BODY, METHOD FOR MANUFACTURING THE BONDED BODY...

ORIENTED FIBER CERAMIC MATRIX COMPOSITE ABRADABLE THERMAL BARRIER C...