TREA

wherein the bump connectors are disposed on both the semiconductor chip and the mounting substrate

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Industry

  • CPC
  • H01L2021/60247
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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60247wherein the bump connectors are disposed on both the semiconductor chip and the mounting substrate
Industries