wherein the bump connectors are disposed on both the semiconductor chip and the mounting substrate

Follow

Industry

CPC
H01L2021/60247

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60247wherein the bump connectors are disposed on both the semiconductor chip and the mounting substrate

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 9,978,716
- Issue date May 22, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING USING IN-SITU PLASMA TREATMENT AND APPARATUS FOR EFFEC...
- Publication number 20240404839
- Publication date Dec 5, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hui-Min Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170317054
- Publication date Nov 2, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang TSAO
- H01 - BASIC ELECTRIC ELEMENTS