wherein the bump connectors are disposed only on the semiconductor chip

Industry

CPC
H01L2021/60232

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

Current Industry

H01L2021/60232wherein the bump connectors are disposed only on the semiconductor chip

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 11,594,507
- Issue date Feb 28, 2023
- Sumitomo Electric Device Innovations, Inc.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,957,719
- Issue date Mar 23, 2021
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acrylic resin composition for sealing, cured product of same, metho...
- Patent number 10,797,013
- Issue date Oct 6, 2020
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Jin Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 10,304,867
- Issue date May 28, 2019
- Renesas Electronics Corporation
- Akihiko Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 10,256,210
- Issue date Apr 9, 2019
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same
- Patent number 9,929,185
- Issue date Mar 27, 2018
- Renesas Electronics Corporation
- Akihiko Yoshioka
- G02 - OPTICS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 9,786,632
- Issue date Oct 10, 2017
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...
- Publication number 20240421053
- Publication date Dec 19, 2024
- Qianli MU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240162128
- Publication date May 16, 2024
- LBSEMICON CO., LTD.
- Gi Jo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240128142
- Publication date Apr 18, 2024
- JCET GROUP CO., LTD.
- Shuo Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20220359240
- Publication date Nov 10, 2022
- SHINKAWA LTD.
- Makoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210351147
- Publication date Nov 11, 2021
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Keita Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20200235131
- Publication date Jul 23, 2020
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20190244978
- Publication date Aug 8, 2019
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACRYLIC RESIN COMPOSITION FOR SEALING, CURED PRODUCT OF SAME, METHO...
- Publication number 20180247910
- Publication date Aug 30, 2018
- JIN JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20180175067
- Publication date Jun 21, 2018
- Renesas Electronics Corporation
- Akihiko YOSHIOKA
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20170373038
- Publication date Dec 28, 2017
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS

wherein the bump connectors are disposed only on the semiconductor chip

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing semiconductor device

Semiconductor device and a method of manufacturing the same

Acrylic resin composition for sealing, cured product of same, metho...

Semiconductor device and a method of manufacturing the same

Semiconductor package structure and method for forming the same

Semiconductor device and a method of manufacturing the same

Semiconductor package structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGED DEVICE HAVING AN INTEGRATED PASSIVE DEVICE WITH WAFER LEVE...

METHODS OF FABRICATING SEMICONDUCTOR PACKAGE

DOUBLE-SIDED SIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

ACRYLIC RESIN COMPOSITION FOR SEALING, CURED PRODUCT OF SAME, METHO...

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME