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wherein the coefficient of thermal expansion is important

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  • H05K2201/068
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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

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H05K2201/068wherein the coefficient of thermal expansion is important
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ELECTRONIC DEVICE AND PACKAGE STRUCTURE
    • Publication number 20240155758
    • Publication date May 9, 2024
    • Advanced Semiconductor Engineering, Inc.
    • Chien Lin CHANG CHIEN
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...
    • Publication number 20240079303
    • Publication date Mar 7, 2024
    • Taiwan Semiconductor Manufacturing Company Limited
    • Wei-Hung Lin
    • H01 - BASIC ELECTRIC ELEMENTS
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    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
    • Publication number 20240074042
    • Publication date Feb 29, 2024
    • Huawei Technologies Co., Ltd
    • Yulong Wu
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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    LAMINATE AND ELECTRONIC DEVICE
    • Publication number 20240049386
    • Publication date Feb 8, 2024
    • FUJIFILM CORPORATION
    • Akio KATAYAMA
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
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    PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
    • Publication number 20240008175
    • Publication date Jan 4, 2024
    • Sumitomo Electric Industries, Ltd.
    • Yoshio OKA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE LAYER CIRCUIT ELEMENT
    • Publication number 20230377904
    • Publication date Nov 23, 2023
    • InnoLux Corporation
    • Chuan-Ming Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
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    BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
    • Publication number 20230380062
    • Publication date Nov 23, 2023
    • Corning Incorporated
    • DHANANJAY JOSHI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230363080
    • Publication date Nov 9, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jian-Ting Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COMPOSITED CARRIER FOR MICROPHONE PACKAGE
    • Publication number 20230345648
    • Publication date Oct 26, 2023
    • Skyworks Solutions, Inc.
    • Takanori Yasuda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MATERIALS FOR PRINTED CIRCUIT BOARDS
    • Publication number 20230309221
    • Publication date Sep 28, 2023
    • Thintronics, Inc.
    • Tarun Amla
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    ELECTRONIC CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING THEREOF
    • Publication number 20230284376
    • Publication date Sep 7, 2023
    • Unimicron Technology Corp.
    • Chun-Hung KUO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20230247762
    • Publication date Aug 3, 2023
    • SUMITOMO BAKELITE CO., LTD.
    • Nobuo Tagashira
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT SUBSTRATE AND MODULE
    • Publication number 20230232531
    • Publication date Jul 20, 2023
    • MURATA MANUFACTURING CO., LTD.
    • Hisashi SUZUKI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH W...
    • Publication number 20230209702
    • Publication date Jun 29, 2023
    • Intel Corporation
    • Satyajit WALWADKAR
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL-CLAD LAMINATE
    • Publication number 20230180384
    • Publication date Jun 8, 2023
    • Shin-Etsu Polymer Co., Ltd.
    • Kazuyoshi YOSHIDA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FABRICATING ASYMMETRIC BOARD
    • Publication number 20230164927
    • Publication date May 25, 2023
    • SHENZHEN KINWONG ELECTRONIC CO., LTD.
    • Jun WANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Component Carrier With a Via Containing a Hardened Filling Material
    • Publication number 20230156912
    • Publication date May 18, 2023
    • AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    • Shuying YAO
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DEVICE FOR POWER TRANSMISSION, POWER CONVERTER, AND AIRCRAFT
    • Publication number 20230132321
    • Publication date Apr 27, 2023
    • ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
    • Stanley Buchert
    • B64 - AIRCRAFT AVIATION COSMONAUTICS
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    CIRCUIT BOARD
    • Publication number 20230119237
    • Publication date Apr 20, 2023
    • LG Innotek Co., Ltd.
    • Dong Hwa LEE
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20230066017
    • Publication date Mar 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Jian-Ting Chen
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTERCONNECT SUBSTRATE
    • Publication number 20230054390
    • Publication date Feb 23, 2023
    • Shinko Electric Industries Co., Ltd.
    • Rie MIZUTANI
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COMPOSITE LAYER CIRCUIT ELEMENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20230026151
    • Publication date Jan 26, 2023
    • InnoLux Corporation
    • Chuan-Ming Yeh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HYBRID SOCKET WARP INDICATOR
    • Publication number 20230009784
    • Publication date Jan 12, 2023
    • International Business Machines Corporation
    • Stephen Michael Hugo
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN MULTILAYER SUBSTRATE
    • Publication number 20220418103
    • Publication date Dec 29, 2022
    • Murata Manufacturing Co., Ltd.
    • Atsushi KASUYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HIGH TEMPERATURE PRINTED CIRCUIT BOARD SUBSTRATE
    • Publication number 20220377904
    • Publication date Nov 24, 2022
    • 3D GLASS SOLUTIONS, INC
    • Jeb H. Flemming
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WIRING BOARD
    • Publication number 20220361331
    • Publication date Nov 10, 2022
    • Shinko Electric Industries Co., Ltd.
    • Masaya TAKIZAWA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    RESIN MULTILAYER SUBSTRATE
    • Publication number 20220346221
    • Publication date Oct 27, 2022
    • Murata Manufacturing Co., Ltd.
    • Atsushi KASUYA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CIRCUIT BOARD
    • Publication number 20220287174
    • Publication date Sep 8, 2022
    • LG Innotek Co., Ltd.
    • Yong Suk KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONNECTION STRUCTURE EMBEDDED SUBSTRATE
    • Publication number 20220210921
    • Publication date Jun 30, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Ho Hyung HAM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC CIRCUIT AND METHOD FOR PRODUCING AN ELECTRONIC CIRCUIT
    • Publication number 20220208643
    • Publication date Jun 30, 2022
    • SIEMENS AKTIENGESELLSCHAFT
    • Thomas Bigl
    • H01 - BASIC ELECTRIC ELEMENTS