wherein the coefficient of thermal expansion is important

Industry

CPC
H05K2201/068

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/068wherein the coefficient of thermal expansion is important

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hermetic metallized via with improved reliability
- Patent number 12,131,985
- Issue date Oct 29, 2024
- Corning Incorporated
- Mandakini Kanungo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Thermosetting resin composition for semiconductor package, prepreg...
- Patent number 12,129,338
- Issue date Oct 29, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Maintaining the shape of a circuit board
- Patent number 12,127,334
- Issue date Oct 22, 2024
- Dis Tech America, LLC
- Heng-Kit Too
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin multilayer substrate and method for manufacturing resin multi...
- Patent number 12,120,817
- Issue date Oct 15, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke Takada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit board
- Patent number 12,101,878
- Issue date Sep 24, 2024
- LG Innotek Co., Ltd
- Dong Hwa Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermosetting resin composite and metal clad laminate using the same
- Patent number 12,091,510
- Issue date Sep 17, 2024
- LG Chem, Ltd.
- Changbo Shim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminated glass structures for electronic devices and electronic de...
- Patent number 12,076,971
- Issue date Sep 3, 2024
- Corning Incorporated
- Jin Su Kim
- B32 - LAYERED PRODUCTS
Information Patent Grant
Embedding component in component carrier by component fixation stru...
- Patent number 12,075,561
- Issue date Aug 27, 2024
- AT&SAustria Technologie & Systemtechnik AG
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink integrated insulating circuit board
- Patent number 12,068,219
- Issue date Aug 20, 2024
- Mitsubishi Materials Corporation
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase shifter, antenna, and base station
- Patent number 12,069,801
- Issue date Aug 20, 2024
- Huawei Technologies Co., Ltd.
- Xinming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin multilayer substrate
- Patent number 12,052,818
- Issue date Jul 30, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Kasuya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting system for optical element of intraoral scanner
- Patent number 12,011,338
- Issue date Jun 18, 2024
- Align Technology, Inc.
- Rami Boltanski
- G01 - MEASURING TESTING
Information Patent Grant
Wiring board and production method for same
- Patent number 12,004,305
- Issue date Jun 4, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Flexible laminated board and multilayer circuit board
- Patent number 11,985,762
- Issue date May 14, 2024
- UBE EXSYMO CO., LTD.
- Eisuke Tachibana
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 11,979,990
- Issue date May 7, 2024
- Resonac Corporation
- Masaya Toba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate for high-frequency printed wiring board
- Patent number RE49929
- Issue date Apr 16, 2024
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
Information Patent Grant
Materials for printed circuit boards
- Patent number 11,930,596
- Issue date Mar 12, 2024
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating asymmetric board
- Patent number 11,917,769
- Issue date Feb 27, 2024
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid socket warp indicator
- Patent number 11,906,574
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Stephen Michael Hugo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for power transmission, power converter, and aircraft
- Patent number 11,882,650
- Issue date Jan 23, 2024
- Rolls-Royce Deutschland Ltd & Co KG
- Stanley Buchert
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Multi-layer line structure and method for manufacturing thereof
- Patent number 11,862,564
- Issue date Jan 2, 2024
- Dai Nippon Printing Co., Ltd.
- Hiroshi Kudo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power module
- Patent number 11,844,198
- Issue date Dec 12, 2023
- ZF Friedrichshafen AG
- Wei Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal-ceramic substrate and method for producing a metal-ceramic su...
- Patent number 11,807,584
- Issue date Nov 7, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated passive component
- Patent number 11,800,635
- Issue date Oct 24, 2023
- Murata Manufacturing Co., Ltd.
- Jyou Kikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit assembly and method for manufacturing thereof
- Patent number 11,792,922
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Chun-Hung Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect substrate
- Patent number 11,792,927
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Rie Mizutani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board assembly with electronic surface mount device and mou...
- Patent number 11,785,711
- Issue date Oct 10, 2023
- Honeywell International Inc.
- Scott A. Peters
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly and method of manufacturing the same
- Patent number 11,778,727
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...
- Publication number 20250016918
- Publication date Jan 9, 2025
- INFINEON TECHNOLOGIES AG
- Martin Richard NIEßNER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20250016912
- Publication date Jan 9, 2025
- KYOCERA CORPORATION
- Takafumi OYOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES
- Publication number 20250008646
- Publication date Jan 2, 2025
- Plume Design, Inc.
- Chiu-Wen CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...
- Publication number 20240422892
- Publication date Dec 19, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240422896
- Publication date Dec 19, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chulmun Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT
- Publication number 20240407080
- Publication date Dec 5, 2024
- Micron Technology, Inc.
- Quang Nguyen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...
- Publication number 20240365510
- Publication date Oct 31, 2024
- Kuprion Inc.
- Alfred A. Zinn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS
- Publication number 20240341032
- Publication date Oct 10, 2024
- AVISHTECH, INC.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240306308
- Publication date Sep 12, 2024
- Resonac Corporation
- Masaya TOBA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WIRING SUBSTRATE
- Publication number 20240224426
- Publication date Jul 4, 2024
- TOPPAN Holdings Inc.
- Yuki UMEMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN SHEET AND RESIN MULTILAYER SUBSTRATE
- Publication number 20240206060
- Publication date Jun 20, 2024
- Murata Manufacturing Co., Ltd.
- Ryosuke TAKADA
- B32 - LAYERED PRODUCTS
Information Patent Application
LARGE AREA MONITORING APPARATUS
- Publication number 20240179833
- Publication date May 30, 2024
- WIT CORPORATION
- Jae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND PACKAGE STRUCTURE
- Publication number 20240155758
- Publication date May 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...
- Publication number 20240079303
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
- Publication number 20240074042
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Yulong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE AND ELECTRONIC DEVICE
- Publication number 20240049386
- Publication date Feb 8, 2024
- FUJIFILM CORPORATION
- Akio KATAYAMA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
- Publication number 20240008175
- Publication date Jan 4, 2024
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE LAYER CIRCUIT ELEMENT
- Publication number 20230377904
- Publication date Nov 23, 2023
- InnoLux Corporation
- Chuan-Ming Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME
- Publication number 20230380062
- Publication date Nov 23, 2023
- Corning Incorporated
- DHANANJAY JOSHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230363080
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jian-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITED CARRIER FOR MICROPHONE PACKAGE
- Publication number 20230345648
- Publication date Oct 26, 2023
- Skyworks Solutions, Inc.
- Takanori Yasuda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR PRINTED CIRCUIT BOARDS
- Publication number 20230309221
- Publication date Sep 28, 2023
- Thintronics, Inc.
- Tarun Amla
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING THEREOF
- Publication number 20230284376
- Publication date Sep 7, 2023
- Unimicron Technology Corp.
- Chun-Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230247762
- Publication date Aug 3, 2023
- SUMITOMO BAKELITE CO., LTD.
- Nobuo Tagashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE AND MODULE
- Publication number 20230232531
- Publication date Jul 20, 2023
- MURATA MANUFACTURING CO., LTD.
- Hisashi SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH W...
- Publication number 20230209702
- Publication date Jun 29, 2023
- Intel Corporation
- Satyajit WALWADKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL-CLAD LAMINATE
- Publication number 20230180384
- Publication date Jun 8, 2023
- Shin-Etsu Polymer Co., Ltd.
- Kazuyoshi YOSHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING ASYMMETRIC BOARD
- Publication number 20230164927
- Publication date May 25, 2023
- SHENZHEN KINWONG ELECTRONIC CO., LTD.
- Jun WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component Carrier With a Via Containing a Hardened Filling Material
- Publication number 20230156912
- Publication date May 18, 2023
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Shuying YAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE FOR POWER TRANSMISSION, POWER CONVERTER, AND AIRCRAFT
- Publication number 20230132321
- Publication date Apr 27, 2023
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Stanley Buchert
- B64 - AIRCRAFT AVIATION COSMONAUTICS

wherein the coefficient of thermal expansion is important

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer level bump stack for chip scale package

Hermetic metallized via with improved reliability

Thermosetting resin composition for semiconductor package, prepreg...

Maintaining the shape of a circuit board

Resin multilayer substrate and method for manufacturing resin multi...

Circuit board

Thermosetting resin composite and metal clad laminate using the same

Laminated glass structures for electronic devices and electronic de...

Embedding component in component carrier by component fixation stru...

Heat sink integrated insulating circuit board

Phase shifter, antenna, and base station

Resin multilayer substrate

Mounting system for optical element of intraoral scanner

Wiring board and production method for same

Flexible laminated board and multilayer circuit board

Wiring board and method for manufacturing the same

Substrate for high-frequency printed wiring board

Materials for printed circuit boards

Method for fabricating asymmetric board

Hybrid socket warp indicator

Device for power transmission, power converter, and aircraft

Multi-layer line structure and method for manufacturing thereof

Method for forming through-hole, and substrate for flexible printed...

Power module

Metal-ceramic substrate and method for producing a metal-ceramic su...

Integrated passive component

Electronic circuit assembly and method for manufacturing thereof

Interconnect substrate

Circuit board assembly with electronic surface mount device and mou...

Semiconductor package assembly and method of manufacturing the same

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING AT LEAST ONE SEMICOND...

WIRING BOARD

POWER SUPPLY BOARDS FOR WIRELESS COMMUNICATIONS DEVICES

HEAT SPREADERS FEATURING COEFFICIENT OF THERMAL EXPANSION MATCHING...

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

PRINTED CIRCUIT BOARD WITH ENHANCED STRUCTURAL SUPPORT

Heat Pipes Featuring Coefficient of Thermal Expansion Matching and...

USE OF INORGANIC THIN NON-WOVEN DIELECTRICS IN PRINTED CIRCUIT BOARDS

SEMICONDUCTOR PACKAGE

WIRING SUBSTRATE

RESIN SHEET AND RESIN MULTILAYER SUBSTRATE

LARGE AREA MONITORING APPARATUS

ELECTRONIC DEVICE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE SUBSTRATE WITH HYBRID CORE STRUCTURE AND METH...

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

LAMINATE AND ELECTRONIC DEVICE

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

COMPOSITE LAYER CIRCUIT ELEMENT

BEVELED OVERBURDEN FOR VIAS AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MANUFACTURING THE SAME

COMPOSITED CARRIER FOR MICROPHONE PACKAGE

MATERIALS FOR PRINTED CIRCUIT BOARDS

ELECTRONIC CIRCUIT ASSEMBLY AND METHOD FOR MANUFACTURING THEREOF

CIRCUIT BOARD

CIRCUIT SUBSTRATE AND MODULE

SUBSTRATE WARPAGE REDUCTION TECHNIQUES WITH LAMINATE GLASS CLOTH W...

METAL-CLAD LAMINATE

METHOD FOR FABRICATING ASYMMETRIC BOARD

Component Carrier With a Via Containing a Hardened Filling Material

DEVICE FOR POWER TRANSMISSION, POWER CONVERTER, AND AIRCRAFT