Wire bonding

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CPC
H05K2203/049

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00

Current Industry

H05K2203/049Wire bonding

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 12,185,476
- Issue date Dec 31, 2024
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and method of producing printed circuit board
- Patent number 12,144,111
- Issue date Nov 12, 2024
- Denso Corporation
- Hirokazu Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method for producing an electronic module
- Patent number 12,035,477
- Issue date Jul 9, 2024
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,904,073
- Issue date Feb 20, 2024
- Verily Life Sciences LLC
- Alexander Loo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,765,837
- Issue date Sep 19, 2023
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly that includes interconnected circuit boards
- Patent number 11,688,958
- Issue date Jun 27, 2023
- Microsoft Technology Licensing, LLC
- Julian Arlo Binder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid discharging apparatus and wiring member
- Patent number 11,654,679
- Issue date May 23, 2023
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Biocompatible electromechanical connection for ceramic substrate el...
- Patent number 11,504,453
- Issue date Nov 22, 2022
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for fabricating Z-axis vertical launch
- Patent number 11,470,725
- Issue date Oct 11, 2022
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid discharging apparatus and wiring member
- Patent number 11,318,745
- Issue date May 3, 2022
- Brother Kogyo Kabushiki Kaisha
- Toru Kakiuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Manufacturing method for semiconductor package with cantilever pads
- Patent number 11,270,894
- Issue date Mar 8, 2022
- STMicroelectronics, Inc.
- Jefferson Talledo
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer printed circuit board for reducing quantum signal crosstalk
- Patent number 11,197,365
- Issue date Dec 7, 2021
- Google LLC
- Erik Anthony Lucero
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for flexible circuit cable attachment
- Patent number 11,191,169
- Issue date Nov 30, 2021
- Jabil Inc.
- Wenlu Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Configurable substrate and systems
- Patent number 11,171,126
- Issue date Nov 9, 2021
- OCTAVO SYSTEMS LLC
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 11,137,649
- Issue date Oct 5, 2021
- Samsung Display Co., Ltd.
- Myong Hoon Roh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic module assembly and manufacturing method
- Patent number 11,114,573
- Issue date Sep 7, 2021
- ams Sensors Singapore Pte. Ltd.
- Martin Lukas Balimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for fabricating Z-axis vertical launch within a printed c...
- Patent number 11,109,489
- Issue date Aug 31, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
High-speed hybrid circuit
- Patent number 11,057,984
- Issue date Jul 6, 2021
- II-VI DELAWARE, INC.
- Steven C. Bird
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for a printed circuit board
- Patent number 10,984,972
- Issue date Apr 20, 2021
- GE Aviation Systems Limited
- David Killin Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate, stacked wiring substrate, and manufacturing metho...
- Patent number 10,959,328
- Issue date Mar 23, 2021
- SHINKO ELECTRIC INDUSTRIES CO., LTD.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrasonic vibration bonding apparatus
- Patent number 10,953,487
- Issue date Mar 23, 2021
- Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Akihiro Ichinose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Communication module packaging
- Patent number 10,952,312
- Issue date Mar 16, 2021
- II-VI DELAWARE, INC.
- Jianwei Mu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional packaging structure and packaging method of power...
- Patent number 10,943,845
- Issue date Mar 9, 2021
- Huazhong University of Science & Technology
- Cai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an electronic component mounted on a s...
- Patent number 10,897,822
- Issue date Jan 19, 2021
- STMicroelectronics (Grenoble 2) SAS
- Fabien Quercia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable signal flow control method for realizing chip reuse and co...
- Patent number 10,878,148
- Issue date Dec 29, 2020
- VANCHIP (TIANJIN) TECHNOLOGY CO., LTD
- Sheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit chip packaging including a heat sink topped cavity
- Patent number 10,818,572
- Issue date Oct 27, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250240893
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Che-Neng LIU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRE BONDING MACHINE HAVING A ROTATABLE CAPILLARY TO SECURE A BOND...
- Publication number 20250233102
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES, INC.
- Jingyun Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250098067
- Publication date Mar 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250089173
- Publication date Mar 13, 2025
- Unimicron Technology Corp.
- Chun Hung KUO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250048542
- Publication date Feb 6, 2025
- Murata Manufacturing Co., Ltd.
- Nobuo IKEMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20240206063
- Publication date Jun 20, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Seong Ho Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...
- Publication number 20240206072
- Publication date Jun 20, 2024
- Lumileds LLC
- Say Chun OOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...
- Publication number 20240147629
- Publication date May 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHANG-HE ZHU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES
- Publication number 20240090131
- Publication date Mar 14, 2024
- HAMILTON SUNDSTRAND CORPORATION
- Alexander Trotman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
- Publication number 20240057250
- Publication date Feb 15, 2024
- Koninklijke Philips N.V.
- FRANCIS KUSTI MAKIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240032208
- Publication date Jan 25, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20240015888
- Publication date Jan 11, 2024
- Shinko Electric Industries Co., Ltd.
- Kensuke UCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module and Method for Producing an Electronic Module
- Publication number 20230094926
- Publication date Mar 30, 2023
- Rogers Germany GmbH
- Andreas Meyer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...
- Publication number 20230049960
- Publication date Feb 16, 2023
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STUD BUMPED PRINTED CIRCUIT ASSEMBLY
- Publication number 20230041747
- Publication date Feb 9, 2023
- James Rathburn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES INTERCONNECTED CIRCUIT BOARDS
- Publication number 20220376412
- Publication date Nov 24, 2022
- Microsoft Technology Licensing, LLC
- Julian Arlo BINDER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD
- Publication number 20220225502
- Publication date Jul 14, 2022
- DENSO CORPORATION
- Hirokazu SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID DISCHARGING APPARATUS AND WIRING MEMBER
- Publication number 20220176696
- Publication date Jun 9, 2022
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru KAKIUCHI
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210368629
- Publication date Nov 25, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH
- Publication number 20210051805
- Publication date Feb 18, 2021
- Raytheon Company
- Mikhail Pevzner
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
LIQUID DISCHARGING APPARATUS AND WIRING MEMBER
- Publication number 20210001632
- Publication date Jan 7, 2021
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Kakiuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...
- Publication number 20210007220
- Publication date Jan 7, 2021
- Shinko Electric Industries Co., Ltd.
- Naoki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...
- Publication number 20200305283
- Publication date Sep 24, 2020
- STMicroelectronics (Grenoble 2) SAS
- Fabien QUERCIA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20200271979
- Publication date Aug 27, 2020
- SAMSUNG DISPLAY CO., LTD.
- Myong Hoon ROH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...
- Publication number 20200171212
- Publication date Jun 4, 2020
- Verily Life Sciences LLC
- Alexander Loo
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168524
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP PACKAGING
- Publication number 20200168525
- Publication date May 28, 2020
- International Business Machines Corporation
- Young Hoon Kwark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC MODULE ASSEMBLY AND MANUFACTURING METHOD
- Publication number 20200127147
- Publication date Apr 23, 2020
- ams Sensors Singapore Pte. Ltd.
- Martin Lukas BALIMANN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID DISCHARGING APPARATUS AND WIRING MEMBER
- Publication number 20200094552
- Publication date Mar 26, 2020
- BROTHER KOGYO KABUSHIKI KAISHA
- Toru Kakiuchi
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Wire bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method and apparatus for flexible circuit cable attachment

Method for processing memory device

Printed circuit board and method of producing printed circuit board

Semiconductor device, printed circuit board (PCB), and method of in...

Electronic module and method for producing an electronic module

Impedance controlled electrical interconnection employing meta-mate...

Biocompatible electromechanical connection for ceramic substrate el...

Method and apparatus for flexible circuit cable attachment

Electronic assembly that includes interconnected circuit boards

Liquid discharging apparatus and wiring member

Biocompatible electromechanical connection for ceramic substrate el...

Method for fabricating Z-axis vertical launch

Impedance controlled electrical interconnection employing meta-mate...

Liquid discharging apparatus and wiring member

Manufacturing method for semiconductor package with cantilever pads

Multilayer printed circuit board for reducing quantum signal crosstalk

Method and apparatus for flexible circuit cable attachment

Configurable substrate and systems

Display device

Optoelectronic module assembly and manufacturing method

Apparatus for fabricating Z-axis vertical launch within a printed c...

High-speed hybrid circuit

Method and apparatus for a printed circuit board

Wiring substrate, stacked wiring substrate, and manufacturing metho...

Ultrasonic vibration bonding apparatus

Communication module packaging

Three-dimensional packaging structure and packaging method of power...

Electronic device comprising an electronic component mounted on a s...

Variable signal flow control method for realizing chip reuse and co...

Integrated circuit chip packaging including a heat sink topped cavity

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

WIRE BONDING MACHINE HAVING A ROTATABLE CAPILLARY TO SECURE A BOND...

PRINTED CIRCUIT BOARD

CIRCUIT BOARD STRUCTURE AND FABRICATION METHOD THEREOF

CIRCUIT MODULE AND MANUFACTURING METHOD THEREFOR

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

LIGHT-EMITTING DIODE ARRAY WITH PRECISE POSITION ASSEMBLY FOR AUTOM...

CIRCUIT BOARD ASSEMBLY AND METHOD OF MANUFACTURING THE SAME, PACKAG...

THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES

METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

WIRING BOARD

Electronic Module and Method for Producing an Electronic Module

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...

STUD BUMPED PRINTED CIRCUIT ASSEMBLY

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

ELECTRONIC ASSEMBLY THAT INCLUDES INTERCONNECTED CIRCUIT BOARDS

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING PRINTED CIRCUIT BOARD

LIQUID DISCHARGING APPARATUS AND WIRING MEMBER

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

SYSTEM AND METHOD FOR FABRICATING Z-AXIS VERTICAL LAUNCH

LIQUID DISCHARGING APPARATUS AND WIRING MEMBER

WIRING SUBSTRATE, STACKED WIRING SUBSTRATE, AND MANUFACTURING METHO...

ELECTRONIC DEVICE COMPRISING AN ELECTRONIC COMPONENT MOUNTED ON A S...

DISPLAY DEVICE

BIOCOMPATIBLE ELECTROMECHANICAL CONNECTION FOR CERAMIC SUBSTRATE EL...

INTEGRATED CIRCUIT CHIP PACKAGING

INTEGRATED CIRCUIT CHIP PACKAGING

OPTOELECTRONIC MODULE ASSEMBLY AND MANUFACTURING METHOD

LIQUID DISCHARGING APPARATUS AND WIRING MEMBER