Wire-like parts or pins

Industry

CPC
H01L21/4885

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/4885Wire-like parts or pins

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided routing in 3D SiP structure
- Patent number 11,824,007
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithic formation of a set of interconnects below active devices
- Patent number 11,791,271
- Issue date Oct 17, 2023
- Tokyo Electron Limited
- Daniel Chanemougame
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power stage package including flexible circuit and stacked die
- Patent number 11,715,679
- Issue date Aug 1, 2023
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory structure
- Patent number 11,665,889
- Issue date May 30, 2023
- Winbond Electronics Corp.
- Shuen-Hsiang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Variable pin fin construction to facilitate compliant cold plates
- Patent number 11,515,230
- Issue date Nov 29, 2022
- International Business Machines Corporation
- Mark Delorman Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power module and method for manufacturing the same
- Patent number 11,495,521
- Issue date Nov 8, 2022
- Delta Electronics (Shanghai) Co., Ltd.
- Pengkai Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and manufacturing method therefor
- Patent number 11,387,210
- Issue date Jul 12, 2022
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic shielding element, and transmission line assembly a...
- Patent number 11,369,049
- Issue date Jun 21, 2022
- HOTEK MATERIAL TECHNOLOGY CO., LTD.
- Hao-Wei Fong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual-sided routing in 3D SiP structure
- Patent number 11,322,447
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor memory structure
- Patent number 11,205,574
- Issue date Dec 21, 2021
- Winbond Electronics Corp.
- Shuen-Hsiang Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant pin fin heat sink and methods
- Patent number 11,158,565
- Issue date Oct 26, 2021
- International Business Machines Corporation
- John P. Karidis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tunable hardmask for overlayer metrology contrast
- Patent number 11,121,024
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Ekmini A. De Silva
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 11,114,357
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a row of MOS transistors
- Patent number 10,998,236
- Issue date May 4, 2021
- STMicroelectronics (Crolles 2) SAS
- Loic Gaben
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,892,231
- Issue date Jan 12, 2021
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor vertical wire bonding structure and method
- Patent number 10,854,476
- Issue date Dec 1, 2020
- SJ Semiconductor (Jiangyin) Corporation
- Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elbow contact for field-effect transistor and manufacture thereof
- Patent number 10,707,148
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Guy Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable hardmask for overlayer metrology contrast
- Patent number 10,622,248
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Ekmini A. De Silva
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Antenna packaging solution
- Patent number 10,615,511
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and power converter
- Patent number 10,593,609
- Issue date Mar 17, 2020
- Toyota Jidosha Kabushiki Kaisha
- Yuji Nishibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elbow contact for field-effect transistor and manufacture thereof
- Patent number 10,541,191
- Issue date Jan 21, 2020
- International Business Machines Corporation
- Guy Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,541,209
- Issue date Jan 21, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 10,522,437
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable pin fin construction to facilitate compliant cold plates
- Patent number 10,504,814
- Issue date Dec 10, 2019
- International Business Machines Corporation
- Mark Delorman Schultz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,497,650
- Issue date Dec 3, 2019
- Amkor Technology, Inc.
- Soo Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a row of MOS transistors
- Patent number 10,468,306
- Issue date Nov 5, 2019
- STMicroelectronics (Crolles 2) SAS
- Loic Gaben
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Antenna packaging solution
- Patent number 10,374,322
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for display device
- Patent number 10,365,520
- Issue date Jul 30, 2019
- Kobe Steel, Ltd.
- Hiroyuki Okuno
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145350
- Publication date May 2, 2024
- MEDIATEK INC.
- Pu-Shan HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC FORMATION OF A SET OF INTERCONNECTS BELOW ACTIVE DEVICES
- Publication number 20230411298
- Publication date Dec 21, 2023
- TOKYO ELECTRON LIMITED
- Daniel Chanemougame
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED ROUTING IN 3D SIP STRUCTURE
- Publication number 20230387028
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER STAGE PACKAGE INCLUDING FLEXIBLE CIRCUIT AND STACKED DIE
- Publication number 20230378034
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20220352055
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING METAL LAYER CONFIGURED FOR ELECTROMAGNETIC INTER...
- Publication number 20220285286
- Publication date Sep 8, 2022
- QUALCOMM TECHNOLOGIES INC.
- Marc HUESGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-sided Routing in 3D SiP Structure
- Publication number 20220199541
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hao TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHIC FORMATION OF A SET OF INTERCONNECTS BELOW ACTIVE DEVICES
- Publication number 20220102277
- Publication date Mar 31, 2022
- TOKYO ELECTRON LIMITED
- Daniel CHANEMOUGAME
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY STRUCTURE
- Publication number 20220068654
- Publication date Mar 3, 2022
- WINBOND ELECTRONICS CORP.
- Shuen-Hsiang KE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package with Interposers
- Publication number 20210391230
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210066170
- Publication date Mar 4, 2021
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Pengkai JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual-sided Routing in 3D SiP Structure
- Publication number 20210050295
- Publication date Feb 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR
- Publication number 20200294953
- Publication date Sep 17, 2020
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARIABLE PIN FIN CONSTRUCTION TO FACILITATE COMPLIANT COLD PLATES
- Publication number 20200091032
- Publication date Mar 19, 2020
- International Business Machines Corporation
- Mark Delorman Schultz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20200066652
- Publication date Feb 27, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELBOW CONTACT FOR FIELD-EFFECT TRANSISTOR AND MANUFACTURE THEREOF
- Publication number 20200027820
- Publication date Jan 23, 2020
- International Business Machines Corporation
- Guy Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Apparatus for Package with Interposers
- Publication number 20200027803
- Publication date Jan 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A ROW OF MOS TRANSISTORS
- Publication number 20200020589
- Publication date Jan 16, 2020
- STMicroelectronics (Crolles 2) SAS
- Loic GABEN
- B82 - NANO-TECHNOLOGY
Information Patent Application
TUNABLE HARDMASK FOR OVERLAYER METROLOGY CONTRAST
- Publication number 20190371651
- Publication date Dec 5, 2019
- International Business Machines Corporation
- Ekmini A. De Silva
- B82 - NANO-TECHNOLOGY
Information Patent Application
ANTENNA PACKAGING SOLUTION
- Publication number 20190229433
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SYSTEM WITH ROUTING LAYERS IN MULTI-LAYERED HOMOGENE...
- Publication number 20190221527
- Publication date Jul 18, 2019
- AIS Technology, Inc.
- Raymond W. Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION SYSTEM WITH DENSE PITCH AND COMPLEX CIRCUIT STRUCTUR...
- Publication number 20190221448
- Publication date Jul 18, 2019
- AIS Technology, Inc.
- Raymond W. Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNABLE HARDMASK FOR OVERLAYER METROLOGY CONTRAST
- Publication number 20190206722
- Publication date Jul 4, 2019
- International Business Machines Corporation
- Ekmini A. De Silva
- B82 - NANO-TECHNOLOGY
Information Patent Application
ELBOW CONTACT FOR FIELD-EFFECT TRANSISTOR AND MANUFACTURE THEREOF
- Publication number 20190157187
- Publication date May 23, 2019
- International Business Machines Corporation
- Guy Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...
- Publication number 20190096861
- Publication date Mar 28, 2019
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20190043810
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180301420
- Publication date Oct 18, 2018
- Amkor Technology, Inc.
- Soo Hyun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A ROW OF MOS TRANSISTORS
- Publication number 20180286763
- Publication date Oct 4, 2018
- STMicroelectronics (Crolles 2) SAS
- Loic GABEN
- B82 - NANO-TECHNOLOGY

Wire-like parts or pins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package comprising metal layer configured for electromagnetic inter...

Heat-dissipating wirebonded members on package surfaces

Dual-sided routing in 3D SiP structure

Monolithic formation of a set of interconnects below active devices

Power stage package including flexible circuit and stacked die

Semiconductor memory structure

Variable pin fin construction to facilitate compliant cold plates

Power module and method for manufacturing the same

Semiconductor module and manufacturing method therefor

Electromagnetic shielding element, and transmission line assembly a...

Dual-sided routing in 3D SiP structure

Method for forming a semiconductor memory structure

Compliant pin fin heat sink and methods

Tunable hardmask for overlayer metrology contrast

Methods and apparatus for package with interposers

Method for fabricating a row of MOS transistors

Electronics package including integrated electromagnetic interferen...

Semiconductor vertical wire bonding structure and method

Elbow contact for field-effect transistor and manufacture thereof

Tunable hardmask for overlayer metrology contrast

Antenna packaging solution

Semiconductor device and power converter

Elbow contact for field-effect transistor and manufacture thereof

Electronics package including integrated electromagnetic interferen...

Methods and apparatus for package with interposers

Variable pin fin construction to facilitate compliant cold plates

Semiconductor device and manufacturing method thereof

Method for fabricating a row of MOS transistors

Antenna packaging solution

Wiring structure for display device

Patents Applicationslast 30 patents

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MONOLITHIC FORMATION OF A SET OF INTERCONNECTS BELOW ACTIVE DEVICES

DUAL-SIDED ROUTING IN 3D SIP STRUCTURE

POWER STAGE PACKAGE INCLUDING FLEXIBLE CIRCUIT AND STACKED DIE

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

PACKAGE COMPRISING METAL LAYER CONFIGURED FOR ELECTROMAGNETIC INTER...

Dual-sided Routing in 3D SiP Structure

MONOLITHIC FORMATION OF A SET OF INTERCONNECTS BELOW ACTIVE DEVICES

SEMICONDUCTOR MEMORY STRUCTURE

Methods and Apparatus for Package with Interposers

POWER MODULE AND METHOD FOR MANUFACTURING THE SAME

Dual-sided Routing in 3D SiP Structure

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR

VARIABLE PIN FIN CONSTRUCTION TO FACILITATE COMPLIANT COLD PLATES

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

ELBOW CONTACT FOR FIELD-EFFECT TRANSISTOR AND MANUFACTURE THEREOF

Methods and Apparatus for Package with Interposers

METHOD FOR FABRICATING A ROW OF MOS TRANSISTORS

TUNABLE HARDMASK FOR OVERLAYER METROLOGY CONTRAST

ANTENNA PACKAGING SOLUTION

REDISTRIBUTION SYSTEM WITH ROUTING LAYERS IN MULTI-LAYERED HOMOGENE...

REDISTRIBUTION SYSTEM WITH DENSE PITCH AND COMPLEX CIRCUIT STRUCTUR...

TUNABLE HARDMASK FOR OVERLAYER METROLOGY CONTRAST

ELBOW CONTACT FOR FIELD-EFFECT TRANSISTOR AND MANUFACTURE THEREOF

MICROELECTRONIC PACKAGE FOR WAFER-LEVEL CHIP SCALE PACKAGING WITH F...

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING A ROW OF MOS TRANSISTORS