with a conformable or flexible structure compensating for irregularities

Industry

CPC
H05K7/20454

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/20454with a conformable or flexible structure compensating for irregularities

Industries

Patents Grantslast 30 patents

Information Patent Grant
Security camera with angled cable attachment for increased downward...
- Patent number 12,085,841
- Issue date Sep 10, 2024
- Google LLC
- Chi-Ming Lin
- G08 - SIGNALLING
Information Patent Grant
Thermally conductive shock absorbers for electronic devices
- Patent number 12,082,378
- Issue date Sep 3, 2024
- Intel Corporation
- Aleksander Magi
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Cooling device for a power electronics module with cooling adapter,...
- Patent number 12,069,842
- Issue date Aug 20, 2024
- Bayerische Motoren Werke Aktiengesellschaft
- Ludwig Schmid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-column graphite-over-foam assembly
- Patent number 12,022,640
- Issue date Jun 25, 2024
- Cisco Technology, Inc.
- Phong Hoang Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat radiating structure and electronic device including same
- Patent number 12,016,158
- Issue date Jun 18, 2024
- Samsung Electronics Co., Ltd.
- Jungho Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat transfer device
- Patent number 12,009,275
- Issue date Jun 11, 2024
- ASUSTeK COMPUTER Inc.
- Hsin-Chen Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power semiconductor module and power converter
- Patent number 11,997,837
- Issue date May 28, 2024
- Mitsubishi Electric Corporation
- Taketo Nishiyama
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Thermal management system including an overmolded layer and a condu...
- Patent number 11,991,869
- Issue date May 21, 2024
- Lunar Energy, Inc.
- Steven Nicholas Grolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for cooling a bus bar
- Patent number 11,990,741
- Issue date May 21, 2024
- Siemens Aktiengesellschaft
- Ingolf Hoffmann
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Composite thermal interface materials and associated devices, syste...
- Patent number 11,943,899
- Issue date Mar 26, 2024
- Deeia Inc.
- Himanshu Pokharna
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface sandwich
- Patent number 11,889,662
- Issue date Jan 30, 2024
- Lunar Energy, Inc.
- Bozhi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum or copper foil heat dissipator and electronic device havin...
- Patent number 11,864,356
- Issue date Jan 2, 2024
- Alpha Networks Inc.
- Tzu-Chih Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package comprising a component to be cooled and associat...
- Patent number 11,856,734
- Issue date Dec 26, 2023
- Continental Automotive Technologies GmbH
- Jean-Philippe Bekaert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal-control system for a security camera and associated securit...
- Patent number 11,852,957
- Issue date Dec 26, 2023
- Google LLC
- Ihab A. Ali
- G08 - SIGNALLING
Information Patent Grant
Flexible retention ring for thermal interface material
- Patent number 11,844,197
- Issue date Dec 12, 2023
- Intel Corporation
- Raymon S. Anglin Williams
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Temperature equalizing vehicle-mountable device
- Patent number 11,839,065
- Issue date Dec 5, 2023
- Huawei Technologies Co., Ltd.
- Yonghai Mao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal-control system of a video-recording doorbell and associated...
- Patent number 11,839,060
- Issue date Dec 5, 2023
- Google LLC
- Arun Prakash Raghupathy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic apparatus comprising an interface unit comprising a conn...
- Patent number 11,829,054
- Issue date Nov 28, 2023
- Canon Kabushiki Kaisha
- Hideaki Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure assembly
- Patent number 11,818,869
- Issue date Nov 14, 2023
- MICRO-STAR INT'L CO., LIMITED.
- Cheng-Lung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heat dissipation structure with stacked thermal interface materials
- Patent number 11,792,912
- Issue date Oct 17, 2023
- Wistron NeWeb Corporation
- Bo-Yen Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronic apparatus
- Patent number 11,751,347
- Issue date Sep 5, 2023
- Kioxia Corporation
- Akitoshi Suzuki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Shielding film including plurality of layers and electronic device...
- Patent number 11,729,957
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Myeonggil Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-performance thermal interfaces for cylindrical or other curved...
- Patent number 11,665,858
- Issue date May 30, 2023
- Raytheon Company
- Dominic R. Gooden
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Cooling device for an endoscope or an exoscope
- Patent number 11,644,660
- Issue date May 9, 2023
- Karl Storz SE & Co. KG
- Lawrence Geafer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated controller and vehicle including the same
- Patent number 11,564,333
- Issue date Jan 24, 2023
- Hyundai Motor Company
- Jae Yong Park
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Integrated thermal interface detachment mechanism for inaccessible...
- Patent number 11,553,624
- Issue date Jan 10, 2023
- Lenovo (United States) Inc.
- Jeffrey Scott Holland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for employing flexible graphite for thermal con...
- Patent number 11,510,340
- Issue date Nov 22, 2022
- Dell Products L.P.
- Steven Embleton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Thermal interface materials including memory foam cores
- Patent number 11,483,948
- Issue date Oct 25, 2022
- Laird Technologies, Inc.
- Jason L. Strader
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical device and method for assembling the electrical device
- Patent number 11,432,439
- Issue date Aug 30, 2022
- Siemens Aktiengesellschaft
- Martin Petricek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...
- Publication number 20240349465
- Publication date Oct 17, 2024
- Lunar Energy, Inc.
- Steven Nicholas Grolle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR PROVIDING THERMAL MANAGEMENT AND ELECTROMAGNETIC INTE...
- Publication number 20240341066
- Publication date Oct 10, 2024
- Thomson Licensing
- Lizhi ZHAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Pipe Panel for Solar Panel
- Publication number 20240324145
- Publication date Sep 26, 2024
- Sunowner Inc.
- Dennis Wilson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COLD PLATE WITH INTEGRATED SLIDING PEDESTAL AND PROCESSING SYSTEM I...
- Publication number 20240314980
- Publication date Sep 19, 2024
- Tesla, Inc.
- Mohamed Haitham Helmy Nasr
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD STRUCTURE ACCOMM...
- Publication number 20240292571
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Bongkyu MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES
- Publication number 20240292570
- Publication date Aug 29, 2024
- ADLINK TECHNOLOGY INC.
- Hsiu-Ling YU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MODULE AND ELECTRONIC DEVICE THEREOF
- Publication number 20240268079
- Publication date Aug 8, 2024
- PEGATRON CORPORATION
- SHIH-HAO WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTOR
- Publication number 20240253487
- Publication date Aug 1, 2024
- YAZAKI CORPORATION
- Yasuhiro Yamaguchi
- B60 - VEHICLES IN GENERAL
Information Patent Application
Electronic Device
- Publication number 20240260235
- Publication date Aug 1, 2024
- Honor Device Co., Ltd.
- Guochao Fu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT ASSEMBLY
- Publication number 20240249900
- Publication date Jul 25, 2024
- AUTONETWORKS TECHNOLOGIES, LTD.
- Taiji YANAGIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE OF ELECTRONIC EQUIPMENT
- Publication number 20240164062
- Publication date May 16, 2024
- TECHWAY INDUSTRIAL CO., LTD.
- Fu Hsiang Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20240074115
- Publication date Feb 29, 2024
- Canon Kabushiki Kaisha
- Sho NAGATSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VEHICLE-MOUNTABLE DEVICE AND VEHICLE
- Publication number 20240057300
- Publication date Feb 15, 2024
- Huawei Technologies Co., Ltd
- Yonghai Mao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL CONTACT APPARATUS
- Publication number 20230403827
- Publication date Dec 14, 2023
- RAFAEL ADVANCED DEFENSE SYSTEMS LTD.
- Alon TAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH-POWER THERMOELECTRIC CHILLER FOR COMPUTING MACHINES
- Publication number 20230403815
- Publication date Dec 14, 2023
- Benjamin K. Sharfi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC APPARATUS
- Publication number 20230354536
- Publication date Nov 2, 2023
- KIOXIA Corporation
- Akitoshi SUZUKI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD
- Publication number 20230269913
- Publication date Aug 24, 2023
- Hitachi Astemo, Ltd.
- Kumiko YOSHINAGA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THERMAL MANAGEMENT DEVICES
- Publication number 20230262933
- Publication date Aug 17, 2023
- Hewlett-Packard Development Company, L.P.
- HENDRY HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPUTING APPARATUS AND VEHICLE
- Publication number 20230200028
- Publication date Jun 22, 2023
- Huawei Technologies Co., Ltd
- Nengwu Xiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM OR COPPER FOIL HEAT DISSIPATOR AND ELECTRONIC DEVICE HAVIN...
- Publication number 20230189481
- Publication date Jun 15, 2023
- Alpha Networks Inc.
- TZU-CHIH LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated Controller and Vehicle Including the Same
- Publication number 20230137075
- Publication date May 4, 2023
- Hyundai Motor Company
- Jae Yong Park
- B60 - VEHICLES IN GENERAL
Information Patent Application
THERMAL RADIATION HEAT DISSIPATION DEVICE AND PREPARATION METHOD AN...
- Publication number 20230137727
- Publication date May 4, 2023
- National Tsing Hua University
- Meng-Ting Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20220408603
- Publication date Dec 22, 2022
- WISTRON NEWEB CORPORATION
- Bo-Yen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK COOLING ARRANGEMENT
- Publication number 20220408543
- Publication date Dec 22, 2022
- VACON OY
- Sami Karhunen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION APPARATUS, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC...
- Publication number 20220338369
- Publication date Oct 20, 2022
- Huawei Digital Power Technologies Co., Ltd.
- Longhe WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING FILM INCLUDING PLURALITY OF LAYERS AND ELECTRONIC DEVICE...
- Publication number 20220312653
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- Myeonggil LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION MODULE
- Publication number 20220256742
- Publication date Aug 11, 2022
- PAN YU-HSIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal-Control System of a Video-Recording Doorbell and Associated...
- Publication number 20220159877
- Publication date May 19, 2022
- Google LLC
- Arun Prakash Raghupathy
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Inverter
- Publication number 20220159867
- Publication date May 19, 2022
- SUNGROW (SHANGHAI) CO., LTD.
- Bing ZENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE AND POWER CONVERTER
- Publication number 20220141988
- Publication date May 5, 2022
- Mitsubishi Electric Corporation
- Taketo NISHIYAMA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

with a conformable or flexible structure compensating for irregularities

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Security camera with angled cable attachment for increased downward...

Thermally conductive shock absorbers for electronic devices

Cooling device for a power electronics module with cooling adapter,...

Multi-column graphite-over-foam assembly

Heat radiating structure and electronic device including same

Heat transfer device

Power semiconductor module and power converter

Thermal management system including an overmolded layer and a condu...

Device for cooling a bus bar

Composite thermal interface materials and associated devices, syste...

Thermal interface sandwich

Aluminum or copper foil heat dissipator and electronic device havin...

Electronic package comprising a component to be cooled and associat...

Thermal-control system for a security camera and associated securit...

Flexible retention ring for thermal interface material

Temperature equalizing vehicle-mountable device

Thermal-control system of a video-recording doorbell and associated...

Electronic apparatus comprising an interface unit comprising a conn...

Heat dissipation structure assembly

Heat dissipation structure with stacked thermal interface materials

Electronic apparatus

Shielding film including plurality of layers and electronic device...

High-performance thermal interfaces for cylindrical or other curved...

Cooling device for an endoscope or an exoscope

Integrated controller and vehicle including the same

Integrated thermal interface detachment mechanism for inaccessible...

Systems and methods for employing flexible graphite for thermal con...

Thermal interface materials including memory foam cores

Conformable heat sink interface with a high thermal conductivity

Electrical device and method for assembling the electrical device

Patents Applicationslast 30 patents

THERMAL MANAGEMENT SYSTEM INCLUDING AN OVERMOLDED LAYER AND A CONDU...

APPARATUS FOR PROVIDING THERMAL MANAGEMENT AND ELECTROMAGNETIC INTE...

Heat Pipe Panel for Solar Panel

COLD PLATE WITH INTEGRATED SLIDING PEDESTAL AND PROCESSING SYSTEM I...

ELECTRONIC DEVICE COMPRISING PRINTED CIRCUIT BOARD STRUCTURE ACCOMM...

ELASTIC HEAT CONDUCTION MECHANISM FOR ELECTRONIC DEVICES

THERMAL MODULE AND ELECTRONIC DEVICE THEREOF

CONNECTOR

Electronic Device

CIRCUIT ASSEMBLY

HEAT DISSIPATION DEVICE OF ELECTRONIC EQUIPMENT

ELECTRONIC APPARATUS

VEHICLE-MOUNTABLE DEVICE AND VEHICLE

THERMAL CONTACT APPARATUS

HIGH-POWER THERMOELECTRIC CHILLER FOR COMPUTING MACHINES

ELECTRONIC APPARATUS

ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

THERMAL MANAGEMENT DEVICES

COMPUTING APPARATUS AND VEHICLE

ALUMINUM OR COPPER FOIL HEAT DISSIPATOR AND ELECTRONIC DEVICE HAVIN...

Integrated Controller and Vehicle Including the Same

THERMAL RADIATION HEAT DISSIPATION DEVICE AND PREPARATION METHOD AN...

HEAT DISSIPATION STRUCTURE

HEATSINK COOLING ARRANGEMENT

HEAT DISSIPATION APPARATUS, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC...

SHIELDING FILM INCLUDING PLURALITY OF LAYERS AND ELECTRONIC DEVICE...

HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION MODULE

Thermal-Control System of a Video-Recording Doorbell and Associated...

Inverter

POWER SEMICONDUCTOR MODULE AND POWER CONVERTER