with at least one step of making a data line

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CPC
H01L27/10882

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L27/00Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate

Current Industry

H01L27/10882with at least one step of making a data line

Industries

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuitry, DRAM circuitry
- Patent number 11,683,927
- Issue date Jun 20, 2023
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-memory array process edge mats with sense amplifiers
- Patent number 11,568,922
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Yuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,563,010
- Issue date Jan 24, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic random access memory device and method of fabricating the same
- Patent number 11,538,823
- Issue date Dec 27, 2022
- Chen-Chih Wang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having body contact regions proximate transis...
- Patent number 11,476,256
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 11,374,007
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing dynamic random access memory
- Patent number 11,374,011
- Issue date Jun 28, 2022
- Winbond Electronics Corp.
- Akira Kuroda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 11,257,710
- Issue date Feb 22, 2022
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- Woo-Song Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays with vertical transistors and the formation thereof
- Patent number 11,222,975
- Issue date Jan 11, 2022
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic device and method for fabricating the same
- Patent number 11,183,629
- Issue date Nov 23, 2021
- SK hynix Inc.
- Ga-Young Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device and method of forming the same
- Patent number 11,171,140
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Method used in forming integrated circuitry, and method used in for...
- Patent number 11,152,372
- Issue date Oct 19, 2021
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with reduced-resistance interconnect
- Patent number 11,145,655
- Issue date Oct 12, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sahil Preet Singh
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including side surface conductor contact
- Patent number 11,139,301
- Issue date Oct 5, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor memory devices including separate upper and lower bit...
- Patent number 11,088,148
- Issue date Aug 10, 2021
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-memory array process edge mats with sense amplifiers
- Patent number 11,024,366
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Yuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising vertically-alternating tiers of insulative...
- Patent number 11,011,529
- Issue date May 18, 2021
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,916,430
- Issue date Feb 9, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,861,855
- Issue date Dec 8, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies which include non-conductive-semiconductor-ma...
- Patent number 10,825,484
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Deepak Chandra Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 10,825,815
- Issue date Nov 3, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices
- Patent number 10,811,355
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- William R. Brown
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of sealing openings, and methods of forming integrated asse...
- Patent number 10,790,185
- Issue date Sep 29, 2020
- Micron Technology, Inc.
- Guangjun Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having body contact regions proximate transis...
- Patent number 10,784,264
- Issue date Sep 22, 2020
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device comprising memory cell over driver
- Patent number 10,763,261
- Issue date Sep 1, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit devices and methods of fabricating the same
- Patent number 10,727,233
- Issue date Jul 28, 2020
- Samsung Electronics Co., Ltd.
- Seok-han Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,658,365
- Issue date May 19, 2020
- United Microelectronics Corp.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry, DRAM circuitry, method of forming a plurality...
- Patent number 10,607,998
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Construction of integrated circuitry and a method of forming an ele...
- Patent number 10,607,936
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Silvia Borsari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays
- Patent number 10,607,995
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Martin C. Roberts
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZON...
- Publication number 20240098970
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH HORIZONTAL...
- Publication number 20240064966
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL GATE MEMORY DEVICE AND METHOD
- Publication number 20230328966
- Publication date Oct 12, 2023
- Micron Technology, Inc.
- Hyucksoo Yang
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE HAVING A DIAGONALLY OPPOSITE GATE PAIR PER MEMORY CELL
- Publication number 20230200048
- Publication date Jun 22, 2023
- Micron Technology, Inc.
- Giorgio Servalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Body Contact Regions Proximate Transis...
- Publication number 20230013666
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL DRAM STRUCTURE AND METHOD
- Publication number 20220406784
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Ta Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...
- Publication number 20220359529
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Yun-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS WITH VERTICAL TRANSISTORS AND THE FORMATION THEREOF
- Publication number 20220131003
- Publication date Apr 28, 2022
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20220059535
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuitry, DRAM Circuitry, Method Used in Forming Integr...
- Publication number 20210408007
- Publication date Dec 30, 2021
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20210375876
- Publication date Dec 2, 2021
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...
- Publication number 20210343724
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Daeik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-MEMORY ARRAY PROCESS EDGE MATS WITH SENSE AMPLIFIERS
- Publication number 20210335412
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Yuan He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20210296319
- Publication date Sep 23, 2021
- Micron Technology, Inc.
- Mitsunari Sukekawa
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuitry, DRAM Circuitry, Method Used In Forming Integr...
- Publication number 20210265359
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Hitoshi Ishigami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...
- Publication number 20210242226
- Publication date Aug 5, 2021
- Micron Technology, Inc.
- Durai Vishak Nirmal Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20210217657
- Publication date Jul 15, 2021
- XIA TAI XIN SEMICONDUCTOR (QING DAO) LTD.
- WOO-SONG AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies, and Methods of Forming Integrated Assemblies
- Publication number 20210125997
- Publication date Apr 29, 2021
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS
- Publication number 20210125992
- Publication date Apr 29, 2021
- Intel Corporation
- Travis LAJOIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY ARRAYS WITH VERTICAL TRANSISTORS AND THE FORMATION THEREOF
- Publication number 20210028308
- Publication date Jan 28, 2021
- Micron Technology, Inc.
- Fatma Arzum Simsek-Ege
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays
- Publication number 20200411522
- Publication date Dec 31, 2020
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Body Contact Regions Proximate Transis...
- Publication number 20200381438
- Publication date Dec 3, 2020
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20200350316
- Publication date Nov 5, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200313077
- Publication date Oct 1, 2020
- SK HYNIX INC.
- Ga-Young Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200235101
- Publication date Jul 23, 2020
- UNITED MICROELECTRONICS CORP.
- Li-Wei Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Body Contact Regions Proximate Transis...
- Publication number 20200185390
- Publication date Jun 11, 2020
- Micron Technology, Inc.
- Werner Juengling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry, DRAM Circuitry, Method Of Forming A Plurality...
- Publication number 20200105766
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Takayuki Iwaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Non-Conductive-Semiconductor-Ma...
- Publication number 20200105311
- Publication date Apr 2, 2020
- Micron Technology, Inc.
- Deepak Chandra Pandey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING LAYOUT DEFINITION OF SEMICONDUCTOR DEVICE
- Publication number 20200105764
- Publication date Apr 2, 2020
- UNITED MICROELECTRONICS CORP.
- Wei-Lun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Which Include Non-Conductive-Semiconductor-Ma...
- Publication number 20200027486
- Publication date Jan 23, 2020
- Micron Technology, Inc.
- Deepak Chandra Pandey
- G11 - INFORMATION STORAGE

with at least one step of making a data line

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Integrated circuitry, DRAM circuitry

Under-memory array process edge mats with sense amplifiers

Integrated assemblies, and methods of forming integrated assemblies

Dynamic random access memory device and method of fabricating the same

Integrated assemblies having body contact regions proximate transis...

Memory arrays

Method of manufacturing dynamic random access memory

Method of fabricating semiconductor device

Memory arrays with vertical transistors and the formation thereof

Electronic device and method for fabricating the same

Semiconductor memory device and method of forming the same

Method used in forming integrated circuitry, and method used in for...

Memory device with reduced-resistance interconnect

Semiconductor device including side surface conductor contact

Semiconductor memory devices including separate upper and lower bit...

Under-memory array process edge mats with sense amplifiers

Memory arrays comprising vertically-alternating tiers of insulative...

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Integrated assemblies which include non-conductive-semiconductor-ma...

Memory arrays

Methods of forming semiconductor devices

Methods of sealing openings, and methods of forming integrated asse...

Integrated assemblies having body contact regions proximate transis...

Semiconductor memory device comprising memory cell over driver

Integrated circuit devices and methods of fabricating the same

Semiconductor device and method of manufacturing the same

Integrated circuitry, DRAM circuitry, method of forming a plurality...

Construction of integrated circuitry and a method of forming an ele...

Memory arrays

Patents Applicationslast 30 patents

VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZON...

VERTICALLY STACKED STORAGE NODES AND ACCESS DEVICES WITH HORIZONTAL...

METAL GATE MEMORY DEVICE AND METHOD

MEMORY DEVICE HAVING A DIAGONALLY OPPOSITE GATE PAIR PER MEMORY CELL

Integrated Assemblies Having Body Contact Regions Proximate Transis...

VERTICAL DRAM STRUCTURE AND METHOD

SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CAPACITOR AND VERTICAL CH...

MEMORY ARRAYS WITH VERTICAL TRANSISTORS AND THE FORMATION THEREOF

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME

Integrated Circuitry, DRAM Circuitry, Method Used in Forming Integr...

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR MEMORY DEVICES INCLUDING SEPARATE UPPER AND LOWER BIT...

UNDER-MEMORY ARRAY PROCESS EDGE MATS WITH SENSE AMPLIFIERS

SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME

Integrated Circuitry, DRAM Circuitry, Method Used In Forming Integr...

Memory Arrays Comprising Vertically-Alternating Tiers Of Insulative...

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Integrated Assemblies, and Methods of Forming Integrated Assemblies

INTERCONNECT STRUCTURES FOR INTEGRATED CIRCUITS

MEMORY ARRAYS WITH VERTICAL TRANSISTORS AND THE FORMATION THEREOF

Memory Arrays

Integrated Assemblies Having Body Contact Regions Proximate Transis...

SEMICONDUCTOR MEMORY DEVICE

ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated Assemblies Having Body Contact Regions Proximate Transis...

Integrated Circuitry, DRAM Circuitry, Method Of Forming A Plurality...

Integrated Assemblies Which Include Non-Conductive-Semiconductor-Ma...

METHOD OF FORMING LAYOUT DEFINITION OF SEMICONDUCTOR DEVICE

Integrated Assemblies Which Include Non-Conductive-Semiconductor-Ma...