with heat sinks or radiation fins

Industry

CPC
G02B6/4269

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4269with heat sinks or radiation fins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro patterns created on the surface to control placement and unif...
- Patent number 12,176,474
- Issue date Dec 24, 2024
- Intel Corporation
- Asako Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable display device and projection device
- Patent number 12,158,585
- Issue date Dec 3, 2024
- Coretronic Corporation
- Chih-Wei Chang
- G02 - OPTICS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS
Information Patent Grant
Completely encapsulated optical multi chip package
- Patent number 12,099,245
- Issue date Sep 24, 2024
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Silicon photonic package and method of fabricating the same
- Patent number 12,092,874
- Issue date Sep 17, 2024
- OIP TECHNOLOGY PTE LTD.
- Yonggang Jin
- G02 - OPTICS
Information Patent Grant
Optical electrical connector with improved heat dissipation perform...
- Patent number 12,092,882
- Issue date Sep 17, 2024
- Dongguan Luxshare Technologies Co., Ltd.
- Yi-Tseng Lin
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,092,881
- Issue date Sep 17, 2024
- InnoLight Technology Pte. Ltd.
- Yuzhou Sun
- G02 - OPTICS
Information Patent Grant
Heat dissipation structure for optical module and communications de...
- Patent number 12,061,369
- Issue date Aug 13, 2024
- Huawei Technologies Co., Ltd.
- Yunchao Han
- G02 - OPTICS
Information Patent Grant
Circuit board assembly and electronic device
- Patent number 12,058,803
- Issue date Aug 6, 2024
- Huawei Technologies Co., Ltd.
- Chaojun Deng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical transceiver housing with integrated vapor chamber and an op...
- Patent number 12,055,775
- Issue date Aug 6, 2024
- Applied Optoelectronics, Inc.
- Hao-Chiang Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat exchange assembly for a pluggable module
- Patent number 12,050,352
- Issue date Jul 30, 2024
- TE CONNECTIVITY SOLUTIONS GmbH
- Zachary Galbraith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally resistant remote radio unit
- Patent number 12,044,891
- Issue date Jul 23, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefan Dahlfort
- G02 - OPTICS
Information Patent Grant
Switch
- Patent number 12,041,397
- Issue date Jul 16, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module cages mounted for optimal density and cooling
- Patent number 12,038,619
- Issue date Jul 16, 2024
- Cisco Technology, Inc.
- Joel Richard Goergen
- G02 - OPTICS
Information Patent Grant
Corrugated thermal interface device with lateral spring fingers
- Patent number 12,038,618
- Issue date Jul 16, 2024
- Hewlett Packard Enterprise Development LP
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Grant
Light modulating device and electronic apparatus including the same
- Patent number 12,032,267
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Byunggil Jeong
- G02 - OPTICS
Information Patent Grant
Network interface device having a frame with a sloped top wall portion
- Patent number 12,019,291
- Issue date Jun 25, 2024
- MELLANOX TECHNOLOGIES LTD.
- Yaniv Kazav
- G02 - OPTICS
Information Patent Grant
Optical transceiver with separated heat dissipation components
- Patent number 12,013,583
- Issue date Jun 18, 2024
- Prime World International Holdings Ltd.
- Yi-Ju Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Silicon photonics optical transceiver device
- Patent number 12,007,612
- Issue date Jun 11, 2024
- WAVESPLITTER TECHNOLOGIES, INC.
- Ming-Ju Chen
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 11,994,726
- Issue date May 28, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Honghao Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embeddable module for high output led
- Patent number 11,988,825
- Issue date May 21, 2024
- Acera, LLC
- Thomas V. Root
- F21 - LIGHTING
Information Patent Grant
Device for transferring heat between a first module and a second mo...
- Patent number 11,988,882
- Issue date May 21, 2024
- Huawei Technologies Co., Ltd.
- Fredrik Ohlsson
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL MODULE
- Publication number 20250023294
- Publication date Jan 16, 2025
- Cloud Light Technology Limited
- CHIEH-TSE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF
- Publication number 20250020879
- Publication date Jan 16, 2025
- GEMTEK TECHNOLOGY CO., LTD.
- Yen-Yu LAI
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL CIRCUIT
- Publication number 20250012988
- Publication date Jan 9, 2025
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
SUBSTRATE ASSEMBLY
- Publication number 20250012986
- Publication date Jan 9, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250004216
- Publication date Jan 2, 2025
- OIP Technology Pte Ltd
- How Yuan HWANG
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...
- Publication number 20240418949
- Publication date Dec 19, 2024
- nLIGHT, Inc.
- C. Geoffrey FANNING
- G02 - OPTICS
Information Patent Application
TRANSCEIVER AND INTERFACE FOR IC PACKAGE
- Publication number 20240402446
- Publication date Dec 5, 2024
- SAMTEC, INC.
- Eric J. ZBINDEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATER ASSEMBLY
- Publication number 20240369784
- Publication date Nov 7, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Stefano ORSI
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL PACKING STRUCTURE
- Publication number 20240353635
- Publication date Oct 24, 2024
- FOCI FIBER OPTIC COMMUNICATIONS, INC.
- Ting-Ta Hu
- G02 - OPTICS
Information Patent Application
Cooling assembly and method for user-facing surfaces of a pluggable...
- Publication number 20240345342
- Publication date Oct 17, 2024
- CIENA CORPORATION
- Peter Ajersch
- G02 - OPTICS
Information Patent Application
Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...
- Publication number 20240337799
- Publication date Oct 10, 2024
- Chipletz, Inc.
- Siddharth Ravichandran
- G02 - OPTICS
Information Patent Application
Platform Supports the Shortest Direct Electrical Connections betwee...
- Publication number 20240337798
- Publication date Oct 10, 2024
- Shuang Jin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS
- Publication number 20240329342
- Publication date Oct 3, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Harvey John Lunsman
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...
- Publication number 20240329343
- Publication date Oct 3, 2024
- Nitto Denko Corporation
- Atsushi Yamagishi
- G02 - OPTICS
Information Patent Application
LIGHT MODULATING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME
- Publication number 20240310693
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Byunggil JEONG
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE
- Publication number 20240310591
- Publication date Sep 19, 2024
- Kyocera Corporation
- Tomoyuki AKAHOSHI
- G02 - OPTICS
Information Patent Application
MANAGING TEMPERATURES IN INTEGRATED CIRCUITS
- Publication number 20240288633
- Publication date Aug 29, 2024
- CIENA CORPORATION
- Raphael Beaupré-Laflamme
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240288642
- Publication date Aug 29, 2024
- InnoLight Technology (Suzhou) LTD.
- LONG CHEN
- G02 - OPTICS
Information Patent Application
DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...
- Publication number 20240272390
- Publication date Aug 15, 2024
- II-VI Delaware, Inc.
- Long Nguyen
- G02 - OPTICS
Information Patent Application
CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT FOR BEING...
- Publication number 20240248266
- Publication date Jul 25, 2024
- DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD
- Bin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIBER-OPTIC CABLE WITH MONITORING OF BACKWARD-PROPAGATING RADIATION
- Publication number 20240248267
- Publication date Jul 25, 2024
- OPTOSKAND AB
- Fredrik JOHANSSON
- G02 - OPTICS
Information Patent Application
PHOTOELECTRIC SIGNAL CONVERSION DEVICE
- Publication number 20240241331
- Publication date Jul 18, 2024
- JESS-LINK PRODUCTS CO., LTD.
- Chi-Hsien SUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Optical Module
- Publication number 20240241328
- Publication date Jul 18, 2024
- HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
- Honghao ZHANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE DISPLAY DEVICE, HEAD-UP DISPLAY EQUIPPED WITH IMAGE DISPLAY D...
- Publication number 20240231003
- Publication date Jul 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Shunsuke Tomomatsu
- G02 - OPTICS
Information Patent Application
Optical Module and Optical Communication Device
- Publication number 20240231022
- Publication date Jul 11, 2024
- Huawei Technologies Co., Ltd
- Zhiyuan Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20240219662
- Publication date Jul 4, 2024
- Sumitomo Electric Industries, Ltd.
- Hiroshi UEMURA
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20240219663
- Publication date Jul 4, 2024
- INNOLIGHT TECHNOLOGY (SUZHOU) LTD.
- Liang LUO
- G02 - OPTICS
Information Patent Application
SEPARATED HEAT DISSIPATING DEVICE HAVING SUSPENSION MECHANISM AND O...
- Publication number 20240206124
- Publication date Jun 20, 2024
- Alpha Networks Inc.
- HAO HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with heat sinks or radiation fins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Apparatus and methods for optical interconnects

Micro patterns created on the surface to control placement and unif...

Compressible thermal link

High speed network device with orthogonal pluggable optics modules

Optical module

Wearable display device and projection device

Active optical coupler

Cooling device, a receptacle assembly, a system and a printed board...

Co-packaging photonic integrated circuits and application specific...

Transceiver and interface for IC package

Optical module

Completely encapsulated optical multi chip package

Silicon photonic package and method of fabricating the same

Optical electrical connector with improved heat dissipation perform...

Optical module

Heat dissipation structure for optical module and communications de...

Circuit board assembly and electronic device

Optical transceiver housing with integrated vapor chamber and an op...

Heat exchange assembly for a pluggable module

Thermally resistant remote radio unit

Switch

Optical module cages mounted for optimal density and cooling

Corrugated thermal interface device with lateral spring fingers

Light modulating device and electronic apparatus including the same

Network interface device having a frame with a sloped top wall portion

Optical transceiver with separated heat dissipation components

Silicon photonics optical transceiver device

Optical module

Embeddable module for high output led

Device for transferring heat between a first module and a second mo...

Patents Applicationslast 30 patents

OPTICAL MODULE

PLUGGABLE OPTICAL MODULE

COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF

ELECTRO-OPTICAL CIRCUIT

SUBSTRATE ASSEMBLY

INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...

TRANSCEIVER AND INTERFACE FOR IC PACKAGE

HEAT DISSIPATER ASSEMBLY

PLUGGABLE OPTICAL PACKING STRUCTURE

Cooling assembly and method for user-facing surfaces of a pluggable...

Co-Packaging Assembly and Method for Attaching Photonic Dies/Module...

Platform Supports the Shortest Direct Electrical Connections betwee...

CORRUGATED THERMAL INTERFACE DEVICE WITH LATERAL SPRING FINGERS

PHOTOELECTRIC COMPOSITE TRANSMISSION MODULE AND OPTICAL COMMUNICATI...

LIGHT MODULATING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME

OPTICAL MODULE AND OPTICAL COMMUNICATION DEVICE

MANAGING TEMPERATURES IN INTEGRATED CIRCUITS

OPTICAL MODULE

DUAL DUPLEX BELLY-TO-BELLY LITTLE CONNECTOR (BBLC) BASED OPTICAL CO...

CONNECTOR ASSEMBLY WITH IMPROVED HEAT DISSIPATION EFFECT FOR BEING...

FIBER-OPTIC CABLE WITH MONITORING OF BACKWARD-PROPAGATING RADIATION

PHOTOELECTRIC SIGNAL CONVERSION DEVICE

Optical Module

IMAGE DISPLAY DEVICE, HEAD-UP DISPLAY EQUIPPED WITH IMAGE DISPLAY D...

Optical Module and Optical Communication Device

OPTICAL MODULE

OPTICAL MODULE

SEPARATED HEAT DISSIPATING DEVICE HAVING SUSPENSION MECHANISM AND O...