with heat sinks or radiation fins

Industry

CPC
G02B6/4269

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Parent Industries

GPHYSICS G02Optics G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS G02B6/00Light guides

Current Industry

G02B6/4269with heat sinks or radiation fins

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Optical module
- Patent number 12,366,714
- Issue date Jul 22, 2025
- Hisense Broadband Multimedia Technologies Co., Ltd
- Liu Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Heat dissipation structures for optical communication devices
- Patent number 12,366,713
- Issue date Jul 22, 2025
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
Mechanical thermal interface for improved heat dissipation in netwo...
- Patent number 12,360,323
- Issue date Jul 15, 2025
- Mellanox Technologies, Ltd.
- Jamal Mousa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Separated heat dissipating device having suspension mechanism and o...
- Patent number 12,342,507
- Issue date Jun 24, 2025
- Alpha Networks Inc.
- Hao Huang
- G02 - OPTICS
Information Patent Grant
Opto-electronic integrated module
- Patent number 12,332,489
- Issue date Jun 17, 2025
- Nippon Telegraph and Telephone Corporation
- Yuriko Kawamura
- G02 - OPTICS
Information Patent Grant
Optical transceiver modules and heat management techniques therefor
- Patent number 12,321,023
- Issue date Jun 3, 2025
- Molex, LLC
- Shiping Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management system for multi-chip-module and associated methods
- Patent number 12,313,891
- Issue date May 27, 2025
- Ayar Labs, Inc.
- Roy Edward Meade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector system
- Patent number 12,292,606
- Issue date May 6, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Marco Assale
- G02 - OPTICS
Information Patent Grant
Heat dissipation module and projection device
- Patent number 12,292,674
- Issue date May 6, 2025
- Coretronic Corporation
- Pei-Rong Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation module and connector
- Patent number 12,287,159
- Issue date Apr 29, 2025
- Tyco Electronics (Shanghai) Co., Ltd.
- WenYu (Vindy) Liu
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Ultra-dense, low-profile edge card connector
- Patent number 12,278,441
- Issue date Apr 15, 2025
- Samtec, Inc.
- Marc Epitaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,276,849
- Issue date Apr 15, 2025
- Dongguan Luxshare Technologies Co., Ltd.
- QianBing Yan
- G02 - OPTICS
Information Patent Grant
Thermal management of high capacity optics in dense arrangements
- Patent number 12,279,399
- Issue date Apr 15, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Connector assembly with movable heat sink
- Patent number 12,272,896
- Issue date Apr 8, 2025
- Molex, LLC
- Che-Yuan Yang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Fiber shuffle embedded optical connector
- Patent number 12,253,724
- Issue date Mar 18, 2025
- Intel Corporation
- Asako Toda
- G02 - OPTICS
Information Patent Grant
Optical module
- Patent number 12,235,497
- Issue date Feb 25, 2025
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Honghao Zhang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Transceiver handle heat dissipation airflow channeling system
- Patent number 12,225,681
- Issue date Feb 11, 2025
- Dell Products L.P.
- Shree Rathinasamy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Data processor cartridge
- Patent number 12,218,447
- Issue date Feb 4, 2025
- AMULET HOTKEY LTD
- Sean Andrew Copeland
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus and methods for optical interconnects
- Patent number 12,181,724
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Stefan Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro patterns created on the surface to control placement and unif...
- Patent number 12,176,474
- Issue date Dec 24, 2024
- Intel Corporation
- Asako Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compressible thermal link
- Patent number 12,160,979
- Issue date Dec 3, 2024
- Cisco Technology, Inc.
- Chejung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High speed network device with orthogonal pluggable optics modules
- Patent number 12,158,627
- Issue date Dec 3, 2024
- Arista Networks, Inc.
- Adam Hemp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,158,626
- Issue date Dec 3, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd
- Long Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wearable display device and projection device
- Patent number 12,158,585
- Issue date Dec 3, 2024
- Coretronic Corporation
- Chih-Wei Chang
- G02 - OPTICS
Information Patent Grant
Active optical coupler
- Patent number 12,153,269
- Issue date Nov 26, 2024
- Intel Corporation
- Divya Pratap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling device, a receptacle assembly, a system and a printed board...
- Patent number 12,147,084
- Issue date Nov 19, 2024
- Telefonaktiebolaget LM Ericsson (publ)
- Mikkel Myhre
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Co-packaging photonic integrated circuits and application specific...
- Patent number 12,147,073
- Issue date Nov 19, 2024
- Acacia Communications, Inc.
- Christopher Doerr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transceiver and interface for IC package
- Patent number 12,140,809
- Issue date Nov 12, 2024
- Samtec, Inc.
- Eric J. Zbinden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical module
- Patent number 12,130,483
- Issue date Oct 29, 2024
- Hisense Broadband Multimedia Technologies Co., Ltd.
- Jianwei Yao
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Mechanical thermal interface for improved heat dissipation in netwo...
- Publication number 20250237826
- Publication date Jul 24, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Jamal Mousa
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE AND COMMUNICATION APPARATUS
- Publication number 20250237825
- Publication date Jul 24, 2025
- NEC Corporation
- Yuuji MINOTA
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER MODULE AND METHODS OF MAKING AND USING THE SAME
- Publication number 20250224577
- Publication date Jul 10, 2025
- SOURCE PHOTONICS (CHENGDU) CO., LTD.
- Libing ZHU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20250227888
- Publication date Jul 10, 2025
- Marvell Asia Pte Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-DENSE, LOW-PROFILE EDGE CARD CONNECTOR
- Publication number 20250219310
- Publication date Jul 3, 2025
- SAMTEC, INC.
- Marc Epitaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-BANDWIDTH FRONT-PLUGGABLE CO-PACKAGED OPTICAL CONFIGURATION FO...
- Publication number 20250216631
- Publication date Jul 3, 2025
- SEAGATE TECHNOLOGY LLC
- Richard Charles Alexander Pitwon
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE AND OPTICAL TRANSCEIVER
- Publication number 20250189735
- Publication date Jun 12, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- G02 - OPTICS
Information Patent Application
THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS
- Publication number 20250176145
- Publication date May 29, 2025
- Cisco Technology, Inc.
- M. Baris Dogruoz
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
OPTICAL SYSTEM-IN-PACKAGE, AND OPTICAL MODULE AND OPTICAL TRANSCEIV...
- Publication number 20250174613
- Publication date May 29, 2025
- Lipac Co., Ltd.
- Seong Wook CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...
- Publication number 20250169032
- Publication date May 22, 2025
- Suzhou MetaBrain Intelligent Technology Co., Ltd
- Tao WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250164719
- Publication date May 22, 2025
- Kyocera Corporation
- Takashi YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION APPARATUS, HEAT DISSIPATION SYSTEM, AND HEAT DISSI...
- Publication number 20250147250
- Publication date May 8, 2025
- Ruijie Networks Co., Ltd.
- Zhaokuan LIANG
- G02 - OPTICS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250138262
- Publication date May 1, 2025
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- G02 - OPTICS
Information Patent Application
SMALL FOOTPRINT INDEPENDENT HEATSINK ATTACHMENT FOR A PLUGGABLE OPT...
- Publication number 20250138263
- Publication date May 1, 2025
- CIENA CORPORATION
- Peter Vincent Saturley
- G02 - OPTICS
Information Patent Application
OPTICAL TRANSCEIVER HEAT SINK
- Publication number 20250130382
- Publication date Apr 24, 2025
- VECIMA NETWORKS INC.
- Clinton Wade BINKLEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE
- Publication number 20250123456
- Publication date Apr 17, 2025
- Innolight Technology(ChengDu)LTD.
- Yin Wei
- G02 - OPTICS
Information Patent Application
APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS
- Publication number 20250110303
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Stefan RUSU
- G02 - OPTICS
Information Patent Application
HOUSING STRUCTURE OF OPTICAL MODULE AND OPTICAL MODULECONTAINING TH...
- Publication number 20250102747
- Publication date Mar 27, 2025
- Source Photonics (Chengdu) Co.,Ltd.
- Libing ZHU
- G02 - OPTICS
Information Patent Application
CAGE ASSEMBLY AND RECEPTACLE ASSEMBLY
- Publication number 20250102246
- Publication date Mar 27, 2025
- Yamaichi Electronics Co., Ltd.
- Toshiyasu ITO
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
OPTICAL MODULE ASSEMBLY
- Publication number 20250093599
- Publication date Mar 20, 2025
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Won-Bae KWON
- G02 - OPTICS
Information Patent Application
Enhanced optical module cooling with angled fins
- Publication number 20250085495
- Publication date Mar 13, 2025
- CIENA CORPORATION
- Bonnie Lynne Mack
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES
- Publication number 20250044536
- Publication date Feb 6, 2025
- Arista Networks, Inc.
- Andreas Bechtolsheim
- G02 - OPTICS
Information Patent Application
OPTICAL MODULE
- Publication number 20250035868
- Publication date Jan 30, 2025
- Sumitomo Electric Industries, Ltd.
- Taisuke NAGASAKI
- G02 - OPTICS
Information Patent Application
PLUGGABLE OPTICAL MODULE
- Publication number 20250023294
- Publication date Jan 16, 2025
- Cloud Light Technology Limited
- CHIEH-TSE HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF
- Publication number 20250020879
- Publication date Jan 16, 2025
- GEMTEK TECHNOLOGY CO., LTD.
- Yen-Yu LAI
- G02 - OPTICS
Information Patent Application
ELECTRO-OPTICAL CIRCUIT
- Publication number 20250012988
- Publication date Jan 9, 2025
- Cisco Technology, Inc.
- Vipulkumar K. PATEL
- G02 - OPTICS
Information Patent Application
SUBSTRATE ASSEMBLY
- Publication number 20250012986
- Publication date Jan 9, 2025
- FURUKAWA ELECTRIC CO., LTD.
- Yuta ISHIGE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250004216
- Publication date Jan 2, 2025
- OIP Technology Pte Ltd
- How Yuan HWANG
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...
- Publication number 20240418949
- Publication date Dec 19, 2024
- nLIGHT, Inc.
- C. Geoffrey FANNING
- G02 - OPTICS

with heat sinks or radiation fins

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Optical module

Heat dissipation structures for optical communication devices

Mechanical thermal interface for improved heat dissipation in netwo...

Separated heat dissipating device having suspension mechanism and o...

Opto-electronic integrated module

Optical transceiver modules and heat management techniques therefor

Thermal management system for multi-chip-module and associated methods

Connector system

Heat dissipation module and projection device

Heat dissipation module and connector

Ultra-dense, low-profile edge card connector

Optical module

Thermal management of high capacity optics in dense arrangements

Connector assembly with movable heat sink

Heatsink for co-packaged optical switch rack package

Fiber shuffle embedded optical connector

Optical module

Transceiver handle heat dissipation airflow channeling system

Data processor cartridge

Apparatus and methods for optical interconnects

Micro patterns created on the surface to control placement and unif...

Compressible thermal link

High speed network device with orthogonal pluggable optics modules

Optical module

Wearable display device and projection device

Active optical coupler

Cooling device, a receptacle assembly, a system and a printed board...

Co-packaging photonic integrated circuits and application specific...

Transceiver and interface for IC package

Optical module

Patents Applicationslast 30 patents

Mechanical thermal interface for improved heat dissipation in netwo...

OPTICAL MODULE AND COMMUNICATION APPARATUS

OPTICAL TRANSCEIVER MODULE AND METHODS OF MAKING AND USING THE SAME

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

ULTRA-DENSE, LOW-PROFILE EDGE CARD CONNECTOR

HIGH-BANDWIDTH FRONT-PLUGGABLE CO-PACKAGED OPTICAL CONFIGURATION FO...

OPTICAL DEVICE AND OPTICAL TRANSCEIVER

THERMAL MANAGEMENT OF HIGH CAPACITY OPTICS IN DENSE ARRANGEMENTS

OPTICAL SYSTEM-IN-PACKAGE, AND OPTICAL MODULE AND OPTICAL TRANSCEIV...

OPTICAL MODULE COOLING APPARATUS, OPTICAL MODULE SYSTEM, AND OPTICA...

SEMICONDUCTOR MODULE

HEAT DISSIPATION APPARATUS, HEAT DISSIPATION SYSTEM, AND HEAT DISSI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SMALL FOOTPRINT INDEPENDENT HEATSINK ATTACHMENT FOR A PLUGGABLE OPT...

OPTICAL TRANSCEIVER HEAT SINK

OPTICAL MODULE

APPARATUS AND METHODS FOR OPTICAL INTERCONNECTS

HOUSING STRUCTURE OF OPTICAL MODULE AND OPTICAL MODULECONTAINING TH...

CAGE ASSEMBLY AND RECEPTACLE ASSEMBLY

OPTICAL MODULE ASSEMBLY

Enhanced optical module cooling with angled fins

HIGH SPEED NETWORK DEVICE WITH ORTHOGONAL PLUGGABLE OPTICS MODULES

OPTICAL MODULE

PLUGGABLE OPTICAL MODULE

COMMUNICATION ASSEMBLY AND HEAT DISSIPATION SHIELDING MODULE THEREOF

ELECTRO-OPTICAL CIRCUIT

SUBSTRATE ASSEMBLY

INTEGRATED PHOTONICS PACKAGE AND METHOD OF FORMING SAME

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

FIBER CONNECTOR BULKHEAD ADAPTER WITH SHROUD FOR PROTECTING HIGH-PO...