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CPC
Y10S257/924

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YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10S257/00Active solid-state devices

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Y10S257/924with passive device

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including first inductor of a spiral shape and...
- Patent number 9,319,091
- Issue date Apr 19, 2016
- Renesas Electronics Corporation
- Takao Kihara
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Battery pack with integral seal member and electronic device includ...
- Patent number 9,269,935
- Issue date Feb 23, 2016
- Varian Medical Systems, Inc.
- Steven Douglas Bandis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device including a thin film transistor and a capacitor
- Patent number 9,070,773
- Issue date Jun 30, 2015
- Semiconductor Energy Laboratory Co., Ltd.
- Akira Ishikawa
- G02 - OPTICS
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 9,012,264
- Issue date Apr 21, 2015
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device
- Patent number 8,941,213
- Issue date Jan 27, 2015
- Renesas Electronics Corporation
- Takao Kihara
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package including embedded thin-film battery
- Patent number 8,766,435
- Issue date Jul 1, 2014
- STMicroelectronics, Inc.
- Michael J. Hundt
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,531,025
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Nonvolatile memory element having a tantalum oxide variable resista...
- Patent number 8,492,875
- Issue date Jul 23, 2013
- Panasonic Corporation
- Koichi Osano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device including a thin film transistor and capacitor
- Patent number 8,368,071
- Issue date Feb 5, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Akira Ishikawa
- G02 - OPTICS
Information Patent Grant
Capacitive element, method of manufacture of the same, and semicond...
- Patent number 8,264,063
- Issue date Sep 11, 2012
- Fujitsu Limited
- Takeshi Shioga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Inductively coupled integrated circuit with magnetic communication...
- Patent number 8,217,492
- Issue date Jul 10, 2012
- Broadcom Corporation
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Nonvolatile memory element having a tantalum oxide variable resista...
- Patent number 8,217,489
- Issue date Jul 10, 2012
- Panasonic Corporation
- Koichi Osano
- G11 - INFORMATION STORAGE
Information Patent Grant
Capacitors and methods of manufacture thereof
- Patent number 8,101,985
- Issue date Jan 24, 2012
- Infineon Technologies AG
- Matthias Hierlemann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming a card with embedded IC and electrochemical cell
- Patent number 8,088,243
- Issue date Jan 3, 2012
- Solicore, Inc.
- C. Glen Wensley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Semiconductor device having metal cap divided by slit
- Patent number 8,076,771
- Issue date Dec 13, 2011
- Renesas Electronics Corporation
- Hideko Ando
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Interposer for redistributing signals
- Patent number 8,062,968
- Issue date Nov 22, 2011
- Xilinx, Inc.
- Robert O. Conn
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Variable resistance nonvolatile memory apparatus
- Patent number 8,058,636
- Issue date Nov 15, 2011
- Panasonic Corporation
- Koichi Osano
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with power noise suppression
- Patent number 8,049,303
- Issue date Nov 1, 2011
- Hitachi, Ltd.
- Hideki Osaka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,021,925
- Issue date Sep 20, 2011
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure of a microphone
- Patent number 7,884,467
- Issue date Feb 8, 2011
- Lingsen Precision Industries, Ltd.
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus for non-conductively interconnecting integrated circuits
- Patent number 7,869,221
- Issue date Jan 11, 2011
- Oracle America, Inc.
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Grant
Capacitors and methods of manufacture thereof
- Patent number 7,851,302
- Issue date Dec 14, 2010
- Infineon Technologies AG
- Matthias Hierlemann
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Inductively coupled integrated circuit with magnetic communication...
- Patent number 7,795,700
- Issue date Sep 14, 2010
- Broadcom Corporation
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device including triple-stacked structures having the...
- Patent number 7,732,895
- Issue date Jun 8, 2010
- NEC Electronics Corporation
- Takeshi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,719,085
- Issue date May 18, 2010
- NEC Electronics Corporation
- Takuji Onuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having an array of embedded capacitors for power delivery an...
- Patent number 7,705,423
- Issue date Apr 27, 2010
- Georgia Tech Research Corporation
- Madhavan Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated current sensor package
- Patent number 7,679,162
- Issue date Mar 16, 2010
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Grant
Interposing structure
- Patent number 7,566,960
- Issue date Jul 28, 2009
- Xilinx, Inc.
- Robert O. Conn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging image sensitive electronic devices
- Patent number 7,553,688
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Todd O. Bolken
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin profile battery bonding method, method of conductively interco...
- Patent number 7,511,616
- Issue date Mar 31, 2009
- Keystone Technology Solutions, LLC
- Rickie C. Lake
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY
- Publication number 20140315334
- Publication date Oct 23, 2014
- Michael J. Hundt
- G21 - NUCLEAR PHYSICS NUCLEAR ENGINEERING
Information Patent Application
BATTERY PACK WITH INTEGRAL SEAL MEMBER AND ELECTRONIC DEVICE INCLUD...
- Publication number 20140211921
- Publication date Jul 31, 2014
- Varian Medical Systems, Inc.
- Steven Douglas Bandis
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130285198
- Publication date Oct 31, 2013
- RENESAS ELECTRONICS CORPORATION
- Takao KIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Preparing the Same
- Publication number 20130140577
- Publication date Jun 6, 2013
- SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Akira Ishikawa
- G02 - OPTICS
Information Patent Application
NONVOLATILE MEMORY ELEMENT HAVING A TANTALUM OXIDE VARIABLE RESISTA...
- Publication number 20120235111
- Publication date Sep 20, 2012
- PANASONIC CORPORATION
- Koichi OSANO
- G11 - INFORMATION STORAGE
Information Patent Application
NONVOLATILE MEMORY APPARATUS, NONVOLATILE MEMORY ELEMENT, AND NONVO...
- Publication number 20120074369
- Publication date Mar 29, 2012
- PANASONIC CORPORATION
- Koichi OSANO
- G11 - INFORMATION STORAGE
Information Patent Application
Capacitors and Methods of Manufacture Thereof
- Publication number 20110037146
- Publication date Feb 17, 2011
- Matthias Hierlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION...
- Publication number 20100285634
- Publication date Nov 11, 2010
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
NONVOLATILE MEMORY APPARATUS, NONVOLATILE MEMORY ELEMENT, AND NONVO...
- Publication number 20090250678
- Publication date Oct 8, 2009
- Koichi Osano
- G11 - INFORMATION STORAGE
Information Patent Application
INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION...
- Publication number 20090218701
- Publication date Sep 3, 2009
- BROADCOM CORPORATION
- Ahmadreza (Reza) Rofougaran
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METAL CAP
- Publication number 20090001555
- Publication date Jan 1, 2009
- NEC Electronics Corporation
- Hideko ANDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATE...
- Publication number 20080315978
- Publication date Dec 25, 2008
- SUN MICROSYSTEMS, INC.
- Thomas F. Knight
- G01 - MEASURING TESTING
Information Patent Application
Capacitive element, method of manufacture of the same, and semicond...
- Publication number 20080315358
- Publication date Dec 25, 2008
- FUJITSU LIMITED
- Takeshi Shioga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20080299707
- Publication date Dec 4, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Profile Battery Bonding Method, Method Of Conductively Interco...
- Publication number 20080291027
- Publication date Nov 27, 2008
- RICKIE C. LAKE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure of a microphone
- Publication number 20080285784
- Publication date Nov 20, 2008
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20080258259
- Publication date Oct 23, 2008
- Hideki OSAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frame with Included Passive Devices
- Publication number 20080036034
- Publication date Feb 14, 2008
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for preparing the same
- Publication number 20070295964
- Publication date Dec 27, 2007
- Semiconductor Energy Laboratory Co., Ltd
- Akira Ishikawa
- G02 - OPTICS
Information Patent Application
Semiconductor device including triple-stacked structures having the...
- Publication number 20070262453
- Publication date Nov 15, 2007
- NEC ELECTRONICS CORPORATION
- Takeshi Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20070222064
- Publication date Sep 27, 2007
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having capacitors for reducing power source noise
- Publication number 20070205505
- Publication date Sep 6, 2007
- Renesas Technology Corp.
- Masaki Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of a microphone
- Publication number 20070182002
- Publication date Aug 9, 2007
- Chin-Ching Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Card with embedded IC and electrochemical cell
- Publication number 20070184343
- Publication date Aug 9, 2007
- Solicore
- C. Glen Wensley
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Array capacitors for broadband decoupling applications, and methods...
- Publication number 20070152301
- Publication date Jul 5, 2007
- Intel Corporation
- Joel A. Auernheimer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20070148825
- Publication date Jun 28, 2007
- NEC ELECTRONICS CORPORATION
- Kuniko Kikuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated current sensor package
- Publication number 20070139066
- Publication date Jun 21, 2007
- Silicon Laboratories Inc.
- Timothy J. Dupuis
- G01 - MEASURING TESTING
Information Patent Application
Packaging having an array of embedded capacitors for power delivery...
- Publication number 20070120225
- Publication date May 31, 2007
- Madhavan Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package having an array of embedded capacitors for power delivery a...
- Publication number 20070102811
- Publication date May 10, 2007
- Madhavan Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070096294
- Publication date May 3, 2007
- Sanyo Electric Co., Ltd.
- Osamu Ikeda
- B81 - MICRO-STRUCTURAL TECHNOLOGY

with passive device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device including first inductor of a spiral shape and...

Battery pack with integral seal member and electronic device includ...

Semiconductor device including a thin film transistor and a capacitor

Integrated circuit package including embedded thin-film battery

Semiconductor device

Integrated circuit package including embedded thin-film battery

Thermal paste containment for semiconductor modules

Nonvolatile memory element having a tantalum oxide variable resista...

Semiconductor device including a thin film transistor and capacitor

Capacitive element, method of manufacture of the same, and semicond...

Inductively coupled integrated circuit with magnetic communication...

Nonvolatile memory element having a tantalum oxide variable resista...

Capacitors and methods of manufacture thereof

Method of forming a card with embedded IC and electrochemical cell

Semiconductor device having metal cap divided by slit

Interposer for redistributing signals

Variable resistance nonvolatile memory apparatus

Semiconductor device with power noise suppression

Thermal paste containment for semiconductor modules

Package structure of a microphone

Apparatus for non-conductively interconnecting integrated circuits

Capacitors and methods of manufacture thereof

Inductively coupled integrated circuit with magnetic communication...

Semiconductor device including triple-stacked structures having the...

Semiconductor device and method of manufacturing the same

Device having an array of embedded capacitors for power delivery an...

Integrated current sensor package

Interposing structure

Methods for packaging image sensitive electronic devices

Thin profile battery bonding method, method of conductively interco...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE INCLUDING EMBEDDED THIN-FILM BATTERY

BATTERY PACK WITH INTEGRAL SEAL MEMBER AND ELECTRONIC DEVICE INCLUD...

SEMICONDUCTOR DEVICE

Semiconductor Device and Method for Preparing the Same

NONVOLATILE MEMORY ELEMENT HAVING A TANTALUM OXIDE VARIABLE RESISTA...

NONVOLATILE MEMORY APPARATUS, NONVOLATILE MEMORY ELEMENT, AND NONVO...

Capacitors and Methods of Manufacture Thereof

INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION...

NONVOLATILE MEMORY APPARATUS, NONVOLATILE MEMORY ELEMENT, AND NONVO...

INDUCTIVELY COUPLED INTEGRATED CIRCUIT WITH MAGNETIC COMMUNICATION...

SEMICONDUCTOR DEVICE HAVING METAL CAP

METHOD AND APPARATUS FOR NON-CONDUCTIVELY INTERCONNECTING INTEGRATE...

Capacitive element, method of manufacture of the same, and semicond...

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

Thin Profile Battery Bonding Method, Method Of Conductively Interco...

Package structure of a microphone

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

Lead Frame with Included Passive Devices

Semiconductor device and method for preparing the same

Semiconductor device including triple-stacked structures having the...

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

Semiconductor device having capacitors for reducing power source noise

Package structure of a microphone

Card with embedded IC and electrochemical cell

Array capacitors for broadband decoupling applications, and methods...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Integrated current sensor package

Packaging having an array of embedded capacitors for power delivery...

Package having an array of embedded capacitors for power delivery a...

Semiconductor device and manufacturing method of the same