TREA

with retainers mounted beforehand on the PCB

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  • CPC
  • H05K9/0035
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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K9/00Screening of apparatus or components against electric or magnetic fields

Current Industry

H05K9/0035with retainers mounted beforehand on the PCB
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    EYEWEAR WITH RF SHIELDING HAVING GROUNDING SPRINGS
    • Publication number 20240324155
    • Publication date Sep 26, 2024
    • Chukwubuikem Marcel Okoli
    • G02 - OPTICS
  • Information Patent Application

    Shield Can as Stiffener on Flexible Printed Circuits
    • Publication number 20240224481
    • Publication date Jul 4, 2024
    • Meta Platforms Technologies, LLC
    • Adam Richard WEBER
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EYEWEAR WITH RF SHIELDING HAVING GROUNDING SPRINGS
    • Publication number 20230301045
    • Publication date Sep 21, 2023
    • Chukwubuikem Marcel Okoli
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Shielded Interconnect System
    • Publication number 20220022348
    • Publication date Jan 20, 2022
    • GITech, Inc.
    • John Williams
    • G01 - MEASURING TESTING
  • Information Patent Application

    TERMINAL AND METHOD FOR RETAINING A COMPONENT TO A SURFACE, AND MAN...
    • Publication number 20200107477
    • Publication date Apr 2, 2020
    • HARWIN PLC
    • Robert Webber
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONDUCTIVE CLIP
    • Publication number 20160081236
    • Publication date Mar 17, 2016
    • KITAGAWA INDUSTRIES CO., LTD.
    • Tomohisa KURITA
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHIELD CAN ASSEMBLY AND ELECTRONIC DEVICE INCLUDING THE SAME
    • Publication number 20140362543
    • Publication date Dec 11, 2014
    • Ki-Youn Jang
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHIELDING REINFORCING APPARATUS
    • Publication number 20140318851
    • Publication date Oct 30, 2014
    • Samsung Electronics Co., Ltd.
    • Won-Jea JANG
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SUPPORT-RETAINING STRUCTURE FOR INTERFACE CARD
    • Publication number 20140293567
    • Publication date Oct 2, 2014
    • Lite-On Technology Corporation
    • YU-CHING KUO
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SURFACE MOUNT CLIP
    • Publication number 20130280968
    • Publication date Oct 24, 2013
    • Kitagawa Industries Co., Ltd.
    • Tomohisa KURITA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SURFACE MOUNT CLIP
    • Publication number 20130206457
    • Publication date Aug 15, 2013
    • KITAGAWA INDUSTRIES CO., LTD.
    • Kenji Konda
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CLIP TERMINAL FOR FIXING CASE AND SHIELD APPARATUS USING THE SAME
    • Publication number 20130148318
    • Publication date Jun 13, 2013
    • JOINSET CO., LTD.
    • Sun-Ki Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METAL STRIP ASSEMBLY FOR EMI SHIELD CASE, EMI SHIELD CASE INCLUDING...
    • Publication number 20130008707
    • Publication date Jan 10, 2013
    • JOINSET CO., LTD.
    • Sun-Ki Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SHIELD CASE FOR EMI SHIELDING
    • Publication number 20120218727
    • Publication date Aug 30, 2012
    • JOINSET CO., LTD.
    • Sun-Ki Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    MID-BOARD MODULE RETENTION AND EMI CAGE
    • Publication number 20110272188
    • Publication date Nov 10, 2011
    • AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD.
    • Seng-Kum Chan
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMI SHIELD SPRING DEVICE
    • Publication number 20100261359
    • Publication date Oct 14, 2010
    • HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD
    • MING-CHIH CHAN
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Shield Structure
    • Publication number 20090057002
    • Publication date Mar 5, 2009
    • Murata Manufacturing Co., Ltd.
    • Wataru Kakinoki
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
  • Information Patent Application

    Printed circuit board assembly
    • Publication number 20070035938
    • Publication date Feb 15, 2007
    • ARKA TECHNOLOGIES LIMITED
    • Craig Rochford
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electromagnetic shield assembly with opposed hook flanges
    • Publication number 20050219832
    • Publication date Oct 6, 2005
    • Ivan Pawlenko
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    EMI protective elastic plate
    • Publication number 20050023018
    • Publication date Feb 3, 2005
    • Chin-Fu Horng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Structure for fastening a component
    • Publication number 20030218873
    • Publication date Nov 27, 2003
    • Nokia Corporation
    • Marko Eromaki
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Transmitter-receiver unit that ensures mounting of cover
    • Publication number 20010009503
    • Publication date Jul 26, 2001
    • Alps Electric Co., Ltd.
    • Yoshikiyo Watanabe
    • Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...