with selective destruction of conductive paths

Industry

CPC
Y10T29/49156

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49156with selective destruction of conductive paths

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming flexible interconnect circuits
- Patent number 12,035,459
- Issue date Jul 9, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cutting conductive patterns
- Patent number 12,013,643
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electronic module and electronic module
- Patent number 11,716,816
- Issue date Aug 1, 2023
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foil laminate intermediate and method of manufacturing
- Patent number 11,710,886
- Issue date Jul 25, 2023
- AVERY DENNISON RETAIL INFORMATION SERVICES LLC
- Ian J. Forster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated electronic circuit
- Patent number 11,529,524
- Issue date Dec 20, 2022
- Torsten Lehmann
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
System producing a conductive path on a substrate
- Patent number 11,464,114
- Issue date Oct 4, 2022
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting conductive patterns
- Patent number 11,429,028
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods for producing lower electrical isolation in electrochromic...
- Patent number 11,194,211
- Issue date Dec 7, 2021
- Sage Electrochromics, Inc.
- Harvey Kalweit
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible sensors and sensor systems
- Patent number 11,147,510
- Issue date Oct 19, 2021
- BeBop Sensors, Inc.
- Keith A. McMillen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package substrate and flip-chip package circuit including the same
- Patent number 11,081,435
- Issue date Aug 3, 2021
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for optimizing dual track routing
- Patent number 10,776,553
- Issue date Sep 15, 2020
- Cisco Technology, Inc.
- Lin Shen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Foil laminate intermediate and method of manufacturing
- Patent number 10,770,777
- Issue date Sep 8, 2020
- Avery Dennison Corporation
- Ian James Forster
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor apparatus, systems and methods of making same
- Patent number 10,746,684
- Issue date Aug 18, 2020
- Case Western Reserve University
- Pedram Mohseni
- G01 - MEASURING TESTING
Information Patent Grant
Photo sensor for use as a radiation detector and power supply and m...
- Patent number 10,705,228
- Issue date Jul 7, 2020
- Oregon State University
- Steven R. Reese
- G01 - MEASURING TESTING
Information Patent Grant
Electrical leads for medical use
- Patent number 10,668,275
- Issue date Jun 2, 2020
- CATHRX LTD
- Neil L. Anderson
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of manufacturing a touch module
- Patent number 10,664,112
- Issue date May 26, 2020
- BOE Technology Group Co., Ltd.
- Shouzheng Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a circuit board by punching
- Patent number 10,651,320
- Issue date May 12, 2020
- DSM IP Assets B.V.
- Koichi Kumai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing advanced test probes
- Patent number 10,627,427
- Issue date Apr 21, 2020
- Intel Corporation
- Roy E. Swart
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and method for manufacturing the same
- Patent number 10,631,406
- Issue date Apr 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chih-Cheng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of redistribution layer
- Patent number 10,607,856
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Kun-Yung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,595,416
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method producing a conductive path on a substrate
- Patent number 10,537,027
- Issue date Jan 14, 2020
- Orbotech Ltd.
- Zvi Kotler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cutting conductive patterns
- Patent number 10,509,322
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Hsiung Hsu
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Fabrication of vacuum electronic components with self-aligned doubl...
- Patent number 10,483,073
- Issue date Nov 19, 2019
- Elwha LLC
- Andrew T. Koch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for camera module
- Patent number 10,477,084
- Issue date Nov 12, 2019
- Murata Manufacturing Co., Ltd.
- Nobuo Ikemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board
- Patent number 10,462,894
- Issue date Oct 29, 2019
- Force10 Networks, Inc.
- Joel R. Goergen
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board and corresponding method for producing a prin...
- Patent number 10,433,432
- Issue date Oct 1, 2019
- Rohde & Schwarz GmbH & Co. KG
- Uwe Hassel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Insertion loss reduction and increased bonding in a circuit apparatus
- Patent number 10,390,439
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Brian L. Carlson
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Sensor system integrated with a glove
- Patent number 10,362,989
- Issue date Jul 30, 2019
- BeBop Sensors, Inc.
- Keith A. McMillen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Display device and method of manufacturing the same
- Patent number 10,288,962
- Issue date May 14, 2019
- Samsung Display Co., Ltd.
- Yeo Geon Yoon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Interconnect Circuit Methods And Devices
- Publication number 20240276632
- Publication date Aug 15, 2024
- CelLink Corporation
- Kevin Michael Coakley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CUTTING CONDUCTIVE PATTERNS
- Publication number 20220382160
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Hsiung HSU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS FOR PRODUCING LOWER ELECTRICAL ISOLATION IN ELECTROCHROMIC...
- Publication number 20220057686
- Publication date Feb 24, 2022
- SAGE Electrochromics, Inc.
- Harvey KALWEIT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE
- Publication number 20210329788
- Publication date Oct 21, 2021
- IMBERATEK, LLC
- Antti Iihola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Producing a Conductive Path on a Substrate
- Publication number 20210195756
- Publication date Jun 24, 2021
- ORBOTECH LTD.
- Zvi KOTLER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Foil Laminate Intermediate and Method of Manufacturing
- Publication number 20200403291
- Publication date Dec 24, 2020
- Avery Dennison Retail Information Services, LLC
- Ian J. FORSTER
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF CUTTING CONDUCTIVE PATTERNS
- Publication number 20200081348
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Chin-Hsiung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING
- Publication number 20190288127
- Publication date Sep 19, 2019
- DSM IP Assets, B.V.
- Koichi KUMAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED ELECTRONIC CIRCUIT
- Publication number 20180256900
- Publication date Sep 13, 2018
- Torsten Lehmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR APPARATUS, SYSTEMS AND METHODS OF MAKING SAME
- Publication number 20180259473
- Publication date Sep 13, 2018
- Case Western Reserve University
- Pedram Mohseni
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME
- Publication number 20180122734
- Publication date May 3, 2018
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Che-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS
- Publication number 20180103548
- Publication date Apr 12, 2018
- International Business Machines Corporation
- Brian L. Carlson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER ULTRA THIN SUBSTRATE
- Publication number 20180082858
- Publication date Mar 22, 2018
- Apple Inc.
- Jun Chung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING ADVANCED TEST PROBES
- Publication number 20180045760
- Publication date Feb 15, 2018
- Intel Corporation
- Roy E. SWART
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of making a test sensor
- Publication number 20170269020
- Publication date Sep 21, 2017
- Abbott Diabetes Care Inc.
- Yi Wang
- G01 - MEASURING TESTING
Information Patent Application
REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS
- Publication number 20170257975
- Publication date Sep 7, 2017
- HONEYWELL INTERNATIONAL INC.
- Peter Charles Strickland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the Production of a Circuit Board Involving the Removal...
- Publication number 20140373350
- Publication date Dec 25, 2014
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and Device of Manufacturing Printed Circuit Board
- Publication number 20140345913
- Publication date Nov 27, 2014
- Yeong Uk Seo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING A PACKAGE SUBSTRATE
- Publication number 20140331493
- Publication date Nov 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hyo Bin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for the Production of a Circuit Board involving the Removal...
- Publication number 20140331494
- Publication date Nov 13, 2014
- Markus Leitgeb
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT SUBSTRATE, SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATIN...
- Publication number 20140293547
- Publication date Oct 2, 2014
- VIA TECHNOLOGIES, INC.
- Chen-Yueh Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME
- Publication number 20140291385
- Publication date Oct 2, 2014
- Hiromasa KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD OF MANUFACT...
- Publication number 20140285976
- Publication date Sep 25, 2014
- SEIKO EPSON CORPORATION
- Tomonaga Kobayashi
- G01 - MEASURING TESTING
Information Patent Application
CIRCUITRY WITH HIGH ASPECT RATIO TRACES
- Publication number 20140262444
- Publication date Sep 18, 2014
- George Gregoire
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Connection Component with Posts and Pads
- Publication number 20140262460
- Publication date Sep 18, 2014
- Tessera, Inc.
- YOICHI KUBOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DEVICE HAVING VARIABLE GAP WIDTH AND METHOD OF MANUFACTURE
- Publication number 20140260616
- Publication date Sep 18, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Andrew C. McNeil
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF CUTTING CONDUCTIVE PATTERNS
- Publication number 20140259658
- Publication date Sep 18, 2014
- Chin-Hsiung HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TWO-STAGE POWER DELIVERY ARCHITECTURE
- Publication number 20140268615
- Publication date Sep 18, 2014
- QUALCOMM Incorporated
- Changhan Yun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grounding device for a battery of a vehicle
- Publication number 20140227917
- Publication date Aug 14, 2014
- Intercable GmbH
- Marco UNTERHALT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTHEAD ASSEMBLY INCORPORATING INK DISTRIBUTION ASSEMBLY
- Publication number 20140218447
- Publication date Aug 7, 2014
- ZAMTEC LIMITED
- Kia Silverbrook
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

with selective destruction of conductive paths

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods of forming flexible interconnect circuits

Method of cutting conductive patterns

Method for manufacturing an electronic module and electronic module

Foil laminate intermediate and method of manufacturing

Encapsulated electronic circuit

System producing a conductive path on a substrate

Method of cutting conductive patterns

Methods for producing lower electrical isolation in electrochromic...

Flexible sensors and sensor systems

Package substrate and flip-chip package circuit including the same

Techniques for optimizing dual track routing

Foil laminate intermediate and method of manufacturing

Sensor apparatus, systems and methods of making same

Photo sensor for use as a radiation detector and power supply and m...

Electrical leads for medical use

Method of manufacturing a touch module

Method of manufacturing a circuit board by punching

Manufacturing advanced test probes

Substrate structure and method for manufacturing the same

Manufacturing method of redistribution layer

Insertion loss reduction and increased bonding in a circuit apparatus

Method producing a conductive path on a substrate

Method of cutting conductive patterns

Fabrication of vacuum electronic components with self-aligned doubl...

Manufacturing method for camera module

Circuit board

Printed circuit board and corresponding method for producing a prin...

Insertion loss reduction and increased bonding in a circuit apparatus

Sensor system integrated with a glove

Display device and method of manufacturing the same

Patents Applicationslast 30 patents

Interconnect Circuit Methods And Devices

METHOD OF CUTTING CONDUCTIVE PATTERNS

METHODS FOR PRODUCING LOWER ELECTRICAL ISOLATION IN ELECTROCHROMIC...

METHOD FOR MANUFACTURING AN ELECTRONIC MODULE AND ELECTRONIC MODULE

System Producing a Conductive Path on a Substrate

Foil Laminate Intermediate and Method of Manufacturing

METHOD OF CUTTING CONDUCTIVE PATTERNS

METHOD OF MANUFACTURING A CIRCUIT BOARD BY PUNCHING

ENCAPSULATED ELECTRONIC CIRCUIT

SENSOR APPARATUS, SYSTEMS AND METHODS OF MAKING SAME

PACKAGE SUBSTRATE AND FLIP-CHIP PACKAGE CIRCUIT INCLUDING THE SAME

INSERTION LOSS REDUCTION AND INCREASED BONDING IN A CIRCUIT APPARATUS

CARRIER ULTRA THIN SUBSTRATE

MANUFACTURING ADVANCED TEST PROBES

Methods of making a test sensor

REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS

Method for the Production of a Circuit Board Involving the Removal...

Method and Device of Manufacturing Printed Circuit Board

METHOD OF FABRICATING A PACKAGE SUBSTRATE

Method for the Production of a Circuit Board involving the Removal...

CIRCUIT SUBSTRATE, SEMICONDUCTOR PACKAGE AND PROCESS FOR FABRICATIN...

CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME

MODULE, ELECTRONIC APPARATUS, MOVING OBJECT, AND METHOD OF MANUFACT...

CIRCUITRY WITH HIGH ASPECT RATIO TRACES

Connection Component with Posts and Pads

MEMS DEVICE HAVING VARIABLE GAP WIDTH AND METHOD OF MANUFACTURE

METHOD OF CUTTING CONDUCTIVE PATTERNS

TWO-STAGE POWER DELIVERY ARCHITECTURE

Grounding device for a battery of a vehicle

PRINTHEAD ASSEMBLY INCORPORATING INK DISTRIBUTION ASSEMBLY