with separation/delamination along a porous layer

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H01L21/76259

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/76259with separation/delamination along a porous layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for producing a layer of solid material
- Patent number 11,699,616
- Issue date Jul 11, 2023
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for preparing the remainder of a donor substrate, substrate...
- Patent number 11,542,155
- Issue date Jan 3, 2023
- Soitec
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Removable structure and removal method using the structure
- Patent number 11,424,156
- Issue date Aug 23, 2022
- Soitec
- Didier Landru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer production method
- Patent number 11,004,723
- Issue date May 11, 2021
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip, semiconductor wafer and method for manufacturin...
- Patent number 10,985,050
- Issue date Apr 20, 2021
- DYNAX SEMICONDUCTOR, INC.
- Naiqian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable support substrate for formation and transfer of semiconduc...
- Patent number 10,910,272
- Issue date Feb 2, 2021
- SanDisk Technologies LLC
- Fei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined wafer production method with a multi-component receiving l...
- Patent number 10,707,068
- Issue date Jul 7, 2020
- Siltectra GmbH
- Jan Richter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor structure with temporary d...
- Patent number 10,643,884
- Issue date May 5, 2020
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Elodie Beche
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Combined wafer production method with laser treatment and temperatu...
- Patent number 10,593,590
- Issue date Mar 17, 2020
- Siltectra GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming strained-semiconductor-on-insulator device struc...
- Patent number 10,510,581
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas A. Langdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combined wafer production method with laser treatment and temperatu...
- Patent number 10,312,135
- Issue date Jun 4, 2019
- Siltectra, GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for processing a 3D semiconductor device
- Patent number 10,297,586
- Issue date May 21, 2019
- Monolithic 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device structures
- Patent number 10,050,145
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anthony J. Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of a stack of electronic devices
- Patent number 9,997,395
- Issue date Jun 12, 2018
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Claire Fenouillet-Beranger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a layer structure having partially sealed p...
- Patent number 9,929,111
- Issue date Mar 27, 2018
- Infineon Technologies AG
- Martin Mischitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for laser splitting and device layer transfer
- Patent number 9,929,054
- Issue date Mar 27, 2018
- Takao Yonehara
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,728,441
- Issue date Aug 8, 2017
- Fuji Electric Co., Ltd.
- Masaaki Tachioka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate peeling apparatus and method of fabricating device using...
- Patent number 9,688,062
- Issue date Jun 27, 2017
- Samsung Display Co., Ltd.
- Yukinori Asakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinning in package using separation structure as stop
- Patent number 9,627,287
- Issue date Apr 18, 2017
- Infineon Technologies AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor device structures
- Patent number 9,601,623
- Issue date Mar 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anthony J. Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming strained-semiconductor-on-insulator device struc...
- Patent number 9,548,236
- Issue date Jan 17, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas A. Langdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing piezoelectric device with a composite piez...
- Patent number 9,508,918
- Issue date Nov 29, 2016
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing flexible piezoelectric structures
- Patent number 9,502,638
- Issue date Nov 22, 2016
- The Trustees of Princeton University
- Michael C. McAlpine
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method of implantation for fragilization of substrates
- Patent number 9,425,081
- Issue date Aug 23, 2016
- SOITEC
- Nadia Ben Mohamed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor substrate, and method for...
- Patent number 9,406,551
- Issue date Aug 2, 2016
- Infineon Technologies Austria AG
- Wolfgang Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasing apparatus for separating a semiconductor substrate from a...
- Patent number 9,397,250
- Issue date Jul 19, 2016
- Solexel, Inc.
- Mehrdad M. Moslehi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for separating semiconductor devices using nanoporous structure
- Patent number 9,356,187
- Issue date May 31, 2016
- SEOUL VIOSYS CO., LTD.
- Sang Wan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of detaching a layer
- Patent number 9,275,893
- Issue date Mar 1, 2016
- Soitec
- Alexandre Barthelemy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI wafer, manufacturing method therefor, and MEMS device
- Patent number 9,266,715
- Issue date Feb 23, 2016
- Mitsubishi Electric Corporation
- Eiji Yoshikawa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for manufacturing a multilayer structure on a substrate
- Patent number 9,230,850
- Issue date Jan 5, 2016
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Umberto Rossini
- C30 - CRYSTAL GROWTH

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING...
- Publication number 20240304494
- Publication date Sep 12, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...
- Publication number 20240297078
- Publication date Sep 5, 2024
- KIOXIA Corporation
- Mariko SUMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20230307286
- Publication date Sep 28, 2023
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...
- Publication number 20230073003
- Publication date Mar 9, 2023
- SOITEC
- Charlotte Drazek
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20210296119
- Publication date Sep 23, 2021
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Producing a Layer of Solid Material
- Publication number 20210225694
- Publication date Jul 22, 2021
- SILTECTRA GMBH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer Production Method
- Publication number 20200185267
- Publication date Jun 11, 2020
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Combined wafer production method with laser treatment and temperatu...
- Publication number 20190237359
- Publication date Aug 1, 2019
- Siltectra, GmbH
- Wolfram Drescher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND STRUCTURE WITH THERMAL ISOLATION
- Publication number 20190057959
- Publication date Feb 21, 2019
- MonolithIC 3D Inc.
- Zvi Or-Bach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINED WAFER PRODUCTION METHOD WITH A MULTI-COMPONENT RECEIVING L...
- Publication number 20180233347
- Publication date Aug 16, 2018
- SILTECTRA GMBH
- Richter Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURIN...
- Publication number 20180182663
- Publication date Jun 28, 2018
- Dynax Semiconductor, Inc.
- Naiqian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS SEMICONDUCTOR LAYER TRANSFER FOR AN INTEGRATED CIRCUIT STRUC...
- Publication number 20180068886
- Publication date Mar 8, 2018
- QUALCOMM Incorporated
- Richard HAMMOND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES
- Publication number 20170352583
- Publication date Dec 7, 2017
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Claire FENOUILLET-BERANGER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Semiconductor Device Structures
- Publication number 20170179285
- Publication date Jun 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Anthony J. Lochtefeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETACHING A LAYER
- Publication number 20150243551
- Publication date Aug 27, 2015
- SOITEC
- Alexandre Barthelemy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED SUBSTRATES HAVING MECHANICALLY WEAK STRUCTURES AND ASSOC...
- Publication number 20150048301
- Publication date Feb 19, 2015
- Micron Technology, Inc.
- Oliver J. Kilbury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE ON A SUBSTRATE
- Publication number 20140363951
- Publication date Dec 11, 2014
- Umberto Rossini
- C30 - CRYSTAL GROWTH
Information Patent Application
DOUBLE LAYER TRANSFER METHOD
- Publication number 20140295642
- Publication date Oct 2, 2014
- Frank Fournel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Strained-Semiconductor-on-Insulator Device Struc...
- Publication number 20140242778
- Publication date Aug 28, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas A. Langdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE
- Publication number 20140175573
- Publication date Jun 26, 2014
- Mitsubishi Electric Corporation
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Manufacturing a Semiconductor Substrate, and Method for...
- Publication number 20140087541
- Publication date Mar 27, 2014
- Wolfgang Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Semiconductor Device Structures
- Publication number 20140051230
- Publication date Feb 20, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Thomas A. Langdo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER
- Publication number 20140038392
- Publication date Feb 6, 2014
- Takao Yonehara
- B42 - BOOKBINDING ALBUMS FILES SPECIAL PRINTED MATTER
Information Patent Application
METHOD FOR PRODUCING THIN LAYERS OF CRYSTALLINE OR POLYCRYSTALLINE...
- Publication number 20130288463
- Publication date Oct 31, 2013
- Mark T. Winkler
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method For Releasing a Thin-Film Substrate
- Publication number 20130280887
- Publication date Oct 24, 2013
- SOLEXEL, INC.
- Rafael Ricolcol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE
- Publication number 20130277675
- Publication date Oct 24, 2013
- Eiji YOSHIKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING GALLIUM NITRIDE SUBSTRATES FOR ELECTRONIC AND...
- Publication number 20130207237
- Publication date Aug 15, 2013
- The Regents of the University of California
- Claude C.A. Weisbuch
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20130143387
- Publication date Jun 6, 2013
- Semiconductor Energy Laboratory Co., Ltd.
- Shunpei Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR THE FABRICATION OF SAME
- Publication number 20120329213
- Publication date Dec 27, 2012
- STMicroelectronics S.r. I.
- Vincenzo VINCIGUERRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PIEZOELECTRIC STRUCTURES AND METHOD OF MAKING SAME
- Publication number 20120312456
- Publication date Dec 13, 2012
- The Trustees of Princeton University
- Michael C. McAlpine
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

with separation/delamination along a porous layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing a layer of solid material

Method for preparing the remainder of a donor substrate, substrate...

Removable structure and removal method using the structure

Wafer production method

Semiconductor chip, semiconductor wafer and method for manufacturin...

Reusable support substrate for formation and transfer of semiconduc...

Combined wafer production method with a multi-component receiving l...

Method for manufacturing a semiconductor structure with temporary d...

Combined wafer production method with laser treatment and temperatu...

Methods of forming strained-semiconductor-on-insulator device struc...

Combined wafer production method with laser treatment and temperatu...

Methods for processing a 3D semiconductor device

Methods for forming semiconductor device structures

Fabrication method of a stack of electronic devices

Method of manufacturing a layer structure having partially sealed p...

Systems and methods for laser splitting and device layer transfer

Method for manufacturing semiconductor device

Substrate peeling apparatus and method of fabricating device using...

Thinning in package using separation structure as stop

Methods for forming semiconductor device structures

Methods of forming strained-semiconductor-on-insulator device struc...

Method for manufacturing piezoelectric device with a composite piez...

Method of manufacturing flexible piezoelectric structures

Method of implantation for fragilization of substrates

Method for manufacturing a semiconductor substrate, and method for...

Releasing apparatus for separating a semiconductor substrate from a...

Method for separating semiconductor devices using nanoporous structure

Method of detaching a layer

SOI wafer, manufacturing method therefor, and MEMS device

Method for manufacturing a multilayer structure on a substrate

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR SEPARATING...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD OF SEPARAT...

Method for Producing a Layer of Solid Material

METHOD FOR PREPARING THE REMAINDER OF A DONOR SUBSTRATE, SUBSTRATE...

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

Method for Producing a Layer of Solid Material

Wafer Production Method

Combined wafer production method with laser treatment and temperatu...

SEMICONDUCTOR DEVICE AND STRUCTURE WITH THERMAL ISOLATION

COMBINED WAFER PRODUCTION METHOD WITH A MULTI-COMPONENT RECEIVING L...

SEMICONDUCTOR CHIP, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURIN...

POROUS SEMICONDUCTOR LAYER TRANSFER FOR AN INTEGRATED CIRCUIT STRUC...

FABRICATION METHOD OF A STACK OF ELECTRONIC DEVICES

Methods for Forming Semiconductor Device Structures

METHOD OF DETACHING A LAYER

ENGINEERED SUBSTRATES HAVING MECHANICALLY WEAK STRUCTURES AND ASSOC...

METHOD FOR MANUFACTURING A MULTILAYER STRUCTURE ON A SUBSTRATE

DOUBLE LAYER TRANSFER METHOD

Methods of Forming Strained-Semiconductor-on-Insulator Device Struc...

SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE

Method for Manufacturing a Semiconductor Substrate, and Method for...

Methods for Forming Semiconductor Device Structures

SYSTEMS AND METHODS FOR LASER SPLITTING AND DEVICE LAYER TRANSFER

METHOD FOR PRODUCING THIN LAYERS OF CRYSTALLINE OR POLYCRYSTALLINE...

Method For Releasing a Thin-Film Substrate

SOI WAFER, MANUFACTURING METHOD THEREFOR, AND MEMS DEVICE

METHOD FOR PRODUCING GALLIUM NITRIDE SUBSTRATES FOR ELECTRONIC AND...

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

FLEXIBLE ELECTRONIC DEVICE AND METHOD FOR THE FABRICATION OF SAME

FLEXIBLE PIEZOELECTRIC STRUCTURES AND METHOD OF MAKING SAME