with spring contact pieces

Industry

CPC
H05K7/1038

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

Current Industry

H05K7/1038with spring contact pieces

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component
- Patent number 10,560,066
- Issue date Feb 11, 2020
- Murata Manufacturing Co., Ltd.
- Kosuke Ishida
- B32 - LAYERED PRODUCTS
Information Patent Grant
Socket receiving an electronic component having a plurality of cont...
- Patent number 10,483,666
- Issue date Nov 19, 2019
- Tyco Electronics Japan G.K.
- Hidenori Taguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device, system and method for providing zone-based configuration of...
- Patent number 10,278,302
- Issue date Apr 30, 2019
- Intel Corporation
- Anne M. Sepic
- G01 - MEASURING TESTING
Information Patent Grant
Reusable electronic circuit assembling and testing system and uses...
- Patent number 8,991,040
- Issue date Mar 31, 2015
- 5eTek, LLC
- Erli Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket for electronic module
- Patent number 7,029,308
- Issue date Apr 18, 2006
- Hirose Electric Co., Ltd.
- Shuntaro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electric connector having elastic pins
- Patent number 6,764,317
- Issue date Jul 20, 2004
- Chou Hsuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC socket with two point-contacts
- Patent number 6,540,537
- Issue date Apr 1, 2003
- Yamaichi Electronics Co., Ltd.
- Nobuo Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular support and casing for electrical and electronic circuit co...
- Patent number 6,459,587
- Issue date Oct 1, 2002
- Eric K. D. Chan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket having a staggered conductive path through multiple memory m...
- Patent number 5,788,510
- Issue date Aug 4, 1998
- The Whitaker Corporation
- Kevin Eugene Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting CPU heat dissipator
- Patent number 5,651,688
- Issue date Jul 29, 1997
- Chuen-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reusable vibration resistant integrated circuit mounting socket
- Patent number 5,445,532
- Issue date Aug 29, 1995
- The United States of America as represented by the United States Department o...
- Craig N. Evans
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC accommodation apparatus having retaining latches
- Patent number 5,373,938
- Issue date Dec 20, 1994
- Yamaichi Electric Co., Ltd.
- Masaaki Kubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socket
- Patent number 5,318,456
- Issue date Jun 7, 1994
- Texas Instruments Incorporated
- Ikuo Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Supportable contact and chip carrier socket for use with an assembl...
- Patent number 5,295,841
- Issue date Mar 22, 1994
- The Whitaker Corporation
- Dimitry Grabbe
- G01 - MEASURING TESTING
Information Patent Grant
Gull wing IC carrier/socket system
- Patent number 5,266,037
- Issue date Nov 30, 1993
- Precision Connector Designs, Inc.
- Kurt C. Hetzel
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electroplated contact with insulating material
- Patent number 5,169,321
- Issue date Dec 8, 1992
- Yamaichi Electric Co., Ltd.
- Noriyuki Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket for testing a plug-in type semiconductor
- Patent number 5,170,117
- Issue date Dec 8, 1992
- Chuy-Nan Chio
- G01 - MEASURING TESTING
Information Patent Grant
Reactive base for cantilevered connector
- Patent number 5,161,982
- Issue date Nov 10, 1992
- Teledyne Kinetics
- Thomas E. Mowry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal latch for SIMM socket
- Patent number 5,161,995
- Issue date Nov 10, 1992
- Molex Incorporated
- Patrick D. Bakke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal latch for SIMM socket
- Patent number 5,094,624
- Issue date Mar 10, 1992
- Molex Incorporated
- Patrick D. Bakke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Terminal piece sealing structure
- Patent number 5,090,919
- Issue date Feb 25, 1992
- Omron Corporation
- Hideaki Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC holder
- Patent number 5,067,911
- Issue date Nov 26, 1991
- Seikosha Co., Ltd.
- Toshiro Saeki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for an electric part
- Patent number 5,017,154
- Issue date May 21, 1991
- Yamaichi Electric Mfg. Co., Ltd.
- Noriyuki Matsuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5004429
- Patent number 5,004,429
- Issue date Apr 2, 1991
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelement and base assembly
- Patent number 4,943,891
- Issue date Jul 24, 1990
- Alan Ouellette
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector
- Patent number 4,907,976
- Issue date Mar 13, 1990
- Killy Corporation
- Peter Killcommons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket, connection system and method of making
- Patent number 4,902,235
- Issue date Feb 20, 1990
- Texas Instruments Incorporated
- Takashi Tonooka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC socket
- Patent number 4,887,969
- Issue date Dec 19, 1989
- Yamaichi Electric Mfg. Co., Ltd.
- Shunji Abe
- G01 - MEASURING TESTING
Information Patent Grant
Bottom loaded I.C. socket
- Patent number 4,828,515
- Issue date May 9, 1989
- Augat Inc.
- Ronald Senor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier and header assembly and terminals therefor
- Patent number 4,826,440
- Issue date May 2, 1989
- Molex Incorporated
- Edward J. Plocek
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE
- Publication number 20230046581
- Publication date Feb 16, 2023
- Xiang Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC COMPONENT
- Publication number 20180061670
- Publication date Mar 1, 2018
- MURATA MANUFACTURING CO., LTD.
- Kosuke ISHIDA
- B32 - LAYERED PRODUCTS
Information Patent Application
DIP SOCKET
- Publication number 20140073177
- Publication date Mar 13, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kang Hyun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reusable electronic circuit assembling and testing system and uses...
- Publication number 20120317801
- Publication date Dec 20, 2012
- Erli Chen
- G01 - MEASURING TESTING
Information Patent Application
Socket for electronic module
- Publication number 20050239302
- Publication date Oct 27, 2005
- Shuntaro Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electric connector having elastic pins
- Publication number 20030096518
- Publication date May 22, 2003
- Chou Hsuan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC SOCKET WITH TWO POINT-CONTACTS
- Publication number 20030073355
- Publication date Apr 17, 2003
- Yamaichi Electronics Co.
- Nobuo Kawamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

with spring contact pieces

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic component

Socket receiving an electronic component having a plurality of cont...

Device, system and method for providing zone-based configuration of...

Reusable electronic circuit assembling and testing system and uses...

Socket for electronic module

Electric connector having elastic pins

IC socket with two point-contacts

Modular support and casing for electrical and electronic circuit co...

Socket having a staggered conductive path through multiple memory m...

Apparatus for mounting CPU heat dissipator

Reusable vibration resistant integrated circuit mounting socket

IC accommodation apparatus having retaining latches

Socket

Supportable contact and chip carrier socket for use with an assembl...

Gull wing IC carrier/socket system

Electroplated contact with insulating material

Socket for testing a plug-in type semiconductor

Reactive base for cantilevered connector

Metal latch for SIMM socket

Metal latch for SIMM socket

Terminal piece sealing structure

IC holder

Connector for an electric part

5004429

Microelement and base assembly

Connector

Socket, connection system and method of making

IC socket

Bottom loaded I.C. socket

Chip carrier and header assembly and terminals therefor

Patents Applicationslast 30 patents

LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE

ELECTRONIC COMPONENT

DIP SOCKET

Reusable electronic circuit assembling and testing system and uses...

Socket for electronic module

Electric connector having elastic pins

IC SOCKET WITH TWO POINT-CONTACTS