within sub-racks for removing heat from electronic boards

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H05K7/20672

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K7/00Constructional details common to different types of electric apparatus

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H05K7/20672within sub-racks for removing heat from electronic boards

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Patents Grantslast 30 patents

Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 12,274,036
- Issue date Apr 8, 2025
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 12,150,279
- Issue date Nov 19, 2024
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Container for one or more electronic devices and methods of use the...
- Patent number 12,120,847
- Issue date Oct 15, 2024
- Engendren LLC
- Alan Paul Meissner
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Systems and methods for electronics cooling
- Patent number 11,895,805
- Issue date Feb 6, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,612,079
- Issue date Mar 21, 2023
- MARVELL ASIA PTE. LTD.
- Radhakrishnan L. Nagarajan
- G02 - OPTICS
Information Patent Grant
Thermal management for modular electronic devices
- Patent number 11,573,054
- Issue date Feb 7, 2023
- CommScope Technologies LLC
- Kevin E. Craig
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Housing structure for electronic boards
- Patent number 11,324,136
- Issue date May 3, 2022
- Eurotech S.p.A.
- Mauro Rossi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Phase change cooling system and electronic device
- Patent number 11,262,136
- Issue date Mar 1, 2022
- NEC Corporation
- Mahiro Hachiya
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 11,109,517
- Issue date Aug 31, 2021
- Google LLC
- Soheil Farshchian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Heatsink for co-packaged optical switch rack package
- Patent number 11,109,515
- Issue date Aug 31, 2021
- Inphi Corporation
- Radhakrishnan L. Nagarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system with floating cold plate with single pipes
- Patent number 10,959,352
- Issue date Mar 23, 2021
- Quanta Computer Inc.
- Chao-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensors for cooling system fluid attributes
- Patent number 10,871,481
- Issue date Dec 22, 2020
- Hewlett Packard Enterprise Development LP
- Anita Rogacs
- F01 - MACHINES OR ENGINES IN GENERAL ENGINE PLANTS IN GENERAL STEAM ENGINES
Information Patent Grant
Cooling device
- Patent number 10,845,127
- Issue date Nov 24, 2020
- Kabushiki Kaisha Toshiba
- Kensuke Aoki
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Flexible thermal cooling assembly
- Patent number 10,721,842
- Issue date Jul 21, 2020
- Hewlett Packard Enterprise Development LP
- Nabeel Fathi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for using additive manufacturing for thermal ma...
- Patent number 10,660,236
- Issue date May 19, 2020
- General Electric Company
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Two-phase fluid-actuated cooling device, system, and method
- Patent number 10,602,635
- Issue date Mar 24, 2020
- Lockheed Martin Corporation
- John Ditri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat-pipe heat dissipation system and power device
- Patent number 10,470,339
- Issue date Nov 5, 2019
- Huawei Technologies Co., Ltd.
- Yaofeng Peng
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling electronic devices in a data center
- Patent number 10,448,543
- Issue date Oct 15, 2019
- Google LLC
- Soheil Farshchian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Server thermal management with heat pipes
- Patent number 10,365,046
- Issue date Jul 30, 2019
- Intel Corporation
- Henry C. Bosak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System and method for thermal management using vapor chamber
- Patent number 10,356,945
- Issue date Jul 16, 2019
- General Electric Company
- Brian Rush
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermosiphon systems for electronic devices
- Patent number 10,225,959
- Issue date Mar 5, 2019
- Google LLC
- Jeremy Rice
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Removable board with cooling system for chassis-based electronic eq...
- Patent number 10,201,114
- Issue date Feb 5, 2019
- Juniper Networks, Inc.
- Boris Reynov
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management systems and methods for heat generating electronics
- Patent number 10,136,557
- Issue date Nov 20, 2018
- General Electric Company
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronics rack with selective engagement of heat sink
- Patent number 10,136,556
- Issue date Nov 20, 2018
- Thermal Corp.
- Walter John Bilski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stationary cooling structure for board/chassis-level conduction coo...
- Patent number 10,117,357
- Issue date Oct 30, 2018
- FutureWei Technologies, Inc.
- Mo Bai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface card cooling using heat pipes
- Patent number 10,091,911
- Issue date Oct 2, 2018
- Infinera Corporation
- Matthew J. Kelty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated card rail and cooling module for embedded computing systems
- Patent number 9,999,156
- Issue date Jun 12, 2018
- General Dynamics MIssion Systems, Inc.
- Michael M. Holahan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for cooling equipment provided with electronic bo...
- Patent number 9,949,403
- Issue date Apr 17, 2018
- Airbus Operations SAS
- Louis Rouch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wickless heat pipe and thermal ground plane
- Patent number 9,921,003
- Issue date Mar 20, 2018
- Lockheed Martin Corporation
- Robert J. Monson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Reusable phase-change thermal interface structures
- Patent number 9,826,662
- Issue date Nov 21, 2017
- General Electric Company
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20250048594
- Publication date Feb 6, 2025
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
TWO-PHASE IMMERSION COOLING SYSTEM
- Publication number 20250024638
- Publication date Jan 16, 2025
- Vertiv Corporation
- Russell Tipton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTRONICS COOLING
- Publication number 20240107710
- Publication date Mar 28, 2024
- Eagle Technology, LLC
- Donald S. George
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20230225090
- Publication date Jul 13, 2023
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE
- Publication number 20210385975
- Publication date Dec 9, 2021
- Marvell Asia Pte, Ltd.
- Radhakrishnan L. NAGARAJAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SERVER HEAT DISSIPATION STRUCTURE
- Publication number 20210212238
- Publication date Jul 8, 2021
- Inventec (Pudong) Technology Corporation
- Guang-Zhao TIAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HOUSING STRUCTURE FOR ELECTRONIC BOARDS
- Publication number 20210051813
- Publication date Feb 18, 2021
- EUROTECH SPA
- Mauro ROSSI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...
- Publication number 20200281095
- Publication date Sep 3, 2020
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING ELECTRONIC DEVICES IN A DATA CENTER
- Publication number 20200015387
- Publication date Jan 9, 2020
- Google LLC
- Soheil Farshchian
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SERVER THERMAL MANAGEMENT WITH HEAT PIPES
- Publication number 20190293361
- Publication date Sep 26, 2019
- Intel Corporation
- Henry C. Bosak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SENSORS FOR COOLING SYSTEM FLUID ATTRIBUTES
- Publication number 20180017538
- Publication date Jan 18, 2018
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Anita Rogacs
- G01 - MEASURING TESTING
Information Patent Application
HEAT RELAY NETWORK SYSTEM FOR TELECOMMUNICATION EQUIPMENT
- Publication number 20170196123
- Publication date Jul 6, 2017
- Infinera Corp.
- Matthew James Kelty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosiphon Systems for Electronic Devices
- Publication number 20140268548
- Publication date Sep 18, 2014
- Google Inc.
- Jeremy Rice
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
SERVER AND METHOD FOR COOLING A SERVER
- Publication number 20140233177
- Publication date Aug 21, 2014
- FUJITSU TECHNOLOGY SOLUTIONS INTELLECTUAL PROPERTY GMBH
- Wilfried Weidner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INTERFACE CARD COOLING UISNG HEAT PIPES
- Publication number 20140160679
- Publication date Jun 12, 2014
- Infinera Corporation
- Matthew J. KELTY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING AN ELECTRONIC DEVICE
- Publication number 20130322024
- Publication date Dec 5, 2013
- THALES
- Christian Tantolin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WICKLESS HEAT PIPE AND THERMAL GROUND PLANE
- Publication number 20130186601
- Publication date Jul 25, 2013
- Lockheed Martin Corporation
- Robert J. Monson
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMOSIPHON COOLER ARRANGEMENT IN MODULES WITH ELECTRIC AND/OR ELE...
- Publication number 20130107455
- Publication date May 2, 2013
- ABB TECHNOLOGY AG
- Didier Cottet
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT
- Publication number 20130104592
- Publication date May 2, 2013
- ABB TECHNOLOGY AG
- Didier COTTET
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS
- Publication number 20120281359
- Publication date Nov 8, 2012
- Alcatel-Lucent
- Susanne Arney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermosiphon Systems for Electronic Devices
- Publication number 20120268877
- Publication date Oct 25, 2012
- Jeremy Rice
- F25 - REFRIGERATION OR COOLING COMBINED HEATING AND REFRIGERATION SYSTEMS HEA...
Information Patent Application
DEVICE FOR COOLING AN ELECTRONIC CARD BY CONDUCTION COMPRISING HEAT...
- Publication number 20110182033
- Publication date Jul 28, 2011
- THALES
- Serge Tissot
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS
- Publication number 20110149518
- Publication date Jun 23, 2011
- Alcatel-Lucent USA Inc.
- Todd R. Salamon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY
- Publication number 20110141692
- Publication date Jun 16, 2011
- Jeff Bult
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE FOR COMMUNICATION CHASSIS
- Publication number 20100296250
- Publication date Nov 25, 2010
- Chiu-Mao Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC HOUSING WITH ELECTRONIC BOARDS COMPRISING HEAT PIPES
- Publication number 20100002395
- Publication date Jan 7, 2010
- THALES
- Pierre Bertrou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC EQUIPMENT HOUSING COOLED BY NATURAL AND FORCED VENTILATION
- Publication number 20090318071
- Publication date Dec 24, 2009
- Gérard Nemoz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL TRANSFER TECHNIQUE USING HEAT PIPES WITH INTEGRAL RACK RAILS
- Publication number 20090284924
- Publication date Nov 19, 2009
- SUN MICROSYSTEMS, INC.
- Michael V. Konshak
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method and system for dissipating thermal energy from conduction-co...
- Publication number 20080218980
- Publication date Sep 11, 2008
- Tracewell Systems, Inc.
- Matthew S. Tracewell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid cooled electronic chassis having a plurality of phase change...
- Publication number 20080084666
- Publication date Apr 10, 2008
- Honeywell International, Inc.
- Kenyon Kehl
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

within sub-racks for removing heat from electronic boards

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Heatsink for co-packaged optical switch rack package

Systems and methods for using additive manufacturing for thermal ma...

Container for one or more electronic devices and methods of use the...

Systems and methods for electronics cooling

Heatsink for co-packaged optical switch rack package

Thermal management for modular electronic devices

Housing structure for electronic boards

Phase change cooling system and electronic device

Cooling electronic devices in a data center

Heatsink for co-packaged optical switch rack package

Cooling system with floating cold plate with single pipes

Sensors for cooling system fluid attributes

Cooling device

Flexible thermal cooling assembly

Systems and methods for using additive manufacturing for thermal ma...

Two-phase fluid-actuated cooling device, system, and method

Heat-pipe heat dissipation system and power device

Cooling electronic devices in a data center

Server thermal management with heat pipes

System and method for thermal management using vapor chamber

Thermosiphon systems for electronic devices

Removable board with cooling system for chassis-based electronic eq...

Thermal management systems and methods for heat generating electronics

Electronics rack with selective engagement of heat sink

Stationary cooling structure for board/chassis-level conduction coo...

Interface card cooling using heat pipes

Integrated card rail and cooling module for embedded computing systems

Method and device for cooling equipment provided with electronic bo...

Wickless heat pipe and thermal ground plane

Reusable phase-change thermal interface structures

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

TWO-PHASE IMMERSION COOLING SYSTEM

SYSTEMS AND METHODS FOR ELECTRONICS COOLING

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

HEATSINK FOR CO-PACKAGED OPTICAL SWITCH RACK PACKAGE

SERVER HEAT DISSIPATION STRUCTURE

HOUSING STRUCTURE FOR ELECTRONIC BOARDS

SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MA...

COOLING ELECTRONIC DEVICES IN A DATA CENTER

SERVER THERMAL MANAGEMENT WITH HEAT PIPES

SENSORS FOR COOLING SYSTEM FLUID ATTRIBUTES

HEAT RELAY NETWORK SYSTEM FOR TELECOMMUNICATION EQUIPMENT

Thermosiphon Systems for Electronic Devices

SERVER AND METHOD FOR COOLING A SERVER

INTERFACE CARD COOLING UISNG HEAT PIPES

COOLING AN ELECTRONIC DEVICE

WICKLESS HEAT PIPE AND THERMAL GROUND PLANE

THERMOSIPHON COOLER ARRANGEMENT IN MODULES WITH ELECTRIC AND/OR ELE...

CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT

MECHANICALLY-REATTACHABLE LIQUID-COOLED COOLING APPARATUS

Thermosiphon Systems for Electronic Devices

DEVICE FOR COOLING AN ELECTRONIC CARD BY CONDUCTION COMPRISING HEAT...

HEAT-TRANSFER ARRANGEMENT FOR ENCLOSED CIRCUIT BOARDS

CONDUCTION COOLED CIRCUIT BOARD ASSEMBLY

HEAT DISSIPATION DEVICE FOR COMMUNICATION CHASSIS

ELECTRONIC HOUSING WITH ELECTRONIC BOARDS COMPRISING HEAT PIPES

ELECTRONIC EQUIPMENT HOUSING COOLED BY NATURAL AND FORCED VENTILATION

THERMAL TRANSFER TECHNIQUE USING HEAT PIPES WITH INTEGRAL RACK RAILS

Method and system for dissipating thermal energy from conduction-co...

Liquid cooled electronic chassis having a plurality of phase change...