1523401

Information

• Patent Grant
• 1523401

• References
• Source

• Patent Number

  1,523,401

• Date Filed

  Not available

• Date Issued

  Tuesday, January 20, 1925
  99 years ago

• CPC

  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L23/10 - characterised by the material or arrangement of seals between parts,ween cap
  • H01L24/00 - Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
  • H01L2924/12037 - Cat's whisker diode
  • Y10T403/459 - Helical spring type coupling

• US Classifications

  • 257 - Active solid-state devices
  • 403 - Joints and connections