characterised by the material or arrangement of seals between parts,ween cap

Industry

CPC
H01L23/10

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/10characterised by the material or arrangement of seals between parts,ween cap

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including liquid alloy thermal interface material...
- Patent number 12,255,119
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,255,620
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Toru Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,249,545
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for an integrated circuit and manufacturing method
- Patent number 12,249,549
- Issue date Mar 11, 2025
- STMicroelectronics (Grenoble 2) SAS
- Jerome Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor chip
- Patent number 12,243,831
- Issue date Mar 4, 2025
- JVCKENWOOD CORPORATION
- Takayuki Iwasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inverter device
- Patent number 12,243,790
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Yosuke Miyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,211,762
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Yun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,207,467
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Bong Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,651
- Issue date Dec 31, 2024
- Amkor Technology Japan, Inc.
- Masao Hirobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device
- Patent number 12,185,563
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- Sungsoo Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Laser module
- Patent number 12,184,034
- Issue date Dec 31, 2024
- Sumitomo Electric Industries, Ltd.
- Yohei Enya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure for semiconductor device and the method thereof
- Patent number 12,170,235
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,148,680
- Issue date Nov 19, 2024
- Renesas Electronics Corporation
- Toshihiko Akiba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, power conversion apparatus, and manufacturing...
- Patent number 12,142,540
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Masayuki Mafune
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,136,575
- Issue date Nov 5, 2024
- Mitsubishi Electric Corporation
- Tomohiro Maegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 12,131,969
- Issue date Oct 29, 2024
- Mitsubishi Electric Corporation
- Hiroya Sannai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,125,756
- Issue date Oct 22, 2024
- Fuji Electric Co., Ltd.
- Yuko Nakamata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed lid and ring designs and lid local peripheral reinforcemen...
- Patent number 12,119,275
- Issue date Oct 15, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,119,281
- Issue date Oct 15, 2024
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,107,024
- Issue date Oct 1, 2024
- Mitsubishi Electric Corporation
- Takayuki Onaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Array substrate, display, and terminal device
- Patent number 12,100,715
- Issue date Sep 24, 2024
- Huawei Technologies Co., Ltd.
- Huajun Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with free-floating packaging concept
- Patent number 12,094,791
- Issue date Sep 17, 2024
- HITACHI ENERGY LTD
- Jagoda Dobrzynska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a deformable flow blocking mem...
- Patent number 12,094,798
- Issue date Sep 17, 2024
- Mitsubishi Electric Corporation
- Hiroshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...
- Publication number 20250069964
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE
- Publication number 20250046720
- Publication date Feb 6, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Metal Packaging Structure For Chip Heat Dissipation
- Publication number 20250038065
- Publication date Jan 30, 2025
- YUNNAN ZHONGXUAN LIQUID METAL TECHNOLOGY CO.,LTD
- Changli CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE ESTER RESIN
- Publication number 20250026883
- Publication date Jan 23, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Customized heat dissipation from different types of integrated circ...
- Publication number 20250029888
- Publication date Jan 23, 2025
- Marvell Asia Pte Ltd.
- Carl E. Benes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Alignment Mark
- Publication number 20250029880
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COVER MEMBER, DOUBLE-SIDED ADHESIVE SHEET, SEAL MEMBER, AND SHEET F...
- Publication number 20250018684
- Publication date Jan 16, 2025
- Nitto Denko Corporation
- Kyoko ISHII
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...
- Publication number 20250008637
- Publication date Jan 2, 2025
- Casey Jamesen Carte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE
- Publication number 20250006565
- Publication date Jan 2, 2025
- Kyocera Corporation
- Tomoya TABUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429115
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...
- Publication number 20240413025
- Publication date Dec 12, 2024
- INFINEON TECHNOLOGIES AG
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413040
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Danfeng Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods
- Publication number 20240387304
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Huan Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20240379496
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT
- Publication number 20240363367
- Publication date Oct 31, 2024
- ams-OSRAM International GmbH
- Johann Ramchen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Structure with Zigzag Patterns and Method Forming Same
- Publication number 20240363457
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347403
- Publication date Oct 17, 2024
- Mitsubishi Electric Corporation
- Takeshi HIGASHIHATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240339387
- Publication date Oct 10, 2024
- DANFOSS SILICON POWER GMBH
- Jacek RUDZKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
- Publication number 20240321699
- Publication date Sep 26, 2024
- ROHM CO., LTD.
- Yo MOCHIZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...
- Publication number 20240321654
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240312852
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material or arrangement of seals between parts,ween cap

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device package and a method of manufacturing the same

Package assembly including liquid alloy thermal interface material...

Electronic component

Integrated circuit device

Package for an integrated circuit and manufacturing method

Semiconductor wafer and method of manufacturing semiconductor chip

Semiconductor device and inverter device

Electronics assemblies employing copper in multiple locations

Semiconductor structure and method for forming the same

Glass carrier having protection structure and manufacturing method...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Semiconductor device

Semiconductor device

Display device

Laser module

Seal ring structure for semiconductor device and the method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device, power conversion apparatus, and manufacturing...

Semiconductor package

Semiconductor module

Semiconductor device

Recessed lid and ring designs and lid local peripheral reinforcemen...

Hermetic package for high CTE mismatch

Package structure with protective lid

Semiconductor device and method of manufacturing semiconductor device

Bonded structures

Array substrate, display, and terminal device

Power semiconductor device with free-floating packaging concept

Power semiconductor device including a deformable flow blocking mem...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

Inductive Heatable Particles in Semiconductor Module

BONDED STRUCTURES

HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...

PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE

Advanced Device Assembly Structures And Methods

Liquid Metal Packaging Structure For Chip Heat Dissipation

ACTIVE ESTER RESIN

Customized heat dissipation from different types of integrated circ...

Seal Ring Structure with Alignment Mark

COVER MEMBER, DOUBLE-SIDED ADHESIVE SHEET, SEAL MEMBER, AND SHEET F...

ISOLATION AND PROTECTION OF COMPUTING COMPONENTS FROM LIQUID IMMERS...

ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC MODULE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

METHODS FOR PRODUCING A SEAL FOR A SEMICONDUCTOR MODULE, AND A HOUS...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Integrated Circuit Packages and Methods

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

PACKAGE STRUCTURE WITH PROTECTIVE LID

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

METHOD FOR PRODUCING AN ELECTRONIC COMPONENT, AND ELECTRONIC COMPONENT

Seal Ring Structure with Zigzag Patterns and Method Forming Same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE

THREE-DIMENSIONAL DEVICE STRUCTURE INCLUDING SEAL RING CONNECTION C...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE