characterised by the material or arrangement of seals between parts,ween cap

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/10characterised by the material or arrangement of seals between parts,ween cap

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Patents Grantslast 30 patents

Information Patent Grant
Embedded cooling systems for advanced device packaging and methods...
- Patent number 12,368,087
- Issue date Jul 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including a package lid having an inner foot and m...
- Patent number 12,362,245
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,362,292
- Issue date Jul 15, 2025
- Mitsubishi Electric Corporation
- Daisuke Kawabata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,354,923
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Susumu Hogyoku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for cooling electronic circuits
- Patent number 12,341,075
- Issue date Jun 24, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy patterns in redundant region of double seal ring
- Patent number 12,341,071
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including stress-reduction structures and met...
- Patent number 12,327,772
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal for microelectronic assembly
- Patent number 12,322,667
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die attached leveling control by metal stopper bumps
- Patent number 12,322,722
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Jhih Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly lid and methods for forming the same
- Patent number 12,322,666
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including lid with additional stress mitigating fe...
- Patent number 12,315,768
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with lid
- Patent number 12,300,632
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and method for manufacturing semiconductor module
- Patent number 12,293,949
- Issue date May 6, 2025
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip semiconductor device package with mold compound seal
- Patent number 12,293,948
- Issue date May 6, 2025
- Texas Instruments Incorporated
- Amit Sureshkumar Nangia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,293,950
- Issue date May 6, 2025
- Amkor Technology Japan, Inc.
- Shojiro Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device comprising stacked circuit members
- Patent number 12,289,825
- Issue date Apr 29, 2025
- Japan Aviation Electronics Industry, Limited
- Shinji Ueda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic package for high CTE mismatch
- Patent number 12,266,582
- Issue date Apr 1, 2025
- Qorvo US, Inc.
- Dylan Murdock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and a method of manufacturing the same
- Patent number 12,261,089
- Issue date Mar 25, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including liquid alloy thermal interface material...
- Patent number 12,255,119
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 12,255,620
- Issue date Mar 18, 2025
- Murata Manufacturing Co., Ltd.
- Toru Yamaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 12,249,545
- Issue date Mar 11, 2025
- United Microelectronics Corp.
- Purakh Raj Verma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for an integrated circuit and manufacturing method
- Patent number 12,249,549
- Issue date Mar 11, 2025
- STMicroelectronics (Grenoble 2) SAS
- Jerome Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and method of manufacturing semiconductor chip
- Patent number 12,243,831
- Issue date Mar 4, 2025
- JVCKENWOOD CORPORATION
- Takayuki Iwasa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and inverter device
- Patent number 12,243,790
- Issue date Mar 4, 2025
- Mitsubishi Electric Corporation
- Yosuke Miyagi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics assemblies employing copper in multiple locations
- Patent number 12,230,596
- Issue date Feb 18, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 12,218,049
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier having protection structure and manufacturing method...
- Patent number 12,218,017
- Issue date Feb 4, 2025
- Unimicron Technology Corp.
- Wen Yu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,211,762
- Issue date Jan 28, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Sang Yun Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,205,866
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,207,467
- Issue date Jan 21, 2025
- Samsung Electronics Co., Ltd.
- Bong Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CAVITY TAPE FOR PACKAGE PROTECTION
- Publication number 20250239497
- Publication date Jul 24, 2025
- Western Digital Technologies, Inc.
- Ankit Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20250239496
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Younes BOUTALEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250239506
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Natsuya YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20250226271
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Tsung-Yu LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS
- Publication number 20250218909
- Publication date Jul 3, 2025
- Intel Corporation
- Donald Tiendung TRAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY
- Publication number 20250218878
- Publication date Jul 3, 2025
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250210594
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Soohwan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250212538
- Publication date Jun 26, 2025
- Sony Semiconductor Solutions Corporation
- KOUSUKE SEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...
- Publication number 20250210459
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...
- Publication number 20250191997
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA INDUCED DAMAGE DETECTION OF A MEMORY DIE
- Publication number 20250180640
- Publication date Jun 5, 2025
- Micron Technology, Inc.
- Aryo Santosa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
- Publication number 20250157969
- Publication date May 15, 2025
- Kuprion Inc.
- Alfred A. Zinn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20250160013
- Publication date May 15, 2025
- Sony Semiconductor Solutions Corporation
- KOJI TSUCHIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250157865
- Publication date May 15, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250140686
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-YUAN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250140636
- Publication date May 1, 2025
- Amkor Technology Japan, Inc.
- Masao HIROBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF
- Publication number 20250118606
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH INTEGRAL SEAL
- Publication number 20250105112
- Publication date Mar 27, 2025
- Navitas Semiconductor Limited
- Oseob Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105109
- Publication date Mar 27, 2025
- ROHM CO., LTD.
- Kaito INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250105090
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chia Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250096049
- Publication date Mar 20, 2025
- Mitsubishi Electric Corporation
- Tatsuya UDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive Heatable Particles in Semiconductor Module
- Publication number 20250096219
- Publication date Mar 20, 2025
- Fabian Jaeger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...
- Publication number 20250069964
- Publication date Feb 27, 2025
- INFINEON TECHNOLOGIES AG
- Marco Ludwig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE
- Publication number 20250046720
- Publication date Feb 6, 2025
- AP MEMORY TECHNOLOGY CORPORATION
- WEN-LIANG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20250033138
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid Metal Packaging Structure For Chip Heat Dissipation
- Publication number 20250038065
- Publication date Jan 30, 2025
- YUNNAN ZHONGXUAN LIQUID METAL TECHNOLOGY CO.,LTD
- Changli CAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE ESTER RESIN
- Publication number 20250026883
- Publication date Jan 23, 2025
- AJINOMOTO CO., INC.
- Ichiro OGURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Seal Ring Structure with Alignment Mark
- Publication number 20250029880
- Publication date Jan 23, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ling Liu
- H01 - BASIC ELECTRIC ELEMENTS

characterised by the material or arrangement of seals between parts,ween cap

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Embedded cooling systems for advanced device packaging and methods...

Package assembly including a package lid having an inner foot and m...

Semiconductor device

Semiconductor device

Systems and methods for cooling electronic circuits

Dummy patterns in redundant region of double seal ring

Semiconductor package including stress-reduction structures and met...

Seal for microelectronic assembly

Die attached leveling control by metal stopper bumps

Package assembly lid and methods for forming the same

Package assembly including lid with additional stress mitigating fe...

Chip package with lid

Semiconductor module and method for manufacturing semiconductor module

Flip chip semiconductor device package with mold compound seal

Semiconductor devices and methods of manufacturing semiconductor de...

Device comprising stacked circuit members

Hermetic package for high CTE mismatch

Semiconductor device package and a method of manufacturing the same

Package assembly including liquid alloy thermal interface material...

Electronic component

Integrated circuit device

Package for an integrated circuit and manufacturing method

Semiconductor wafer and method of manufacturing semiconductor chip

Semiconductor device and inverter device

Electronics assemblies employing copper in multiple locations

Semiconductor structure and method for forming the same

Glass carrier having protection structure and manufacturing method...

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor device

Semiconductor device

Patents Applicationslast 30 patents

CAVITY TAPE FOR PACKAGE PROTECTION

INTEGRATED CIRCUIT PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

ENVIRONMENTAL SEALING FOR ELECTRONICS CHIP PACKAGE SOCKETS

LIDDED ELECTRONIC PACKAGE CONTAINING A BATTERY

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

EMBEDDED COOLING SYSTEMS FOR ADVANCED DEVICE PACKAGING AND METHODS...

PACKAGE ASSEMBLY INCLUDING LIQUID ALLOY THERMAL INTERFACE MATERIAL...

PLASMA INDUCED DAMAGE DETECTION OF A MEMORY DIE

ELECTRONIC ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE

SEAL RING STRUCTURE FOR SEMICONDUCTOR DEVICE AND THE METHOD THEREOF

ELECTRONIC PACKAGE WITH INTEGRAL SEAL

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Inductive Heatable Particles in Semiconductor Module

BONDED STRUCTURES

HOUSING, SEMICONDUCTOR MODULE INCLUDING A HOUSING, AND METHOD FOR A...

PACKAGE AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR STRUCTURE HAVING CONDUCTIVE BRIDGE STRUCTURE

Advanced Device Assembly Structures And Methods

Liquid Metal Packaging Structure For Chip Heat Dissipation

ACTIVE ESTER RESIN

Seal Ring Structure with Alignment Mark