2321071

Information

• Patent Grant
• 2321071

• References
• Source

• Patent Number

  2,321,071

• Date Filed

  Not available

• Date Issued

  Tuesday, June 8, 1943
  81 years ago

• CPC

  • H01L21/167 - Application of a non-genetic conductive layer
  • Y10T29/43 - Electric condenser making
  • Y10T29/49149 - by metal fusion bonding

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 029 - Metal working
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 427 - Coating processes
  • 439 - Electrical connectors