by metal fusion bonding

Industry

CPC
Y10T29/49149

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS Y10USPC classification Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION Y10T29/00Metal working

Current Industry

Y10T29/49149by metal fusion bonding

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated assembly sensor cable
- Patent number 11,557,407
- Issue date Jan 17, 2023
- Masimo Corporation
- Ammar Al-Ali
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 11,528,809
- Issue date Dec 13, 2022
- Tahoe Research, LTD.
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated assembly sensor cable
- Patent number 11,069,461
- Issue date Jul 20, 2021
- Masimo Corporation
- Ammar Al-Ali
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,980,134
- Issue date Apr 13, 2021
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate pad structure
- Patent number 10,867,810
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 10,756,049
- Issue date Aug 25, 2020
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 10,748,785
- Issue date Aug 18, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection of conductor to feedthrough
- Patent number 10,561,851
- Issue date Feb 18, 2020
- Medtronic, Inc.
- Mark Breyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing liquid discharge apparatus
- Patent number 10,377,138
- Issue date Aug 13, 2019
- Brother Kogyo Kabushiki Kaisha
- Taiki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pane having an electrical connection element
- Patent number 10,297,929
- Issue date May 21, 2019
- Saint-Gobain Glass France
- Klaus Schmalbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for orienting solder balls on a BGA device
- Patent number 10,278,292
- Issue date Apr 30, 2019
- Intel Corporation
- Md Altaf Hossain
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for electrical testing of a 3-D chip stack
- Patent number 10,114,069
- Issue date Oct 30, 2018
- International Business Machines Corporation
- Martin Eckert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
One glass solution touch panel and manufacturing method thereof and...
- Patent number 10,067,612
- Issue date Sep 4, 2018
- BOE Technology Group Co., Ltd.
- Yingming Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field asymmetric ion mobility spectrometry filter
- Patent number 10,002,750
- Issue date Jun 19, 2018
- Owlstone Medical Limited
- Danielle Toutoungi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connection piece for a video endoscope, video endoscope,...
- Patent number 9,955,855
- Issue date May 1, 2018
- Olympus Winter & IBE GmbH
- Martin Wieters
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Methods for making leads with radially-aligned segmented electrodes...
- Patent number 9,913,974
- Issue date Mar 13, 2018
- Boston Scientific Neuromodulation Corporation
- Anne Margaret Pianca
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Photopatternable glass micro electrochemical cell and method
- Patent number 9,851,327
- Issue date Dec 26, 2017
- Maxim Integrated Products, Inc.
- Dan G. Allen
- G01 - MEASURING TESTING
Information Patent Grant
Pane having an electrical connection element
- Patent number 9,837,727
- Issue date Dec 5, 2017
- Saint-Gobain Glass France
- Klaus Schmalbuch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for fabricating package
- Patent number 9,820,400
- Issue date Nov 14, 2017
- NEC Space Technologies, Ltd.
- Rieka Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with low-stress, reduced-electrical-length con...
- Patent number 9,787,039
- Issue date Oct 10, 2017
- Hubbell Incorporated
- Shadi Alex AbuGhazaleh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Land grid array interconnect formed with discrete pads
- Patent number 9,769,924
- Issue date Sep 19, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Larry G. Pymento
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 9,761,558
- Issue date Sep 12, 2017
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate pad structure
- Patent number 9,741,589
- Issue date Aug 22, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission line structure and method of attaching transmission li...
- Patent number 9,730,312
- Issue date Aug 8, 2017
- Nokia Technologies Oy
- Romeo Dumpit
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnection of conductor to feedthrough
- Patent number 9,724,524
- Issue date Aug 8, 2017
- Medtronic, Inc.
- Mark Breyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED ASSEMBLY SENSOR CABLE
- Publication number 20230230726
- Publication date Jul 20, 2023
- MASIMO CORPORATION
- Ammar Al-Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20230112097
- Publication date Apr 13, 2023
- Tahoe Research, Ltd.
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20230008716
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED ASSEMBLY SENSOR CABLE
- Publication number 20210391099
- Publication date Dec 16, 2021
- MASIMO CORPORATION
- Ammar Al-Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20210185830
- Publication date Jun 17, 2021
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package-on-package Assembly With Wire Bond Vias
- Publication number 20210035948
- Publication date Feb 4, 2021
- Invensas Corporation
- Ellis Chau
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE
- Publication number 20190230795
- Publication date Jul 25, 2019
- Intel Corporation
- MD Altaf HOSSAIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
AUTOMATED ASSEMBLY SENSOR CABLE
- Publication number 20180082767
- Publication date Mar 22, 2018
- MASIMO CORPORATION
- Ammar Al-Ali
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
PANE HAVING AN ELECTRICAL CONNECTION ELEMENT
- Publication number 20180048079
- Publication date Feb 15, 2018
- SAINT-GOBAIN GLASS FRANCE
- Klaus SCHMALBUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20180026007
- Publication date Jan 25, 2018
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Pad Structure
- Publication number 20170345677
- Publication date Nov 30, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONNECTION PIECE FOR A VIDEO ENDOSCOPE, VIDEO ENDOSCOPE,...
- Publication number 20140371530
- Publication date Dec 18, 2014
- OLYMPUS WINTER & IBE GMBH
- Martin WIETERS
- G02 - OPTICS
Information Patent Application
LAND GRID ARRAY INTERCONNECT FORMED WITH DISCRETE PADS
- Publication number 20140326491
- Publication date Nov 6, 2014
- Larry G. Pymento
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...
- Publication number 20140318850
- Publication date Oct 30, 2014
- Junnosuke Yokoyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME
- Publication number 20140318838
- Publication date Oct 30, 2014
- Myung Whun CHANG
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Publication number 20140317919
- Publication date Oct 30, 2014
- Samsung Electro-mechanics Co., Ltd.
- Jin Su KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PIN
- Publication number 20140299368
- Publication date Oct 9, 2014
- Joachim Braunger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERMINAL, TERMINAL MODULE AND METHOD OF MANUFACURING THE TERMINAL M...
- Publication number 20140287604
- Publication date Sep 25, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- PO-YUAN LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALANCED STRESS ASSEMBLY FOR SEMICONDUCTOR DEVICES
- Publication number 20140252578
- Publication date Sep 11, 2014
- Delphi Technologies, Inc.
- CARL W. BERLIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Making User-Friendly USB Male Connector
- Publication number 20140223733
- Publication date Aug 14, 2014
- Joseph Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION
- Publication number 20140202739
- Publication date Jul 24, 2014
- Fujitsu Limited
- Taiji Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY
- Publication number 20140187057
- Publication date Jul 3, 2014
- Gregorio R. Murtagian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURRENT SENSOR AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20140176124
- Publication date Jun 26, 2014
- AISIN SEIKI KABUSHIKI KAISHA
- Ken OKUMURA
- G01 - MEASURING TESTING
Information Patent Application
Substrate Pad Structure
- Publication number 20140159203
- Publication date Jun 12, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Juin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACK PAD ACOUSTIC FEATURES RELATED TO A PORTABLE COMPUTER
- Publication number 20140111914
- Publication date Apr 24, 2014
- Apple Inc.
- William F. Leggett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGING CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE...
- Publication number 20140102772
- Publication date Apr 17, 2014
- Unimicron Technology Corp.
- Ming-Chih Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLING THE SAME
- Publication number 20140106593
- Publication date Apr 17, 2014
- HON HAI PRECISION INDUSTRY CO., LTD.
- SHUO-HSIU HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by metal fusion bonding

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stacked microfeature devices and associated methods

Package-on-package assembly with wire bond vias

Automated assembly sensor cable

Method for orienting solder balls on a BGA device

Stacked microfeature devices and associated methods

Package-on-package assembly with wire bond vias

Automated assembly sensor cable

Method for orienting solder balls on a BGA device

Substrate pad structure

Package-on-package assembly with wire bond vias

Substrate pad structure

Interconnection of conductor to feedthrough

Method for producing liquid discharge apparatus

Pane having an electrical connection element

Method for orienting solder balls on a BGA device

Method for electrical testing of a 3-D chip stack

One glass solution touch panel and manufacturing method thereof and...

Stacked microfeature devices and associated methods

Field asymmetric ion mobility spectrometry filter

Electrical connection piece for a video endoscope, video endoscope,...

Methods for making leads with radially-aligned segmented electrodes...

Photopatternable glass micro electrochemical cell and method

Pane having an electrical connection element

Package and method for fabricating package

Electrical connector with low-stress, reduced-electrical-length con...

Land grid array interconnect formed with discrete pads

Package-on-package assembly with wire bond vias

Substrate pad structure

Transmission line structure and method of attaching transmission li...

Interconnection of conductor to feedthrough

Patents Applicationslast 30 patents

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

AUTOMATED ASSEMBLY SENSOR CABLE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

AUTOMATED ASSEMBLY SENSOR CABLE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

Package-on-package Assembly With Wire Bond Vias

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

AUTOMATED ASSEMBLY SENSOR CABLE

PANE HAVING AN ELECTRICAL CONNECTION ELEMENT

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Substrate Pad Structure

ELECTRICAL CONNECTION PIECE FOR A VIDEO ENDOSCOPE, VIDEO ENDOSCOPE,...

LAND GRID ARRAY INTERCONNECT FORMED WITH DISCRETE PADS

PRINTED CIRCUIT BOARD AND METHOD OF MOUNTING COMPONENTS ON THE PRIN...

METHOD OF REPAIRING PROBE BOARD AND PROBE BOARD USING THE SAME

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

CONTACT PIN

TERMINAL, TERMINAL MODULE AND METHOD OF MANUFACURING THE TERMINAL M...

BALANCED STRESS ASSEMBLY FOR SEMICONDUCTOR DEVICES

Method of Making User-Friendly USB Male Connector

PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION

MECHANISM FOR FACILITATING AND EMPLOYING A MAGNETIC GRID ARRAY

CURRENT SENSOR AND MANUFACTURING METHOD FOR THE SAME

Substrate Pad Structure

TRACK PAD ACOUSTIC FEATURES RELATED TO A PORTABLE COMPUTER

PACKAGING CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE...

ELECTRICAL CONNECTOR ASSEMBLY AND METHOD OF ASSEMBLING THE SAME