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2472938
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Patent Grant
2472938
References
Source
Patent Number
2,472,938
Date Filed
Not available
Date Issued
Tuesday, June 14, 1949
75 years ago
CPC
H01L23/16 - Fillings or auxiliary members in containers or encapsulations
H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
H01L21/54 - Providing fillings in containers
H01L23/26 - including materials for absorbing or reacting with moisture or other undesired substances
H01L24/00 - Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L2924/12037 - Cat's whisker diode
US Classifications
257 - Active solid-state devices
148 - Metal treatment
205 - Electrolysis: processes, compositions used therein, and methods of preparing the compositions
438 - Semiconductor device manufacturing: process
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