including materials for absorbing or reacting with moisture or other undesired substances

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/26including materials for absorbing or reacting with moisture or other undesired substances

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor apparatus and semiconductor apparatus leak inspection...
- Patent number 11,967,537
- Issue date Apr 23, 2024
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,948,847
- Issue date Apr 2, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
- Patent number 11,764,117
- Issue date Sep 19, 2023
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micro-electromechanical system and method for producing same
- Patent number 11,685,645
- Issue date Jun 27, 2023
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Module with gas flow-inhibiting sealing at module interface to moun...
- Patent number 11,615,994
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel, array substrate, display device and method for fabri...
- Patent number 11,600,576
- Issue date Mar 7, 2023
- BOE Technology Group Co., Ltd.
- Chengyuan Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 11,569,181
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crack identification in IC chip package using encapsulated liquid p...
- Patent number 11,543,322
- Issue date Jan 3, 2023
- GLOBALFOUNDRIES U.S. INC.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film getter and manufacturing method therefor
- Patent number 11,524,271
- Issue date Dec 13, 2022
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Yongho Choa
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electroluminescent device including color rendering materials
- Patent number 11,482,693
- Issue date Oct 25, 2022
- BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
- Chengyuan Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,380,597
- Issue date Jul 5, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High-capacity dispensable getter
- Patent number 11,331,647
- Issue date May 17, 2022
- S.A.E.S. Getters S.p.A.
- Miriam Riva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 11,315,845
- Issue date Apr 26, 2022
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture and hydrogen adsorption getter and method of fabricating t...
- Patent number 11,285,453
- Issue date Mar 29, 2022
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Yongho Choa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging cover plate, organic light-emitting diode display and man...
- Patent number 11,245,099
- Issue date Feb 8, 2022
- BOE Technology Group Co., Ltd.
- Linlin Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic light emitting diode display panel and packaging method the...
- Patent number 11,094,911
- Issue date Aug 17, 2021
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Yeqing Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with inner and outer cavities
- Patent number 11,081,413
- Issue date Aug 3, 2021
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin Wu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microsystem device comprising integrated desiccant monitoring
- Patent number 10,962,469
- Issue date Mar 30, 2021
- Albert-Ludwigs-Universitat Freiburg
- Linda Rudmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for gettering impurities in semiconductors
- Patent number 10,937,665
- Issue date Mar 2, 2021
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 10,910,284
- Issue date Feb 2, 2021
- Infineon Technologies Austria AG
- Stefan Schwab
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
External gettering method and device
- Patent number 10,892,202
- Issue date Jan 12, 2021
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 10,892,233
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating package structure
- Patent number 10,879,197
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and multi screen display apparatus comprising the...
- Patent number 10,879,213
- Issue date Dec 29, 2020
- LG Display Co., Ltd.
- MinSeok Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Moisture and hydrogen-absorbing getter and method for manufacturing...
- Patent number 10,843,167
- Issue date Nov 24, 2020
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Yongho Choa
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Hermetically sealed electronic packages with electrically powered m...
- Patent number 10,811,331
- Issue date Oct 20, 2020
- PA&E, HERMETIC SOLUTIONS GROUP, LLC
- Hua Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
- Patent number 10,804,175
- Issue date Oct 13, 2020
- Monolith Semiconductor, Inc.
- Kevin Matocha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sheet for absorbing moisture
- Patent number 10,792,900
- Issue date Oct 6, 2020
- Dynic Corporation
- Nobuo Ose
- B32 - LAYERED PRODUCTS
Information Patent Grant
Composition for heat-dissipating member, heat-dissipating member, e...
- Patent number 10,752,755
- Issue date Aug 25, 2020
- JNC Corporation
- Takeshi Fujiwara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Device for detecting a leak in a sealed enclosure
- Patent number 10,718,684
- Issue date Jul 21, 2020
- COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES
- Claude Chabrol
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
- Publication number 20240355693
- Publication date Oct 24, 2024
- Kabushiki Kaisha Toshiba
- Shogo MINAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE
- Publication number 20240297260
- Publication date Sep 5, 2024
- MELEXIS TECHNOLOGIES NV
- Rachel GLEESON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLE...
- Publication number 20240203807
- Publication date Jun 20, 2024
- President and Fellows of Harvard College
- Yanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED AREA GETTER ARCHITECTURE FOR WAFER-LEVEL VACUUM PACKAGED U...
- Publication number 20240194707
- Publication date Jun 13, 2024
- DRS Network & Imaging Systems, LLC
- Thomas Schimert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240162102
- Publication date May 16, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTURING SAME
- Publication number 20240145324
- Publication date May 2, 2024
- Mitsubishi Electric Corporation
- Misaki HANAOKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20240120245
- Publication date Apr 11, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20230420318
- Publication date Dec 28, 2023
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Encapsulant Strength Enhancer
- Publication number 20230343661
- Publication date Oct 26, 2023
- Georg Troska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...
- Publication number 20230197542
- Publication date Jun 22, 2023
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR PRODUCING SAME
- Publication number 20230123544
- Publication date Apr 20, 2023
- LYNRED
- Sylvain Lemettre
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX
- Publication number 20230101629
- Publication date Mar 30, 2023
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20220367302
- Publication date Nov 17, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HIGH-CAPACITY DISPENSABLE GETTER
- Publication number 20220088565
- Publication date Mar 24, 2022
- SAES GETTERS S.P.A.
- Miriam RIVA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...
- Publication number 20210341349
- Publication date Nov 4, 2021
- GLOBALFOUNDRIES U.S. Inc.
- George K. Parker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS LEAK INSPECTION...
- Publication number 20210313242
- Publication date Oct 7, 2021
- Mitsubishi Electric Corporation
- Takayuki Hisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...
- Publication number 20210305109
- Publication date Sep 30, 2021
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20210118819
- Publication date Apr 22, 2021
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE AND HYDROGEN ADSORPTION GETTER AND METHOD OF FABRICATING T...
- Publication number 20210031167
- Publication date Feb 4, 2021
- Industry-University Cooperation Foundation Hanyang University ERICA Campus
- YONGHO CHOA
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...
- Publication number 20210028077
- Publication date Jan 28, 2021
- Corning Incorporated
- Robert Alan Bellman
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...
- Publication number 20210005523
- Publication date Jan 7, 2021
- Monolith Semiconductor Inc.
- Kevin MATOCHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM GETTER AND MANUFACTURING METHOD THEREFOR
- Publication number 20200346184
- Publication date Nov 5, 2020
- Industry-University Cooperation Foundation Hanyang University Erica Campus
- Yongho Choa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISPLAY PANEL, ARRAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR FABRI...
- Publication number 20200273815
- Publication date Aug 27, 2020
- BOE TECHNOLOGY GROUP CO., LTD.
- Chengyuan LUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...
- Publication number 20200273769
- Publication date Aug 27, 2020
- PA&E, Hermetic Solutions Group, LLC
- Hua Xia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...
- Publication number 20200176352
- Publication date Jun 4, 2020
- Intel Corporation
- Je-Young CHANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20200135662
- Publication date Apr 30, 2020
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTERNAL GETTERING METHOD AND DEVICE
- Publication number 20190341321
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Michael Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190267298
- Publication date Aug 29, 2019
- Advanced Semiconductor Engineering, Inc.
- Hsin Lin WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20190198409
- Publication date Jun 27, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

including materials for absorbing or reacting with moisture or other undesired substances

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus and semiconductor apparatus leak inspection...

Bonded structures

Hermetically sealed optically transparent wafer-level packages and...

Micro-electromechanical system and method for producing same

Module with gas flow-inhibiting sealing at module interface to moun...

Display panel, array substrate, display device and method for fabri...

Mitigating moisture-driven degradation of features designed to prev...

Crack identification in IC chip package using encapsulated liquid p...

Thin film getter and manufacturing method therefor

Electroluminescent device including color rendering materials

Bonded structures

High-capacity dispensable getter

Semiconductor devices comprising getter layers and methods of makin...

Moisture and hydrogen adsorption getter and method of fabricating t...

Packaging cover plate, organic light-emitting diode display and man...

Organic light emitting diode display panel and packaging method the...

Semiconductor package with inner and outer cavities

Microsystem device comprising integrated desiccant monitoring

Methods and apparatus for gettering impurities in semiconductors

Semiconductor device and method of manufacturing thereof

External gettering method and device

Mitigating moisture-driven degradation of features designed to prev...

Package structure and method of fabricating package structure

Display apparatus and multi screen display apparatus comprising the...

Moisture and hydrogen-absorbing getter and method for manufacturing...

Hermetically sealed electronic packages with electrically powered m...

Semiconductor devices comprising getter layers and methods of makin...

Sheet for absorbing moisture

Composition for heat-dissipating member, heat-dissipating member, e...

Device for detecting a leak in a sealed enclosure

Patents Applicationslast 30 patents

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...

METHOD OF MANUFACTURING A SENSOR DEVICE

FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLE...

ENHANCED AREA GETTER ARCHITECTURE FOR WAFER-LEVEL VACUUM PACKAGED U...

BONDED STRUCTURES

SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTURING SAME

BONDED STRUCTURES

SEMICONDUCTOR MODULE

Semiconductor Encapsulant Strength Enhancer

Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...

MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR PRODUCING SAME

OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX

BONDED STRUCTURES

HIGH-CAPACITY DISPENSABLE GETTER

CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS LEAK INSPECTION...

Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

MOISTURE AND HYDROGEN ADSORPTION GETTER AND METHOD OF FABRICATING T...

HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...

SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...

THIN FILM GETTER AND MANUFACTURING METHOD THEREFOR

DISPLAY PANEL, ARRAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR FABRI...

HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...

DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

EXTERNAL GETTERING METHOD AND DEVICE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

BONDED STRUCTURES