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Patents Grants
last 30 patents
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Patent Grant
Semiconductor apparatus and semiconductor apparatus leak inspection...
Patent number
11,967,537
Issue date
Apr 23, 2024
Mitsubishi Electric Corporation
Takayuki Hisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures
Patent number
11,948,847
Issue date
Apr 2, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Hermetically sealed optically transparent wafer-level packages and...
Patent number
11,764,117
Issue date
Sep 19, 2023
Corning Incorporated
Robert Alan Bellman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Micro-electromechanical system and method for producing same
Patent number
11,685,645
Issue date
Jun 27, 2023
LYNRED
Sylvain Lemettre
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Module with gas flow-inhibiting sealing at module interface to moun...
Patent number
11,615,994
Issue date
Mar 28, 2023
Infineon Technologies AG
Johannes Uhlig
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Display panel, array substrate, display device and method for fabri...
Patent number
11,600,576
Issue date
Mar 7, 2023
BOE Technology Group Co., Ltd.
Chengyuan Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
Patent number
11,569,181
Issue date
Jan 31, 2023
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Crack identification in IC chip package using encapsulated liquid p...
Patent number
11,543,322
Issue date
Jan 3, 2023
GLOBALFOUNDRIES U.S. INC.
George K. Parker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin film getter and manufacturing method therefor
Patent number
11,524,271
Issue date
Dec 13, 2022
Industry-University Cooperation Foundation Hanyang University Erica Campus
Yongho Choa
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Electroluminescent device including color rendering materials
Patent number
11,482,693
Issue date
Oct 25, 2022
BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
Chengyuan Luo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonded structures
Patent number
11,380,597
Issue date
Jul 5, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
High-capacity dispensable getter
Patent number
11,331,647
Issue date
May 17, 2022
S.A.E.S. Getters S.p.A.
Miriam Riva
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
Patent number
11,315,845
Issue date
Apr 26, 2022
Monolith Semiconductor, Inc.
Kevin Matocha
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Moisture and hydrogen adsorption getter and method of fabricating t...
Patent number
11,285,453
Issue date
Mar 29, 2022
Industry-University Cooperation Foundation Hanyang University Erica Campus
Yongho Choa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaging cover plate, organic light-emitting diode display and man...
Patent number
11,245,099
Issue date
Feb 8, 2022
BOE Technology Group Co., Ltd.
Linlin Wang
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Organic light emitting diode display panel and packaging method the...
Patent number
11,094,911
Issue date
Aug 17, 2021
WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
Yeqing Wu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package with inner and outer cavities
Patent number
11,081,413
Issue date
Aug 3, 2021
Advanced Semiconductor Engineering, Inc.
Hsin Lin Wu
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Microsystem device comprising integrated desiccant monitoring
Patent number
10,962,469
Issue date
Mar 30, 2021
Albert-Ludwigs-Universitat Freiburg
Linda Rudmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods and apparatus for gettering impurities in semiconductors
Patent number
10,937,665
Issue date
Mar 2, 2021
Intel Corporation
Aaron D. Lilak
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor device and method of manufacturing thereof
Patent number
10,910,284
Issue date
Feb 2, 2021
Infineon Technologies Austria AG
Stefan Schwab
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
External gettering method and device
Patent number
10,892,202
Issue date
Jan 12, 2021
Micron Technology, Inc.
Michael Tan
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
Patent number
10,892,233
Issue date
Jan 12, 2021
International Business Machines Corporation
Sushumna Iruvanti
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of fabricating package structure
Patent number
10,879,197
Issue date
Dec 29, 2020
Taiwan Semiconductor Manufacturing Company, Ltd
Albert Wan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display apparatus and multi screen display apparatus comprising the...
Patent number
10,879,213
Issue date
Dec 29, 2020
LG Display Co., Ltd.
MinSeok Kim
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Moisture and hydrogen-absorbing getter and method for manufacturing...
Patent number
10,843,167
Issue date
Nov 24, 2020
Industry-University Cooperation Foundation Hanyang University Erica Campus
Yongho Choa
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Hermetically sealed electronic packages with electrically powered m...
Patent number
10,811,331
Issue date
Oct 20, 2020
PA&E, HERMETIC SOLUTIONS GROUP, LLC
Hua Xia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices comprising getter layers and methods of makin...
Patent number
10,804,175
Issue date
Oct 13, 2020
Monolith Semiconductor, Inc.
Kevin Matocha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sheet for absorbing moisture
Patent number
10,792,900
Issue date
Oct 6, 2020
Dynic Corporation
Nobuo Ose
B32 - LAYERED PRODUCTS
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Patent Grant
Composition for heat-dissipating member, heat-dissipating member, e...
Patent number
10,752,755
Issue date
Aug 25, 2020
JNC Corporation
Takeshi Fujiwara
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Device for detecting a leak in a sealed enclosure
Patent number
10,718,684
Issue date
Jul 21, 2020
COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES
Claude Chabrol
G01 - MEASURING TESTING
Patents Applications
last 30 patents
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Patent Application
SEMICONDUCTOR PACKAGE HAVING INCREASED RELIABILITY
Publication number
20250014957
Publication date
Jan 9, 2025
Samsung Electronics Co., Ltd.
Jingu KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
Publication number
20240387436
Publication date
Nov 21, 2024
Mitsubishi Electric Corporation
Yusuke YAMAGATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND METHOD FOR MANUFACT...
Publication number
20240355693
Publication date
Oct 24, 2024
Kabushiki Kaisha Toshiba
Shogo MINAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SENSOR DEVICE
Publication number
20240297260
Publication date
Sep 5, 2024
MELEXIS TECHNOLOGIES NV
Rachel GLEESON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLUID-INFUSED ENCAPSULATION OF WATER-SENSITIVE MATERIALS WITH REPLE...
Publication number
20240203807
Publication date
Jun 20, 2024
President and Fellows of Harvard College
Yanhao YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCED AREA GETTER ARCHITECTURE FOR WAFER-LEVEL VACUUM PACKAGED U...
Publication number
20240194707
Publication date
Jun 13, 2024
DRS Network & Imaging Systems, LLC
Thomas Schimert
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20240162102
Publication date
May 16, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR SENSOR AND METHOD FOR MANUFACTURING SAME
Publication number
20240145324
Publication date
May 2, 2024
Mitsubishi Electric Corporation
Misaki HANAOKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20240120245
Publication date
Apr 11, 2024
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR MODULE
Publication number
20230420318
Publication date
Dec 28, 2023
Fuji Electric Co., Ltd.
Akira MOROZUMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Encapsulant Strength Enhancer
Publication number
20230343661
Publication date
Oct 26, 2023
Georg Troska
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...
Publication number
20230197542
Publication date
Jun 22, 2023
Johannes Uhlig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICRO-ELECTROMECHANICAL SYSTEM AND METHOD FOR PRODUCING SAME
Publication number
20230123544
Publication date
Apr 20, 2023
LYNRED
Sylvain Lemettre
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
OMNI DIRECTIONAL INTERCONNECT WITH MAGNETIC FILLERS IN MOLD MATRIX
Publication number
20230101629
Publication date
Mar 30, 2023
Bohan Shan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDED STRUCTURES
Publication number
20220367302
Publication date
Nov 17, 2022
INVENSAS BONDING TECHNOLOGIES, INC.
Rajesh Katkar
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
HIGH-CAPACITY DISPENSABLE GETTER
Publication number
20220088565
Publication date
Mar 24, 2022
SAES GETTERS S.P.A.
Miriam RIVA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CRACK IDENTIFICATION IN IC CHIP PACKAGE USING ENCAPSULATED LIQUID P...
Publication number
20210341349
Publication date
Nov 4, 2021
GLOBALFOUNDRIES U.S. Inc.
George K. Parker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS LEAK INSPECTION...
Publication number
20210313242
Publication date
Oct 7, 2021
Mitsubishi Electric Corporation
Takayuki Hisaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Module with Gas Flow-Inhibiting Sealing at Module Interface to Moun...
Publication number
20210305109
Publication date
Sep 30, 2021
Johannes Uhlig
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
Publication number
20210118819
Publication date
Apr 22, 2021
International Business Machines Corporation
SUSHUMNA IRUVANTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOISTURE AND HYDROGEN ADSORPTION GETTER AND METHOD OF FABRICATING T...
Publication number
20210031167
Publication date
Feb 4, 2021
Industry-University Cooperation Foundation Hanyang University ERICA Campus
YONGHO CHOA
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
HERMETICALLY SEALED OPTICALLY TRANSPARENT WAFER-LEVEL PACKAGES AND...
Publication number
20210028077
Publication date
Jan 28, 2021
Corning Incorporated
Robert Alan Bellman
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SEMICONDUCTOR DEVICES COMPRISING GETTER LAYERS AND METHODS OF MAKIN...
Publication number
20210005523
Publication date
Jan 7, 2021
Monolith Semiconductor Inc.
Kevin MATOCHA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THIN FILM GETTER AND MANUFACTURING METHOD THEREFOR
Publication number
20200346184
Publication date
Nov 5, 2020
Industry-University Cooperation Foundation Hanyang University Erica Campus
Yongho Choa
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
DISPLAY PANEL, ARRAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR FABRI...
Publication number
20200273815
Publication date
Aug 27, 2020
BOE TECHNOLOGY GROUP CO., LTD.
Chengyuan LUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED M...
Publication number
20200273769
Publication date
Aug 27, 2020
PA&E, Hermetic Solutions Group, LLC
Hua Xia
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE BACKSIDE STRUCTURES FOR ENHANCING LIQUID COOLING OF HIGH POWER...
Publication number
20200176352
Publication date
Jun 4, 2020
Intel Corporation
Je-Young CHANG
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
Publication number
20200135662
Publication date
Apr 30, 2020
International Business Machines Corporation
SUSHUMNA IRUVANTI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EXTERNAL GETTERING METHOD AND DEVICE
Publication number
20190341321
Publication date
Nov 7, 2019
Micron Technology, Inc.
Michael Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20190267298
Publication date
Aug 29, 2019
Advanced Semiconductor Engineering, Inc.
Hsin Lin WU
H01 - BASIC ELECTRIC ELEMENTS