2865794

Information

• Patent Grant
• 2865794

• References
• Source

• Patent Number

  2,865,794

• Date Filed

  Not available

• Date Issued

  Tuesday, December 23, 1958
  66 years ago

• CPC

  • H01L21/445 - from a liquid
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/06 - the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials
  • H01L21/40 - Alloying of impurity materials
  • Y10S228/903 - Metal to nonmetal

• US Classifications

  • 257 - Active solid-state devices
  • 228 - Metal fusion bonding
  • 438 - Semiconductor device manufacturing: process