2953673

Information

• Patent Grant
• 2953673

• References
• Source

• Patent Number

  2,953,673

• Date Filed

  Not available

• Date Issued

  Tuesday, September 20, 1960
  64 years ago

• CPC

  • H01R4/026 - comprising means for eliminating an insulative layer prior to soldering or welding
  • Y10S228/904 - Wire bonding

• US Classifications

  • 219 - Electric heating
  • 228 - Metal fusion bonding