3060513

Information

• Patent Grant
• 3060513

• References
• Source

• Patent Number

  3,060,513

• Date Filed

  Not available

• Date Issued

  Tuesday, October 30, 1962
  62 years ago

• CPC

  • C08J9/232 - by sintering expandable particles
  • B29C67/222 - using expandable particles or beads as starting material
  • B29C67/2225 - using high frequency heating
  • B32B27/00 - Layered products comprising a layer of synthetic resin
  • Y10S264/46 - Molding using an electrical heat
  • Y10S521/915 - Utilizing electrical or wave energy during cell forming process

• US Classifications

  • 264 - Plastic and nonmetallic article shaping or treating: processes
  • 053 - Package making
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 206 - Special receptacle or package
  • 521 - Synthetic resins or natural rubbers