3153581

Information

• Patent Grant
• 3153581

• References
• Source

• Patent Number

  3,153,581

• Date Filed

  Not available

• Date Issued

  Tuesday, October 20, 1964
  60 years ago

• CPC

  • C04B37/006 - consisting of metals or metal salts
  • B23K20/02 - by means of a press; Diffusion bonding
  • B23K20/023 - Thermo-compression bonding
  • B23K35/001 - Interlayers, transition pieces for metallurgical bonding of workpieces
  • C03C27/00 - Joining pieces of glass to pieces of other inorganic material Joining glass to glass other than by fusing
  • H01L23/488 - consisting of soldered or bonded constructions
  • B23K2201/22 - Nets, wire fabrics or the like
  • C04B2235/604 - Pressing at temperatures other than sintering temperatures
  • C04B2235/666 - Applying a current during sintering
  • C04B2237/123 - based on iron group metals
  • C04B2237/32 - Ceramic
  • C04B2237/36 - Non-oxidic
  • C04B2237/363 - Carbon
  • C04B2237/52 - Pre-treatment of the joining surfaces
  • C04B2237/72 - Forming laminates or joined articles comprising at least two interlayers directly next to each other
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • H01L2924/09701 - Low temperature co-fired ceramic [LTCC]
  • Y10S428/929 - Electrical contact feature
  • Y10T428/12347 - Plural layers discontinuously bonded [e.g., spot-weld, mechanical fastener, etc.]
  • Y10T428/12444 - Embodying fibers interengaged or between layers [e.g., paper, etc.]
  • Y10T428/12528 - Semiconductor component
  • Y10T428/12674 - Ge- or Si-base component
  • Y10T428/12826 - Group VIB metal-base component

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 148 - Metal treatment
  • 228 - Metal fusion bonding
  • 257 - Active solid-state devices
  • 438 - Semiconductor device manufacturing: process