consisting of soldered or bonded constructions

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H01L23/488

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/488consisting of soldered or bonded constructions

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 12,166,162
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 12,094,772
- Issue date Sep 17, 2024
- Advanced Semiconductor Engineering, Inc.
- Wei-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit device
- Patent number 12,074,130
- Issue date Aug 27, 2024
- RISING TECHNOLOGIES CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,068,271
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die mounted to an insulating substrate an...
- Patent number 12,040,263
- Issue date Jul 16, 2024
- STMicroelectronics S.r.l.
- Roberto Tiziani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire bond and method for preparing the same
- Patent number 12,027,480
- Issue date Jul 2, 2024
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting dies by stitch routing
- Patent number 12,021,035
- Issue date Jun 25, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderable and wire bondable part marking
- Patent number 12,021,038
- Issue date Jun 25, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having a plurality of main pads, a plurality of redu...
- Patent number 12,021,179
- Issue date Jun 25, 2024
- Innolux Corporation
- Jia-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly including plural through wafer vias, method of cooling the...
- Patent number 11,967,548
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kerry Bernstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and heat dissipation structure thereof, comprisi...
- Patent number 11,955,404
- Issue date Apr 9, 2024
- AURAS TECHNOLOGY CO., LTD.
- Jian-Dih Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with redistribution structure and manufacturi...
- Patent number 11,955,439
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic package structure and method of manufacturing the same
- Patent number 11,942,585
- Issue date Mar 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Hsuan Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bonded semiconductor structure utilizing concave...
- Patent number 11,935,854
- Issue date Mar 19, 2024
- United Microelectronics Corp.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,923,257
- Issue date Mar 5, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,901,340
- Issue date Feb 13, 2024
- Rohm Co., Ltd.
- Kenji Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated shield package and method
- Patent number 11,848,275
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having vertical routing to bond pads
- Patent number 11,837,623
- Issue date Dec 5, 2023
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with wire bond and method for preparing the same
- Patent number 11,830,836
- Issue date Nov 28, 2023
- NANYA TECHNOLOGY CORPORATION
- Tse-Yao Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method for manufacturing th...
- Patent number 11,777,068
- Issue date Oct 3, 2023
- Rohm Co., Ltd.
- Masahiko Kobayakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,764,130
- Issue date Sep 19, 2023
- Rohm Co., Ltd.
- Satoshi Kageyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,756,913
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for surface acoustic wave filter package struc...
- Patent number 11,757,426
- Issue date Sep 12, 2023
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Industrial chip scale package for microelectronic device
- Patent number 11,749,616
- Issue date Sep 5, 2023
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus including solder-core connectors and methods of manufactu...
- Patent number 11,705,421
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Po Chih Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring buried layers
- Patent number 11,682,584
- Issue date Jun 20, 2023
- Camtek Ltd.
- Zehava Ben Ezer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE
- Publication number 20240413036
- Publication date Dec 12, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi KUROKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...
- Publication number 20240371738
- Publication date Nov 7, 2024
- STMicroelectronics S.r.l
- Roberto TIZIANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371810
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...
- Publication number 20240355712
- Publication date Oct 24, 2024
- QUALCOMM Incorporated
- Michelle Yejin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF AN ELECTRONIC DEVICE
- Publication number 20240313187
- Publication date Sep 19, 2024
- InnoLux Corporation
- Jia-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERABLE AND WIRE BONDABLE PART MARKING
- Publication number 20240312926
- Publication date Sep 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Margaret Barter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240234380
- Publication date Jul 11, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20240222291
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED SHIELD PACKAGE AND METHOD
- Publication number 20240194615
- Publication date Jun 13, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Paul Mescher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE DES...
- Publication number 20240170423
- Publication date May 23, 2024
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE
- Publication number 20240162163
- Publication date May 16, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20240136335
- Publication date Apr 25, 2024
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS
- Publication number 20240055466
- Publication date Feb 15, 2024
- Raytheon Company
- Eric Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME
- Publication number 20240047391
- Publication date Feb 8, 2024
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20230411581
- Publication date Dec 21, 2023
- ROHM CO., LTD.
- Masahiko KOBAYAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...
- Publication number 20230402415
- Publication date Dec 14, 2023
- WUHAN XINXIN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Tian ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230378115
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING BONDED SEMICONDUCTOR STRUCTURE
- Publication number 20230223366
- Publication date Jul 13, 2023
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR POWER MODULE
- Publication number 20230187416
- Publication date Jun 15, 2023
- ROHM CO., LTD.
- Kenji HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...
- Publication number 20230154863
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Pad for Semiconductor Device
- Publication number 20230112750
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME
- Publication number 20230106386
- Publication date Apr 6, 2023
- NANYA TECHNOLOGY CORPORATION
- TSE-YAO HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...
- Publication number 20230095281
- Publication date Mar 30, 2023
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20230052432
- Publication date Feb 16, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20230017445
- Publication date Jan 19, 2023
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230008792
- Publication date Jan 12, 2023
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230006114
- Publication date Jan 5, 2023
- Advanced Semiconductor Engineering, Inc.
- Cheng-Hsuan WU
- H01 - BASIC ELECTRIC ELEMENTS

consisting of soldered or bonded constructions

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor light emitting device and method for manufacturing th...

Electronic device package and method of manufacturing the same

Electronic circuit device

Semiconductor device structure and methods of forming the same

Semiconductor device with die mounted to an insulating substrate an...

Chip-scale package architectures containing a die back side metal a...

Semiconductor device with wire bond and method for preparing the same

Interconnecting dies by stitch routing

Solderable and wire bondable part marking

Display device having a plurality of main pads, a plurality of redu...

Assembly including plural through wafer vias, method of cooling the...

Electronic package and heat dissipation structure thereof, comprisi...

Semiconductor package with redistribution structure and manufacturi...

Optoelectronic package structure and method of manufacturing the same

Method for forming bonded semiconductor structure utilizing concave...

Hybrid microelectronic substrates

Semiconductor power module

Contact pad for semiconductor device

Integrated shield package and method

Integrated circuit having vertical routing to bond pads

Semiconductor device with wire bond and method for preparing the same

Method for forming embedded grounding planes on interconnect layers

Semiconductor light emitting device and method for manufacturing th...

Semiconductor device

Semiconductor device structure and methods of forming the same

Manufacturing method for surface acoustic wave filter package struc...

Industrial chip scale package for microelectronic device

Packaging method and associated packaging structure

Apparatus including solder-core connectors and methods of manufactu...

Measuring buried layers

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURING SEMI...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SUBSTRATE(S) FOR AN INTEGRATED CIRCUIT (IC) PACKAGE EMPLOYING A MET...

CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...

MANUFACTURING METHOD OF AN ELECTRONIC DEVICE

SOLDERABLE AND WIRE BONDABLE PART MARKING

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

INTEGRATED SHIELD PACKAGE AND METHOD

BONDED SEMICONDUCTOR STRUCTURE UTILIZING CONCAVE/CONVEX PROFILE DES...

INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE

SEMICONDUCTOR POWER MODULE

INTEGRATED CIRCUIT HAVING VERTICAL ROUTING TO BOND PADS

SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING TH...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

METHOD FOR FORMING BONDED SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR POWER MODULE

SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURI...

Contact Pad for Semiconductor Device

SEMICONDUCTOR DEVICE WITH WIRE BOND AND METHOD FOR PREPARING THE SAME

METHODS AND APPARATUS TO REDUCE DEFECTS IN INTERCONNECTS BETWEEN SE...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

Scalable Extreme Large Size Substrate Integration

BONDED SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME