3316384

Information

• Patent Grant
• 3316384

• References
• Source

• Patent Number

  3,316,384

• Date Filed

  Not available

• Date Issued

  Tuesday, April 25, 1967
  57 years ago

• CPC

  • B23K1/018 - Unsoldering Removal of melted solder or other residues
  • B23K3/029 - Solder or residue removing devices

• US Classifications

  • 219 - Electric heating
  • 228 - Metal fusion bonding