Unsoldering Removal of melted solder or other residues

Industry

CPC
B23K1/018

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K1/00Soldering

Current Industry

B23K1/018Unsoldering Removal of melted solder or other residues

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Substrate debonding from bonded part
- Patent number 12,040,311
- Issue date Jul 16, 2024
- The Boeing Company
- Peter D. Brewer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 12,016,127
- Issue date Jun 18, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for debonding temporarily bonded wafers in waf...
- Patent number 11,996,384
- Issue date May 28, 2024
- PulseForge, Inc.
- Vahid Akhavan Attar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,745,281
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,751,369
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,658,147
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ilhyoung Koo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Control assembly fabrication via brazing
- Patent number 11,633,799
- Issue date Apr 25, 2023
- Hamilton Sundstrand Corporation
- Mark A. Zaffetti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cleaning pad assembly
- Patent number 11,602,799
- Issue date Mar 14, 2023
- Hakko Corp
- Mitsuhiko Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems and methods for removing an adhesively-attached component f...
- Patent number 11,553,631
- Issue date Jan 10, 2023
- Raytheon Company
- Michael Spencer Dunn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Localized rework using liquid media soldering
- Patent number 11,445,650
- Issue date Sep 13, 2022
- International Business Machines Corporation
- Theron Lee Lewis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotational removal of electronic chips and other components from pr...
- Patent number 11,343,950
- Issue date May 24, 2022
- Greene Lyon Group, Inc.
- Andre Brosseau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,310,950
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid metal infiltration rework of electronic assembly
- Patent number 11,278,977
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for discharging fluid
- Patent number 11,259,415
- Issue date Feb 22, 2022
- Senju Metal Industry Co., Ltd.
- Hideki Nakamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Personalized copper block for selective solder removal
- Patent number 11,235,404
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Composite soldering, de-soldering station and system
- Patent number 11,179,791
- Issue date Nov 23, 2021
- Hakko Corporation
- Kenji Matsuzaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for automatically clearing residual solder paste with a g...
- Patent number 11,072,033
- Issue date Jul 27, 2021
- Illinois Tool Works Inc.
- Ning Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder removal from semiconductor devices
- Patent number 11,020,811
- Issue date Jun 1, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,679,966
- Issue date Jun 9, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Removal apparatuses for semiconductor chips
- Patent number 10,629,564
- Issue date Apr 21, 2020
- Samsung Electronics Co., Ltd.
- JaeYong Park
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum pick-up confirmation system
- Patent number 10,618,127
- Issue date Apr 14, 2020
- Hakko Corp.
- Yoshitomo Teraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing a connecting medium on an assembly partner, me...
- Patent number 10,615,138
- Issue date Apr 7, 2020
- Infineon Technologies AG
- Nicolas Heuck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste misprint cleaning
- Patent number 10,576,566
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Xingquan Dong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,559,549
- Issue date Feb 11, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ball grid array rework
- Patent number 10,546,828
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Eric V. Kline
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for recovering tin-lead solder from scrap
- Patent number 10,512,981
- Issue date Dec 24, 2019
- Denis Aleksandrovich Vtulkin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of tight crack braze repair using acoustics
- Patent number 10,500,663
- Issue date Dec 10, 2019
- SIEMENS ENERGY, INC.
- Gerald J. Bruck
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Controller and a control method for a hot air blower
- Patent number 10,413,985
- Issue date Sep 17, 2019
- Hakko Corporation
- Yoshitomo Teraoka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Desoldering apparatus and method
- Patent number 10,363,623
- Issue date Jul 30, 2019
- Javon M. Gholston
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rotational removal of electronic chips and other components from pr...
- Patent number 10,362,720
- Issue date Jul 23, 2019
- Greene Lyon Group, Inc.
- Andre Brosseau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20250022838
- Publication date Jan 16, 2025
- Vahid Akhavan Attar
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD
- Publication number 20240408701
- Publication date Dec 12, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Wei Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240321816
- Publication date Sep 26, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...
- Publication number 20240297144
- Publication date Sep 5, 2024
- NCC NANO, LLC
- VAHID AKHAVAN ATTAR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
REMOVABLE STOP-OFF MATERIAL FOR BRAZING
- Publication number 20240286229
- Publication date Aug 29, 2024
- PRINCE & IZANT, LLC
- KRISTINA PAVLOVNA DYSHKO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE...
- Publication number 20240189932
- Publication date Jun 13, 2024
- Trillion Harvest Limited
- Pei-Chung PANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite Soldering, De-Soldering Station and System
- Publication number 20240165726
- Publication date May 23, 2024
- HAKKO CORPORATION
- Kenji Matsuzaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20230371221
- Publication date Nov 16, 2023
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL ASSEMBLY FABRICATION VIA BRAZING
- Publication number 20230249273
- Publication date Aug 10, 2023
- HAMILTON SUNDSTRAND CORPORATION
- Mark A. Zaffetti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, A...
- Publication number 20230017361
- Publication date Jan 19, 2023
- HIRATA CORPORATION
- Toshiomi IKEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING DEVICE
- Publication number 20220347779
- Publication date Nov 3, 2022
- CONTINENTAL AUTOMOTIVE FRANCE
- Cédric Benaben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PR...
- Publication number 20220354034
- Publication date Nov 3, 2022
- Greene Lyon Group, Inc.
- Andre BROSSEAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20220310551
- Publication date Sep 29, 2022
- Samsung Electronics Co., Ltd.
- ILHYOUNG KOO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20220232746
- Publication date Jul 21, 2022
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCT REMOVING METHOD, FLUX REMOVING METHOD, AND PRODUCT REMOVING...
- Publication number 20220203471
- Publication date Jun 30, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIKI MATSUMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING AN ADHESIVELY-ATTACHED COMPONENT F...
- Publication number 20220167536
- Publication date May 26, 2022
- Raytheon Company
- Michael Spencer Dunn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROL ASSEMBLY FABRICATION VIA BRAZING
- Publication number 20220105582
- Publication date Apr 7, 2022
- HAMILTON SUNDSTRAND CORPORATION
- Mark A. Zaffetti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL
- Publication number 20210291287
- Publication date Sep 23, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20210252621
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210114126
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY
- Publication number 20210120713
- Publication date Apr 22, 2021
- International Business Machines Corporation
- Mark K. Hoffmeyer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cleaning Pad Assembly
- Publication number 20200198039
- Publication date Jun 25, 2020
- HAKKO CORPORATION
- Mitsuhiko Miyazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Device, Soldering System And Method
- Publication number 20200156168
- Publication date May 21, 2020
- ERSA GMBH
- Meinrad Eckert
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AN APPARATUS FOR AUTOMATICALLY CLEARING RESIDUAL SOLDER PASTE WITH...
- Publication number 20200147709
- Publication date May 14, 2020
- Illinois Tool Works Inc.
- Ning Yang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATING DEVICE
- Publication number 20200061730
- Publication date Feb 27, 2020
- CONTINENTAL AUTOMOTIVE FRANCE
- Cédric Benaben
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PR...
- Publication number 20200037479
- Publication date Jan 30, 2020
- Greene Lyon Group, Inc.
- Andre BROSSEAU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190247943
- Publication date Aug 15, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREOF
- Publication number 20190140365
- Publication date May 9, 2019
- LOTES CO., LTD
- Yung Sheng Kung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES
- Publication number 20190061034
- Publication date Feb 28, 2019
- Micron Technology, Inc.
- Mark E. Tuttle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Composite Soldering, De-Soldering Station and System
- Publication number 20190047066
- Publication date Feb 14, 2019
- HAKKO CORPORATION
- Kenji Matsuzaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Unsoldering Removal of melted solder or other residues

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Substrate debonding from bonded part

Liquid metal infiltration rework of electronic assembly

Method and apparatus for debonding temporarily bonded wafers in waf...

Solder removal from semiconductor devices

Liquid metal infiltration rework of electronic assembly

Semiconductor manufacturing apparatus

Control assembly fabrication via brazing

Cleaning pad assembly

Systems and methods for removing an adhesively-attached component f...

Localized rework using liquid media soldering

Rotational removal of electronic chips and other components from pr...

Liquid metal infiltration rework of electronic assembly

Liquid metal infiltration rework of electronic assembly

Method for discharging fluid

Personalized copper block for selective solder removal

Composite soldering, de-soldering station and system

Apparatus for automatically clearing residual solder paste with a g...

Solder removal from semiconductor devices

Gallium liquid metal embrittlement for device rework

Removal apparatuses for semiconductor chips

Vacuum pick-up confirmation system

Method for producing a connecting medium on an assembly partner, me...

Solder paste misprint cleaning

Gallium liquid metal embrittlement for device rework

Ball grid array rework

Device and method for recovering tin-lead solder from scrap

Method of tight crack braze repair using acoustics

Controller and a control method for a hot air blower

Desoldering apparatus and method

Rotational removal of electronic chips and other components from pr...

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAF...

REMOVABLE STOP-OFF MATERIAL FOR BRAZING

SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE...

Composite Soldering, De-Soldering Station and System

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

CONTROL ASSEMBLY FABRICATION VIA BRAZING

SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, A...

HEATING DEVICE

ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PR...

SEMICONDUCTOR MANUFACTURING APPARATUS

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

PRODUCT REMOVING METHOD, FLUX REMOVING METHOD, AND PRODUCT REMOVING...

SYSTEMS AND METHODS FOR REMOVING AN ADHESIVELY-ATTACHED COMPONENT F...

CONTROL ASSEMBLY FABRICATION VIA BRAZING

PERSONALIZED COPPER BLOCK FOR SELECTIVE SOLDER REMOVAL

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

LIQUID METAL INFILTRATION REWORK OF ELECTRONIC ASSEMBLY

Cleaning Pad Assembly

Soldering Device, Soldering System And Method

AN APPARATUS FOR AUTOMATICALLY CLEARING RESIDUAL SOLDER PASTE WITH...

HEATING DEVICE

ROTATIONAL REMOVAL OF ELECTRONIC CHIPS AND OTHER COMPONENTS FROM PR...

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

ELECTRICAL CONNECTOR AND MANUFACTURING METHOD THEREOF

SOLDER REMOVAL FROM SEMICONDUCTOR DEVICES

Composite Soldering, De-Soldering Station and System