3363818

Information

• Patent Grant
• 3363818

• References
• Source

• Patent Number

  3,363,818

• Date Filed

  Not available

• Date Issued

  Tuesday, January 16, 1968
  57 years ago

• CPC

  • H01L21/67138 - Apparatus for wiring semiconductor or solid state device
  • B21C47/34 - Feeding or guiding devices not specially adapted to a particular type of apparatus
  • B21C47/3475 - Fluid pressure or vacuum
  • B65H49/18 - Methods or apparatus in which packages rotate
  • B65H2701/31 - Textiles threads or artificial strands of filaments

• US Classifications

  • 228 - Metal fusion bonding
  • 219 - Electric heating