Apparatus for wiring semiconductor or solid state device

Industry

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H01L21/67138

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/67138Apparatus for wiring semiconductor or solid state device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Wire tension adjustment method and wire tension adjuster
- Patent number 12,154,801
- Issue date Nov 26, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method of providing a ramped interconnect fo...
- Patent number 11,862,492
- Issue date Jan 2, 2024
- Jabil Inc.
- Lim Lai Ming
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Device for attaching conductive ball to substrate with plurality of...
- Patent number 11,515,181
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Tae Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 11,495,524
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,282,917
- Issue date Mar 22, 2022
- Renesas Electronics Corporation
- Kazuhiko Iwakiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing organic cured film on substrate, and acidic cle...
- Patent number 11,222,781
- Issue date Jan 11, 2022
- Tokyo Ohka Kogyo Co., Ltd.
- Isao Hirano
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Solar cell panel, and apparatus and method for attaching interconne...
- Patent number 11,152,524
- Issue date Oct 19, 2021
- LG Electronics Inc.
- Donghae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup head with photocurable polymers for assembling light emittin...
- Patent number 11,101,159
- Issue date Aug 24, 2021
- Facebook Technologies, LLC
- Daniel Brodoceanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method of providing a ramped interconnect fo...
- Patent number 11,081,375
- Issue date Aug 3, 2021
- Jabil Inc.
- Lim Lai Ming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Creating an aligned via and metal line in an integrated circuit inc...
- Patent number 11,081,387
- Issue date Aug 3, 2021
- Marvell Asia Pte, Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for joining a micorelectronic chip to a wire element
- Patent number 11,081,466
- Issue date Aug 3, 2021
- PRIMO1D
- Delphine Rolland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standard cell for removing routing interference between adjacent pi...
- Patent number 11,031,385
- Issue date Jun 8, 2021
- Samsung Electronics Co., Ltd.
- Jae-Woo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming self-aligned vias and air gaps
- Patent number 10,840,186
- Issue date Nov 17, 2020
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, system, and method of providing a ramped interconnect fo...
- Patent number 10,790,172
- Issue date Sep 29, 2020
- Jabil Inc.
- Lim Lai Ming
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser-based systems and methods for melt-processing of metal layers...
- Patent number 10,665,504
- Issue date May 26, 2020
- Veeco Instruments Inc.
- Serguei Anikitchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process integration method to tune resistivity of nickel silicide
- Patent number 10,651,043
- Issue date May 12, 2020
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solar cell panel, and apparatus and method for attaching interconne...
- Patent number 10,586,882
- Issue date Mar 10, 2020
- LG Electronics Inc.
- Donghae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and method of estimating position of landing poin...
- Patent number 10,586,781
- Issue date Mar 10, 2020
- Shinkawa Ltd.
- Shigeru Hayata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Standard cell for removing routing interference between adjacent pi...
- Patent number 10,553,574
- Issue date Feb 4, 2020
- Samsung Electronics Co., Ltd.
- Jae-Woo Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of producing fully self-aligned vias and contacts
- Patent number 10,553,485
- Issue date Feb 4, 2020
- Micromaterials LLC
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating aligned vias in ultra-high density integrated ci...
- Patent number 10,522,394
- Issue date Dec 31, 2019
- Marvell World Trade Ltd.
- Runzi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device including tungsten layer
- Patent number 10,438,954
- Issue date Oct 8, 2019
- Micron Technology, Inc.
- Kenichi Kusumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,424,510
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 10,403,505
- Issue date Sep 3, 2019
- Ebara Corporation
- Kenya Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process integration method to tune resistivity of nickel silicide
- Patent number 10,388,533
- Issue date Aug 20, 2019
- Applied Materials, Inc.
- He Ren
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Solder fill into high aspect through holes
- Patent number 10,388,566
- Issue date Aug 20, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Equipment for manufacturing semiconductor devices and method for us...
- Patent number 10,319,619
- Issue date Jun 11, 2019
- Samsung Electronics Co., Ltd.
- BongJin Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for wetting pretreatment for through resist m...
- Patent number 10,301,738
- Issue date May 28, 2019
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Manufacturing apparatus of light-emitting element
- Patent number 10,269,597
- Issue date Apr 23, 2019
- Japan Display Inc.
- Takaaki Ishikawa
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
WIRE TENSION ADJUSTMENT METHOD AND WIRE TENSION ADJUSTER
- Publication number 20240297055
- Publication date Sep 5, 2024
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RE...
- Publication number 20240242984
- Publication date Jul 18, 2024
- SHINKAWA LTD.
- Hiroyuki KASAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND COMPUTING SYSTEM FOR MANUFACTURING THREE-DIMENSIONAL SEM...
- Publication number 20240213054
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Youngsik OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...
- Publication number 20240178016
- Publication date May 30, 2024
- Jabil Inc.
- Lim Lai Ming
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INERTIAL SENSOR, METHOD OF MANUFACTURING INERTIAL SENSOR, AND INERT...
- Publication number 20240003933
- Publication date Jan 4, 2024
- SEIKO EPSON CORPORATION
- Teruo Takizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20230057405
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...
- Publication number 20220319870
- Publication date Oct 6, 2022
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...
- Publication number 20220093424
- Publication date Mar 24, 2022
- Jabil Inc.
- Lim Lai Ming
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066445
- Publication date Mar 4, 2021
- RENESAS ELECTRONICS CORPORATION
- Kazuhiko IWAKIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...
- Publication number 20200395231
- Publication date Dec 17, 2020
- Jabil Inc.
- Lim Lai Ming
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLAR CELL PANEL, AND APPARATUS AND METHOD FOR ATTACHING INTERCONNE...
- Publication number 20200227580
- Publication date Jul 16, 2020
- LG ELECTRONICS INC.
- Donghae OH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
STANDARD CELL FOR REMOVING ROUTING INTERFERENCE BETWEEN ADJACENT PI...
- Publication number 20200126968
- Publication date Apr 23, 2020
- Samsung Electronics Co., Ltd.
- Jae-Woo SEO
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CREATING AN ALIGNED VIA AND METAL LINE IN AN INTEGRATED CIRCUIT INC...
- Publication number 20200118868
- Publication date Apr 16, 2020
- Marvell World Trade Ltd.
- Runzi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR ATTACHING CONDUCTIVE BALL TO SUBSTRATE
- Publication number 20200105553
- Publication date Apr 2, 2020
- Samsung Electronics Co., Ltd.
- Tae Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...
- Publication number 20200058527
- Publication date Feb 20, 2020
- Jabil Inc.
- Lim Lai Ming
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20190378783
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESS INTEGRATION METHOD TO TUNE RESISTIVITY OF NICKEL SILICIDE
- Publication number 20190371610
- Publication date Dec 5, 2019
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Self-Aligned Vias And Air Gaps
- Publication number 20190348368
- Publication date Nov 14, 2019
- Applied Materials, Inc.
- Susmit Singha Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING ORGANIC CURED FILM ON SUBSTRATE, AND ACIDIC CLE...
- Publication number 20190198314
- Publication date Jun 27, 2019
- Tokyo Ohka Kogyo Co., Ltd.
- Isao HIRANO
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
PRECISE ASSEMBLY MECHANISM
- Publication number 20190096718
- Publication date Mar 28, 2019
- CHIH-MENG WU
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF CREATING ALIGNED VIAS IN ULTRA-HIGH DENSITY INTEGRATED CI...
- Publication number 20190096756
- Publication date Mar 28, 2019
- Marvell World Trade Ltd.
- Runzi CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser-Based Systems and Methods for Melt-Processing of Metal Layers...
- Publication number 20190035682
- Publication date Jan 31, 2019
- Ultratech, Inc.
- Serguei Anikitchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Semiconductor Device Including Tungsten Layer
- Publication number 20190035793
- Publication date Jan 31, 2019
- Micron Technology, Inc.
- Kenichi Kusumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Producing Fully Self-Aligned Vias And Contacts
- Publication number 20180374750
- Publication date Dec 27, 2018
- Micromaterials LLC.
- Ying Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS INTEGRATION METHOD TO TUNE RESISTIVITY OF NICKEL SILICIDE
- Publication number 20180366328
- Publication date Dec 20, 2018
- Applied Materials, Inc.
- He REN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COB DIE BONDING AND WIRE BONDING SYSTEM AND METHOD
- Publication number 20180286714
- Publication date Oct 4, 2018
- SOUTH CHINA NORMAL UNIVERSITY
- Miao HE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Forming Semiconductor Device Including Tungsten Layer
- Publication number 20180083010
- Publication date Mar 22, 2018
- Micron Technology, Inc.
- Kenichi Kusumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY
- Publication number 20180082868
- Publication date Mar 22, 2018
- Alcatel-Lucent Canada Inc.
- Paul J. BROWN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...
- Publication number 20180023209
- Publication date Jan 25, 2018
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DEFECT INSPECTION AND REPAIRING METHOD AND ASSOCIATED SYSTEM AND NO...
- Publication number 20180019166
- Publication date Jan 18, 2018
- Taiwan Semiconductor Manufacturing company Ltd.
- NAI-HAN CHENG
- H01 - BASIC ELECTRIC ELEMENTS

Apparatus for wiring semiconductor or solid state device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wire tension adjustment method and wire tension adjuster

QFN device having a mechanism that enables an inspectable solder jo...

Apparatus, system, and method of providing a ramped interconnect fo...

Device for attaching conductive ball to substrate with plurality of...

QFN device having a mechanism that enables an inspectable solder jo...

Semiconductor device and method of manufacturing the same

Method for removing organic cured film on substrate, and acidic cle...

Solar cell panel, and apparatus and method for attaching interconne...

Pickup head with photocurable polymers for assembling light emittin...

Apparatus, system, and method of providing a ramped interconnect fo...

Creating an aligned via and metal line in an integrated circuit inc...

Method for joining a micorelectronic chip to a wire element

Standard cell for removing routing interference between adjacent pi...

Methods of forming self-aligned vias and air gaps

Apparatus, system, and method of providing a ramped interconnect fo...

Laser-based systems and methods for melt-processing of metal layers...

Process integration method to tune resistivity of nickel silicide

Solar cell panel, and apparatus and method for attaching interconne...

Bonding apparatus and method of estimating position of landing poin...

Standard cell for removing routing interference between adjacent pi...

Methods of producing fully self-aligned vias and contacts

Method of creating aligned vias in ultra-high density integrated ci...

Method of forming semiconductor device including tungsten layer

Solder fill into high aspect through holes

Substrate processing method and substrate processing apparatus

Process integration method to tune resistivity of nickel silicide

Solder fill into high aspect through holes

Equipment for manufacturing semiconductor devices and method for us...

Methods and apparatus for wetting pretreatment for through resist m...

Manufacturing apparatus of light-emitting element

Patents Applicationslast 30 patents

WIRE TENSION ADJUSTMENT METHOD AND WIRE TENSION ADJUSTER

WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RE...

METHOD AND COMPUTING SYSTEM FOR MANUFACTURING THREE-DIMENSIONAL SEM...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...

INERTIAL SENSOR, METHOD OF MANUFACTURING INERTIAL SENSOR, AND INERT...

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

PACKAGING STRUCTURE RADIATING ELECTROMAGNETIC WAVES IN HORIZONTAL D...

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...

SOLAR CELL PANEL, AND APPARATUS AND METHOD FOR ATTACHING INTERCONNE...

STANDARD CELL FOR REMOVING ROUTING INTERFERENCE BETWEEN ADJACENT PI...

CREATING AN ALIGNED VIA AND METAL LINE IN AN INTEGRATED CIRCUIT INC...

DEVICE FOR ATTACHING CONDUCTIVE BALL TO SUBSTRATE

APPARATUS, SYSTEM, AND METHOD OF PROVIDING A RAMPED INTERCONNECT FO...

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

PROCESS INTEGRATION METHOD TO TUNE RESISTIVITY OF NICKEL SILICIDE

Methods Of Forming Self-Aligned Vias And Air Gaps

METHOD FOR REMOVING ORGANIC CURED FILM ON SUBSTRATE, AND ACIDIC CLE...

PRECISE ASSEMBLY MECHANISM

METHOD OF CREATING ALIGNED VIAS IN ULTRA-HIGH DENSITY INTEGRATED CI...

Laser-Based Systems and Methods for Melt-Processing of Metal Layers...

Method of Forming Semiconductor Device Including Tungsten Layer

Methods Of Producing Fully Self-Aligned Vias And Contacts

PROCESS INTEGRATION METHOD TO TUNE RESISTIVITY OF NICKEL SILICIDE

COB DIE BONDING AND WIRE BONDING SYSTEM AND METHOD

Method of Forming Semiconductor Device Including Tungsten Layer

GRAVITY FORCE COMPENSATION PLATE FOR UPSIDE DOWN BALL GRID ARRAY

METHODS AND APPARATUS FOR WETTING PRETREATMENT FOR THROUGH RESIST M...

DEFECT INSPECTION AND REPAIRING METHOD AND ASSOCIATED SYSTEM AND NO...