3384791

Information

• Patent Grant
• 3384791

• References
• Source

• Patent Number

  3,384,791

• Date Filed

  Not available

• Date Issued

  Tuesday, May 21, 1968
  56 years ago

• CPC

  • H01L21/74 - Making of localized buried regions
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • Y10S148/031 - Diffusion at an edge
  • Y10S148/037 - Diffusion-deposition
  • Y10S148/05 - Etch and refill
  • Y10S148/085 - Isolated-integrated

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment