3424627

Information

• Patent Grant
• 3424627

• References
• Source

• Patent Number

  3,424,627

• Date Filed

  Not available

• Date Issued

  Tuesday, January 28, 1969
  56 years ago

• CPC

  • H01L23/482 - consisting of lead-in layers inseparably applied to the semiconductor body
  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L27/00 - Devices consisting of a plurality of semiconductor or other solid state components formed in or on a common substrate
  • H01L2224/48463 - the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
  • H01L2224/49107 - on the semiconductor or solid-state body
  • H01L2224/4918 - being disposed on at least two different sides of the body
  • H01L2924/12032 - Schottky diode
  • Y10S148/051 - Etching
  • Y10S148/106 - Masks, special
  • Y10S148/142 - Semiconductor-metal-semiconductor

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 148 - Metal treatment
  • 257 - Active solid-state devices
  • 427 - Coating processes