consisting of lead-in layers inseparably applied to the semiconductor body

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H01L23/482

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

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H01L23/482consisting of lead-in layers inseparably applied to the semiconductor body

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Open cavity bridge co-planar placement architectures and processes
- Patent number 12,176,268
- Issue date Dec 24, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for forming the same
- Patent number 12,159,814
- Issue date Dec 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 12,142,605
- Issue date Nov 12, 2024
- Mitsubishi Electric Corporation
- Koichi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,142,547
- Issue date Nov 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Yuki Yanagisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat slug attached to a die pad for semiconductor package
- Patent number 12,136,588
- Issue date Nov 5, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symmetric FET for RF nonlinearity improvement
- Patent number 12,113,057
- Issue date Oct 8, 2024
- pSemi Corporation
- Tero Tapio Ranta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,112,999
- Issue date Oct 8, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro assembled LED displays and lighting elements
- Patent number 12,080,690
- Issue date Sep 3, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated semiconductor device
- Patent number 12,074,093
- Issue date Aug 27, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Manabu Yanagihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die contact structure and method
- Patent number 12,074,127
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,068,384
- Issue date Aug 20, 2024
- Mitsubishi Electric Corporation
- Yutaro Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,057,374
- Issue date Aug 6, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with separate communication and heat dissipation paths
- Patent number 12,040,249
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Sreenivasan Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device topology for lateral power transistors with low common sourc...
- Patent number 12,040,257
- Issue date Jul 16, 2024
- GaN Systems Inc.
- Ahmad Mizan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Open cavity bridge power delivery architectures and processes
- Patent number 12,027,448
- Issue date Jul 2, 2024
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device topologies for high current lateral power semiconductor devices
- Patent number 12,027,449
- Issue date Jul 2, 2024
- GaN Systems Inc.
- Hossein Mousavian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked semiconductor device including a hybrid bond con...
- Patent number 12,015,010
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an electrically insulating core with e...
- Patent number 12,014,964
- Issue date Jun 18, 2024
- Infineon Technologies AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices
- Patent number 11,996,457
- Issue date May 28, 2024
- Samsung Electronics Co., Ltd.
- Hyuncheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap seal for interconnect air gap and method of fabricating the...
- Patent number 11,996,353
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap type semiconductor device package structure
- Patent number 11,979,136
- Issue date May 7, 2024
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION
- Yunxiang Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,973,007
- Issue date Apr 30, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip semiconductor-on-insulator transistor layout
- Patent number 11,973,033
- Issue date Apr 30, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 11,967,543
- Issue date Apr 23, 2024
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,948,864
- Issue date Apr 2, 2024
- Kabushiki Kaisha Toshiba
- Akira Yoshioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,942,431
- Issue date Mar 26, 2024
- Kioxia Corporation
- Nobuyuki Momo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package with at least one heat ext...
- Patent number 11,942,389
- Issue date Mar 26, 2024
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Group III Nitride Doherty Amplifier Using Different Epitaxial Struc...
- Publication number 20240429870
- Publication date Dec 26, 2024
- MACOM Technology Solutions Holdings, Inc.
- Matthew Mellor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER
- Publication number 20240423103
- Publication date Dec 19, 2024
- TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
- Kunliang BU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT
- Publication number 20240404952
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Yang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240404921
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Features with Air Spacer and Method of Forming Same
- Publication number 20240387332
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiang-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING RC DELAY IN SEMICONDUCTOR DEVICES
- Publication number 20240379563
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gulbagh Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379504
- Publication date Nov 14, 2024
- Zhuhai YUEXIN Semiconductor Limited Liability Company
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...
- Publication number 20240339381
- Publication date Oct 10, 2024
- Intel Corporation
- Hiroki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...
- Publication number 20240332099
- Publication date Oct 3, 2024
- INFINEON TECHNOLOGIES AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN...
- Publication number 20240332322
- Publication date Oct 3, 2024
- Intel Corporation
- Srinivasan Raman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE
- Publication number 20240324169
- Publication date Sep 26, 2024
- KIOXIA Corporation
- Reiko SUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...
- Publication number 20240312876
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Xusheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240312875
- Publication date Sep 19, 2024
- Kabushiki Kaisha Toshiba
- Rie ARIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertically Stacked Semiconductor Device Including a Hybrid Bond Con...
- Publication number 20240304601
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304523
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...
- Publication number 20240304522
- Publication date Sep 12, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...
- Publication number 20240282675
- Publication date Aug 22, 2024
- ROHM CO., LTD.
- Toshio HANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240266258
- Publication date Aug 8, 2024
- ROHM CO., LTD.
- Kentaro CHIKAMATSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION
- Publication number 20240250003
- Publication date Jul 25, 2024
- Skyworks Solutions, Inc.
- Hailing Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT
- Publication number 20240213242
- Publication date Jun 27, 2024
- REALTEK SEMICONDUCTOR CORPORATION
- Tzu-Chieh WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240213122
- Publication date Jun 27, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Kenichi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHYSICAL UNCLONABLE FUNCTIONS WITH SILICON-RICH DIELECTRIC DEVICES
- Publication number 20240213182
- Publication date Jun 27, 2024
- Michael Kozicki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT
- Publication number 20240186220
- Publication date Jun 6, 2024
- INFINEON TECHNOLOGIES AG
- Andre Schmenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUP III NITRIDE TRANSISTOR DEVICE
- Publication number 20240170487
- Publication date May 23, 2024
- Infineon Technologies Austria AG
- Bhargav Pandya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240162165
- Publication date May 16, 2024
- ROHM CO., LTD.
- Keita SHIKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY
- Publication number 20240153850
- Publication date May 9, 2024
- Semiconductor Components Industries, LLC
- Jimmy Robert Hannes FRANCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS
- Publication number 20240153927
- Publication date May 9, 2024
- X Display Company Technology Limited
- Christopher Bower
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA
- Publication number 20240145346
- Publication date May 2, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Joo PARK
- H01 - BASIC ELECTRIC ELEMENTS

consisting of lead-in layers inseparably applied to the semiconductor body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Open cavity bridge co-planar placement architectures and processes

Semiconductor packages and methods for forming the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Heat slug attached to a die pad for semiconductor package

Through-substrate via structure and method of manufacture

Symmetric FET for RF nonlinearity improvement

RF devices with enhanced performance and methods of forming the same

Molded packaging for wide band gap semiconductor devices

Micro assembled LED displays and lighting elements

Integrated semiconductor device

Semiconductor die contact structure and method

Semiconductor device

RF devices with enhanced performance and methods of forming the same

Packages with separate communication and heat dissipation paths

Device topology for lateral power transistors with low common sourc...

Open cavity bridge power delivery architectures and processes

Device topologies for high current lateral power semiconductor devices

Vertically stacked semiconductor device including a hybrid bond con...

Semiconductor package having an electrically insulating core with e...

Semiconductor devices

Air gap seal for interconnect air gap and method of fabricating the...

Air gap type semiconductor device package structure

Power module semiconductor device and inverter equipment, and fabri...

Flip-chip semiconductor-on-insulator transistor layout

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor device

Thin semiconductor package for notched semiconductor die

Semiconductor device and manufacturing method thereof

Thermally enhanced semiconductor package with at least one heat ext...

Patents Applicationslast 30 patents

Group III Nitride Doherty Amplifier Using Different Epitaxial Struc...

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

AIR BRIDGE PREPARATION METHOD, QUANTUM CHIP, AND QUANTUM COMPUTER

FLIP-CHIP SEMICONDUCTOR-ON-INSULATOR TRANSISTOR LAYOUT

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Conductive Features with Air Spacer and Method of Forming Same

REDUCING RC DELAY IN SEMICONDUCTOR DEVICES

SIDE-EXPOSED EMBEDDED TRACE SUBSTRATE AND MANUFACTURING METHOD THEREOF

AIR-GAP TRACES AND AIR-GAP EMBEDDED BRIDGE INTEGRATED IN GLASS INTE...

SEMICONDUCTOR PACKAGE HAVING AN ELECTRICALLY INSULATING CORE WITH E...

INDUCTORLESS CIRCUITS FOR CURRENT-VOLTAGE CONTROL AND REGULATION IN...

MEMORY DEVICE

Air Gap Seal for Interconnect Air Gap and Method of Fabricating The...

SEMICONDUCTOR DEVICE

Vertically Stacked Semiconductor Device Including a Hybrid Bond Con...

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

CIRCUIT STRUCTURE INCLUDING AT LEAST ONE AIR GAP AND METHOD FOR MAN...

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

POWER MODULE SEMICONDUCTOR DEVICE AND INVERTER EQUIPMENT, AND FABRI...

SEMICONDUCTOR DEVICE

FIELD-EFFECT TRANSISTORS WITH INTERLEAVED FINGER CONFIGURATION

INTEGRATED CIRCUIT AND LOW DROP-OUT LINEAR REGULATOR CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PHYSICAL UNCLONABLE FUNCTIONS WITH SILICON-RICH DIELECTRIC DEVICES

ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT

GROUP III NITRIDE TRANSISTOR DEVICE

NITRIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

TRANSISTORS WITH SELECTIVELY LANDED GATE ARRAY

MICRO ASSEMBLED LED DISPLAYS AND LIGHTING ELEMENTS

SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIA