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Chip package structure
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Patent number 12,255,173
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Issue date Mar 18, 2025
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Taiwan Semiconductor Manufacturing Company, Ltd
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Ling-Wei Li
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H01 - BASIC ELECTRIC ELEMENTS
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Offset pads over TSV
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Patent number 12,243,851
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Issue date Mar 4, 2025
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Bongsub Lee
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H01 - BASIC ELECTRIC ELEMENTS
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Transistor
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Patent number 12,230,626
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Issue date Feb 18, 2025
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Japan Display Inc.
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Toshinari Sasaki
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G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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TSV as pad
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Patent number 12,205,926
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Issue date Jan 21, 2025
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ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
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Guilian Gao
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H01 - BASIC ELECTRIC ELEMENTS
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Power converter
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Patent number 12,183,774
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Issue date Dec 31, 2024
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Mitsubishi Electric Corporation
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Shiro Hino
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H01 - BASIC ELECTRIC ELEMENTS
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Semiconductor device
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Patent number 12,142,547
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Issue date Nov 12, 2024
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SONY SEMICONDUCTOR SOLUTIONS CORPORATION
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Yuki Yanagisawa
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H01 - BASIC ELECTRIC ELEMENTS
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-
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Integrated semiconductor device
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Patent number 12,074,093
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Issue date Aug 27, 2024
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PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
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Manabu Yanagihara
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H01 - BASIC ELECTRIC ELEMENTS
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