3424890

Information

• Patent Grant
• 3424890

• References
• Source

• Patent Number

  3,424,890

• Date Filed

  Not available

• Date Issued

  Tuesday, January 28, 1969
  56 years ago

• CPC

  • B29C66/0016 - Liquid environments
  • B29C65/1435 - at least passing through one of the parts to be joined
  • B29C65/1635 - at least passing through one of the parts to be joined
  • B29C66/001 - Joining in special atmospheres
  • B29C66/00143 - Active gases
  • B29C66/0342 - Cooling
  • B29C66/73 - characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
  • C30B33/00 - After-treatment of single crystals or homogeneous polycrystalline material with defined structure
  • H01L21/187 - by direct bonding
  • H01L21/46 - Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
  • H01L35/08 - non-detachable
  • B29C65/1612 - Infrared [IR] radiation
  • B29C65/1616 - Near infrared radiation [NIR]
  • B29C65/1619 - Mid infrared radiation [MIR]
  • B29C66/02 - Preparation of the material, in the area to be joined, prior to joining or welding
  • B29C66/0242 - Heating, or preheating
  • B29C66/026 - Chemical pre-treatments
  • B29K2705/00 - Use of metals, their alloys or their compounds, for preformed parts
  • B29K2995/0005 - Conductive
  • Y10S148/049 - Equivalence and options
  • Y10S148/072 - Heterojunctions
  • Y10S148/093 - Laser beam treatment in general

• US Classifications

  • 219 - Electric heating
  • 148 - Metal treatment
  • 257 - Active solid-state devices