3553824

Information

• Patent Grant
• 3553824

• References
• Source

• Patent Number

  3,553,824

• Date Filed

  Not available

• Date Issued

  Tuesday, January 12, 1971
  54 years ago

• CPC

  • H05K3/3468 - Applying molten solder
  • B23K1/085 - Wave soldering
  • H05K3/3494 - Heating methods for reflowing of solder
  • H05K3/3447 - Lead-in-hole components
  • H05K2203/0445 - Removing excess solder on pads removing solder bridges
  • H05K2203/1105 - Heating or thermal processing not related to soldering, firing, curing or laminating
  • Y10T29/49121 - Beam lead frame or beam lead device
  • Y10T29/49155 - Manufacturing circuit on or in base
  • Y10T29/49224 - with coating

• US Classifications

  • 228 - Metal fusion bonding
  • 029 - Metal working