3600649

Information

• Patent Grant
• 3600649

• References
• Source

• Patent Number

  3,600,649

• Date Filed

  Not available

• Date Issued

  Tuesday, August 17, 1971
  53 years ago

• CPC

  • H01L21/00 - Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • F01C19/005 - Structure and composition of sealing elements such as sealing strips, sealing rings and the like; Coating of these elements
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • Y10S148/098 - Layer conversion
  • Y10S438/936 - Graded energy gap

• US Classifications

  • 257 - Active solid-state devices
  • 148 - Metal treatment
  • 438 - Semiconductor device manufacturing: process