3741858

Information

• Patent Grant
• 3741858

• References
• Source

• Patent Number

  3,741,858

• Date Filed

  Not available

• Date Issued

  Tuesday, June 26, 1973
  51 years ago

• CPC

  • H05K3/386 - by the use of an organic polymeric bonding layer
  • C08G59/4021 - Ureas; Thioureas; Guanidines; Dicyandiamides
  • C08G59/4071 - phosphorus containing compounds
  • C08G59/5066 - Aziridines or their derivatives
  • C08L63/00 - Compositions of epoxy resins Compositions of derivatives of epoxy resins
  • H01B3/40 - epoxy resins
  • H05K2201/0355 - Metal foils
  • Y10S428/901 - Printed circuit
  • Y10T428/24917 - including metal layer
  • Y10T428/31518 - Next to glass or quartz
  • Y10T428/31525 - Next to glass or quartz

• US Classifications

  • 428 - Stock material or miscellaneous articles
  • 156 - Adhesive bonding and miscellaneous chemical manufacture