by the use of an organic polymeric bonding layer

Industry

CPC
H05K3/386

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/386by the use of an organic polymeric bonding layer

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
- Patent number 12,213,249
- Issue date Jan 28, 2025
- Sumitomo Electric Industries, Ltd.
- Shingo Kaimori
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wafer level bump stack for chip scale package
- Patent number 12,177,988
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically conductive adhesive, electronic circuit using the same...
- Patent number 12,171,062
- Issue date Dec 17, 2024
- Toyo Aluminum Kabushiki Kaisha
- Toshio Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 12,150,248
- Issue date Nov 19, 2024
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
- Patent number 12,144,125
- Issue date Nov 12, 2024
- Nitto Denko Corporation
- Takahiro Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition and article made therefrom
- Patent number 12,134,682
- Issue date Nov 5, 2024
- ELITE MATERIAL CO., LTD.
- Tse-Hung Liu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and fabricating method thereof, and displayin...
- Patent number 12,082,337
- Issue date Sep 3, 2024
- Chengdu BOE Optoelectronics Technology Co., Ltd.
- Jiaxiang Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-clad laminate
- Patent number 11,950,376
- Issue date Apr 2, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Toshihiro Hosoi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of improving the adhesion strength of metal-organic interfac...
- Patent number 11,919,036
- Issue date Mar 5, 2024
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Application of electrical conductors of a solar cell
- Patent number 11,877,402
- Issue date Jan 16, 2024
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for encapsulating an electronic component
- Patent number 11,832,398
- Issue date Nov 28, 2023
- Acleap Power Inc.
- Evan Cosentino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Application of electrical conductors to an electrically insulating...
- Patent number 11,832,395
- Issue date Nov 28, 2023
- Landa Labs (2012) LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
- Patent number 11,818,849
- Issue date Nov 14, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a pattern to a substrate
- Patent number 11,751,336
- Issue date Sep 5, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
- Patent number 11,716,818
- Issue date Aug 1, 2023
- LG Chem, Ltd.
- Yong Goo Son
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure and manufacturing method thereof
- Patent number 11,665,832
- Issue date May 30, 2023
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,582,872
- Issue date Feb 14, 2023
- Avary Holding (Shenzhen) Co., Limited.
- Ke-Jian Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible membrane for applying a pattern to a substrate
- Patent number 11,570,902
- Issue date Jan 31, 2023
- Lumet Technologies, LTD.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying of a conductive pattern to a substrate
- Patent number 11,546,999
- Issue date Jan 3, 2023
- Lumet Technologies Ltd.
- Benzion Landa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having first and second component carrier parts w...
- Patent number 11,527,807
- Issue date Dec 13, 2022
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Fabrizio Gentili
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flexible printed circuit board and flexible printe...
- Patent number 11,523,518
- Issue date Dec 6, 2022
- Sumitomo Electric Printed Circuits, Inc.
- Kou Noguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive laminated structure, a manufacturing method thereof, and...
- Patent number 11,510,323
- Issue date Nov 22, 2022
- Yungu (Gu'an) Technology Co., Ltd.
- Yu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride ceramic resin composite body
- Patent number 11,492,299
- Issue date Nov 8, 2022
- DENKA COMPANY LIMITED
- Yoshitaka Minakata
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of manufacturing a flow measuring device having a rotatable...
- Patent number 11,454,527
- Issue date Sep 27, 2022
- Encite LLC
- Stephen Alan Marsh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interfacial layer for high resolution lithography (HRL) and high sp...
- Patent number 11,445,616
- Issue date Sep 13, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
- Patent number 11,439,023
- Issue date Sep 6, 2022
- Honeywell Federal Manufacturing & Technologies, LLC
- Jonathan Douglas Hatch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Processing method and processing system of a flexible substrate
- Patent number 11,430,351
- Issue date Aug 30, 2022
- BOE Technology Group Co., Ltd.
- Weiyun Huang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Interlayer insulating film and method for producing same
- Patent number 11,432,400
- Issue date Aug 30, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Masaharu Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods for improved polymer-copper adhesion
- Patent number 11,388,822
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fluororesin base material, printed wiring board, and circuit module
- Patent number 11,364,714
- Issue date Jun 21, 2022
- SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
- Satoshi Kiya
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
CROSSLINKED POLYESTER RESIN, ADHESIVE AGENT COMPOSITION, AND ADHESI...
- Publication number 20240409782
- Publication date Dec 12, 2024
- Toyobo Co., Ltd.
- Shoko UCHIYAMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
- Publication number 20240357749
- Publication date Oct 24, 2024
- Yield Engineering Systems, Inc.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...
- Publication number 20240235004
- Publication date Jul 11, 2024
- DAI NIPPON PRINTING CO., LTD.
- Kazuki KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...
- Publication number 20240224416
- Publication date Jul 4, 2024
- BOE TECHNOLOGY GROUP CO., LTD.
- Jiaxiang ZHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
- Publication number 20240091528
- Publication date Mar 21, 2024
- ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Florian FALLEGGER
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
- Publication number 20240057250
- Publication date Feb 15, 2024
- Koninklijke Philips N.V.
- FRANCIS KUSTI MAKIE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
- Publication number 20230331916
- Publication date Oct 19, 2023
- ELITE MATERIAL CO., LTD.
- Tse-Hung LIU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
- Publication number 20230328897
- Publication date Oct 12, 2023
- Showa Denko Materials Co., Ltd.
- Hiroyuki IZAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE, ELECTRONIC CIRCUIT USING THE SAME...
- Publication number 20230319988
- Publication date Oct 5, 2023
- TOYO ALUMINIUM KABUSHIKI KAISHA
- Toshio NAKATANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20230292445
- Publication date Sep 14, 2023
- LANDA LABS (2012) LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
- Publication number 20230276579
- Publication date Aug 31, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Daisuke NAKAJIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Application of Electrical Conductors of a Solar Cell
- Publication number 20230129839
- Publication date Apr 27, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Encapsulating an Electronic Component
- Publication number 20230115061
- Publication date Apr 13, 2023
- ABB Schweiz AG
- Evan Cosentino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR APPLYING A PATTERN TO A SUBSTRATE
- Publication number 20230087822
- Publication date Mar 23, 2023
- Lumet Technologies LTD.
- Benzion LANDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...
- Publication number 20230085997
- Publication date Mar 23, 2023
- Intel Corporation
- Yi Yang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...
- Publication number 20230072115
- Publication date Mar 9, 2023
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- JONATHAN DOUGLAS HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
- Publication number 20230018333
- Publication date Jan 19, 2023
- NHK Spring Co., Ltd.
- Takeshi Kawakami
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING DIELECTRIC SHEET, METHOD FOR MANUFACTURING...
- Publication number 20220272838
- Publication date Aug 25, 2022
- Sumitomo Electric Industries, Ltd.
- Shingo KAIMORI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220256717
- Publication date Aug 11, 2022
- Unimicron Technology Corp.
- John Hon-Shing Lau
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...
- Publication number 20220151069
- Publication date May 12, 2022
- Mitsui Chemicals, Inc.
- Taichi KOYAMA
- G01 - MEASURING TESTING
Information Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
- Publication number 20220132675
- Publication date Apr 28, 2022
- LG CHEM, LTD.
- Yong Goo SON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for Improved Polymer-Copper Adhesion
- Publication number 20220071023
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...
- Publication number 20220070998
- Publication date Mar 3, 2022
- KIOXIA Corporation
- Daigo SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
- Publication number 20210345495
- Publication date Nov 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...
- Publication number 20210289633
- Publication date Sep 16, 2021
- HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
- JONATHAN DOUGLAS HATCH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
- Publication number 20210227698
- Publication date Jul 22, 2021
- LANDA LABS (2012) LTD.
- Benzion LANDA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PATTERN-TRANSFERRED OBJECT MANUFACTURING METHOD
- Publication number 20210219433
- Publication date Jul 15, 2021
- MITSUBISHI PAPER MILLS LIMITED
- Shigeki Shino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

by the use of an organic polymeric bonding layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for manufacturing dielectric sheet, method for manufacturing...

Wafer level bump stack for chip scale package

Electrically conductive adhesive, electronic circuit using the same...

System for providing dynamic feedback for selective adhesion PCB pr...

Pressure-sensitive adhesive sheet-including wiring circuit board an...

Resin composition and article made therefrom

Printed circuit board and fabricating method thereof, and displayin...

Copper-clad laminate

Method of improving the adhesion strength of metal-organic interfac...

Application of electrical conductors of a solar cell

Apparatus and method for encapsulating an electronic component

Application of electrical conductors to an electrically insulating...

Increasing adhesion of metal-organic interfaces by silane vapor tre...

Method for applying a pattern to a substrate

Embedded-type transparent electrode substrate and method for manufa...

Circuit board structure and manufacturing method thereof

Circuit board

Flexible membrane for applying a pattern to a substrate

Apparatus for applying of a conductive pattern to a substrate

Electronic device having first and second component carrier parts w...

Method of making flexible printed circuit board and flexible printe...

Conductive laminated structure, a manufacturing method thereof, and...

Nitride ceramic resin composite body

Method of manufacturing a flow measuring device having a rotatable...

Interfacial layer for high resolution lithography (HRL) and high sp...

System for providing dynamic feedback for selective adhesion PCB pr...

Processing method and processing system of a flexible substrate

Interlayer insulating film and method for producing same

Methods for improved polymer-copper adhesion

Fluororesin base material, printed wiring board, and circuit module

Patents Applicationslast 30 patents

CROSSLINKED POLYESTER RESIN, ADHESIVE AGENT COMPOSITION, AND ADHESI...

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...

PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...

ELECTRONIC DEVICE

HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM

METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS

RESIN COMPOSITION AND ARTICLE MADE THEREFROM

MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...

ELECTRICALLY CONDUCTIVE ADHESIVE, ELECTRONIC CIRCUIT USING THE SAME...

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...

Application of Electrical Conductors of a Solar Cell

Apparatus and Method for Encapsulating an Electronic Component

METHOD FOR APPLYING A PATTERN TO A SUBSTRATE

METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...

SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...

LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD

METHOD FOR MANUFACTURING DIELECTRIC SHEET, METHOD FOR MANUFACTURING...

CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF

ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...

EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...

Methods for Improved Polymer-Copper Adhesion

PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...

WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE

SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...

APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...

PATTERN-TRANSFERRED OBJECT MANUFACTURING METHOD