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ELECTRICITY
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Electric techniques
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PRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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Apparatus or processes for manufacturing printed circuits
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H05K3/386
by the use of an organic polymeric bonding layer
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last 30 patents
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Patent Grant
Method for manufacturing dielectric sheet, method for manufacturing...
Patent number
12,213,249
Issue date
Jan 28, 2025
Sumitomo Electric Industries, Ltd.
Shingo Kaimori
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Wafer level bump stack for chip scale package
Patent number
12,177,988
Issue date
Dec 24, 2024
Texas Instruments Incorporated
Sreenivasan K. Koduri
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electrically conductive adhesive, electronic circuit using the same...
Patent number
12,171,062
Issue date
Dec 17, 2024
Toyo Aluminum Kabushiki Kaisha
Toshio Nakatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
Patent number
12,150,248
Issue date
Nov 19, 2024
Honeywell Federal Manufacturing & Technologies, LLC
Jonathan Douglas Hatch
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pressure-sensitive adhesive sheet-including wiring circuit board an...
Patent number
12,144,125
Issue date
Nov 12, 2024
Nitto Denko Corporation
Takahiro Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Resin composition and article made therefrom
Patent number
12,134,682
Issue date
Nov 5, 2024
ELITE MATERIAL CO., LTD.
Tse-Hung Liu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Printed circuit board and fabricating method thereof, and displayin...
Patent number
12,082,337
Issue date
Sep 3, 2024
Chengdu BOE Optoelectronics Technology Co., Ltd.
Jiaxiang Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Copper-clad laminate
Patent number
11,950,376
Issue date
Apr 2, 2024
Mitsui Mining & Smelting Co., Ltd.
Toshihiro Hosoi
B32 - LAYERED PRODUCTS
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Patent Grant
Method of improving the adhesion strength of metal-organic interfac...
Patent number
11,919,036
Issue date
Mar 5, 2024
YIELD ENGINEERING SYSTEMS, INC.
Kenneth Sautter
B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
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Patent Grant
Application of electrical conductors of a solar cell
Patent number
11,877,402
Issue date
Jan 16, 2024
Lumet Technologies, LTD.
Benzion Landa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for encapsulating an electronic component
Patent number
11,832,398
Issue date
Nov 28, 2023
Acleap Power Inc.
Evan Cosentino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Application of electrical conductors to an electrically insulating...
Patent number
11,832,395
Issue date
Nov 28, 2023
Landa Labs (2012) LTD.
Benzion Landa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
Patent number
11,818,849
Issue date
Nov 14, 2023
YIELD ENGINEERING SYSTEMS, INC.
Kenneth Sautter
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for applying a pattern to a substrate
Patent number
11,751,336
Issue date
Sep 5, 2023
Lumet Technologies, LTD.
Benzion Landa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded-type transparent electrode substrate and method for manufa...
Patent number
11,716,818
Issue date
Aug 1, 2023
LG Chem, Ltd.
Yong Goo Son
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board structure and manufacturing method thereof
Patent number
11,665,832
Issue date
May 30, 2023
Unimicron Technology Corp.
John Hon-Shing Lau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Circuit board
Patent number
11,582,872
Issue date
Feb 14, 2023
Avary Holding (Shenzhen) Co., Limited.
Ke-Jian Wu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Flexible membrane for applying a pattern to a substrate
Patent number
11,570,902
Issue date
Jan 31, 2023
Lumet Technologies, LTD.
Benzion Landa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for applying of a conductive pattern to a substrate
Patent number
11,546,999
Issue date
Jan 3, 2023
Lumet Technologies Ltd.
Benzion Landa
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Electronic device having first and second component carrier parts w...
Patent number
11,527,807
Issue date
Dec 13, 2022
AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
Fabrizio Gentili
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method of making flexible printed circuit board and flexible printe...
Patent number
11,523,518
Issue date
Dec 6, 2022
Sumitomo Electric Printed Circuits, Inc.
Kou Noguchi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Conductive laminated structure, a manufacturing method thereof, and...
Patent number
11,510,323
Issue date
Nov 22, 2022
Yungu (Gu'an) Technology Co., Ltd.
Yu Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nitride ceramic resin composite body
Patent number
11,492,299
Issue date
Nov 8, 2022
DENKA COMPANY LIMITED
Yoshitaka Minakata
C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
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Patent Grant
Method of manufacturing a flow measuring device having a rotatable...
Patent number
11,454,527
Issue date
Sep 27, 2022
Encite LLC
Stephen Alan Marsh
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interfacial layer for high resolution lithography (HRL) and high sp...
Patent number
11,445,616
Issue date
Sep 13, 2022
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for providing dynamic feedback for selective adhesion PCB pr...
Patent number
11,439,023
Issue date
Sep 6, 2022
Honeywell Federal Manufacturing & Technologies, LLC
Jonathan Douglas Hatch
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Processing method and processing system of a flexible substrate
Patent number
11,430,351
Issue date
Aug 30, 2022
BOE Technology Group Co., Ltd.
Weiyun Huang
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Interlayer insulating film and method for producing same
Patent number
11,432,400
Issue date
Aug 30, 2022
SHOWA DENKO MATERIALS CO., LTD.
Masaharu Matsuura
B32 - LAYERED PRODUCTS
Information
Patent Grant
Methods for improved polymer-copper adhesion
Patent number
11,388,822
Issue date
Jul 12, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Grant
Fluororesin base material, printed wiring board, and circuit module
Patent number
11,364,714
Issue date
Jun 21, 2022
SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
Satoshi Kiya
B32 - LAYERED PRODUCTS
Patents Applications
last 30 patents
Information
Patent Application
CROSSLINKED POLYESTER RESIN, ADHESIVE AGENT COMPOSITION, AND ADHESI...
Publication number
20240409782
Publication date
Dec 12, 2024
Toyobo Co., Ltd.
Shoko UCHIYAMA
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGAN...
Publication number
20240357749
Publication date
Oct 24, 2024
Yield Engineering Systems, Inc.
Kenneth Sautter
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
Publication number
20240276636
Publication date
Aug 15, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
Yu-Hsien LIAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Publication number
20240276650
Publication date
Aug 15, 2024
TONG HSING ELECTRONIC INDUSTRIES, LTD.
Yu-Hsien LIAO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
WIRING BOARD, METHOD FOR MANUFACTURING WIRING BOARD, LAMINATE FOR I...
Publication number
20240235004
Publication date
Jul 11, 2024
DAI NIPPON PRINTING CO., LTD.
Kazuki KINOSHITA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREOF, AND DISPLAYIN...
Publication number
20240224416
Publication date
Jul 4, 2024
BOE TECHNOLOGY GROUP CO., LTD.
Jiaxiang ZHANG
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240155777
Publication date
May 9, 2024
InnoLux Corporation
Yuan-Lin WU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HYBRID SOFT-RIGID ELECTRICAL INTERCONNECTION SYSTEM
Publication number
20240091528
Publication date
Mar 21, 2024
ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
Florian FALLEGGER
A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information
Patent Application
METHOD AND SYSTEMS FOR COLD FORMING FEATURES ON FLEX CIRCUITS
Publication number
20240057250
Publication date
Feb 15, 2024
Koninklijke Philips N.V.
FRANCIS KUSTI MAKIE
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
RESIN COMPOSITION AND ARTICLE MADE THEREFROM
Publication number
20230331916
Publication date
Oct 19, 2023
ELITE MATERIAL CO., LTD.
Tse-Hung LIU
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING ME...
Publication number
20230328897
Publication date
Oct 12, 2023
Showa Denko Materials Co., Ltd.
Hiroyuki IZAWA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRICALLY CONDUCTIVE ADHESIVE, ELECTRONIC CIRCUIT USING THE SAME...
Publication number
20230319988
Publication date
Oct 5, 2023
TOYO ALUMINIUM KABUSHIKI KAISHA
Toshio NAKATANI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
Publication number
20230292445
Publication date
Sep 14, 2023
LANDA LABS (2012) LTD.
Benzion LANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHODS FOR COPPER-CLAD LAMINATE AND PRINTED WIRING B...
Publication number
20230276579
Publication date
Aug 31, 2023
Mitsui Mining and Smelting Co., Ltd.
Daisuke NAKAJIMA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Application of Electrical Conductors of a Solar Cell
Publication number
20230129839
Publication date
Apr 27, 2023
Lumet Technologies LTD.
Benzion LANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Apparatus and Method for Encapsulating an Electronic Component
Publication number
20230115061
Publication date
Apr 13, 2023
ABB Schweiz AG
Evan Cosentino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS AND APPARATUS TO IMPROVE ADHESION BETWEEN METALS AND DIELEC...
Publication number
20230085997
Publication date
Mar 23, 2023
Intel Corporation
Yi Yang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR APPLYING A PATTERN TO A SUBSTRATE
Publication number
20230087822
Publication date
Mar 23, 2023
Lumet Technologies LTD.
Benzion LANDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...
Publication number
20230072115
Publication date
Mar 9, 2023
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
JONATHAN DOUGLAS HATCH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
LAMINATE, BONDING METHOD, AND INTERMEDIATE PRODUCT FOR CIRCUIT BOARD
Publication number
20230018333
Publication date
Jan 19, 2023
NHK Spring Co., Ltd.
Takeshi Kawakami
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD FOR MANUFACTURING DIELECTRIC SHEET, METHOD FOR MANUFACTURING...
Publication number
20220272838
Publication date
Aug 25, 2022
Sumitomo Electric Industries, Ltd.
Shingo KAIMORI
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220256717
Publication date
Aug 11, 2022
Unimicron Technology Corp.
John Hon-Shing Lau
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND...
Publication number
20220151069
Publication date
May 12, 2022
Mitsui Chemicals, Inc.
Taichi KOYAMA
G01 - MEASURING TESTING
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Patent Application
EMBEDDED-TYPE TRANSPARENT ELECTRODE SUBSTRATE AND METHOD FOR MANUFA...
Publication number
20220132675
Publication date
Apr 28, 2022
LG CHEM, LTD.
Yong Goo SON
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Methods for Improved Polymer-Copper Adhesion
Publication number
20220071023
Publication date
Mar 3, 2022
Applied Materials, Inc.
Tapash Chakraborty
B32 - LAYERED PRODUCTS
Information
Patent Application
PRINTED WIRING BOARD, MEMORY SYSTEM, AND METHOD FOR MANUFACTURING P...
Publication number
20220070998
Publication date
Mar 3, 2022
KIOXIA Corporation
Daigo SUZUKI
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
WAFER LEVEL BUMP STACK FOR CHIP SCALE PACKAGE
Publication number
20210345495
Publication date
Nov 4, 2021
TEXAS INSTRUMENTS INCORPORATED
Sreenivasan K. KODURI
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Information
Patent Application
SYSTEM FOR PROVIDING DYNAMIC FEEDBACK FOR SELECTIVE ADHESION PCB PR...
Publication number
20210289633
Publication date
Sep 16, 2021
HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC
JONATHAN DOUGLAS HATCH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
APPLICATION OF ELECTRICAL CONDUCTORS TO AN ELECTRICALLY INSULATING...
Publication number
20210227698
Publication date
Jul 22, 2021
LANDA LABS (2012) LTD.
Benzion LANDA
B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
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Patent Application
PATTERN-TRANSFERRED OBJECT MANUFACTURING METHOD
Publication number
20210219433
Publication date
Jul 15, 2021
MITSUBISHI PAPER MILLS LIMITED
Shigeki Shino
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR