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3747173
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Information
Patent Grant
3747173
References
Source
Patent Number
3,747,173
Date Filed
Not available
Date Issued
Tuesday, July 24, 1973
51 years ago
CPC
C04B37/045 - characterised by the interlayer used
B23K35/26 - with the principal constituent melting at less than 400 degrees C
C04B37/006 - consisting of metals or metal salts
H01J9/263 - specially adapted for cathode-ray tubes
H01J29/863 - Vessels or containers characterised by the material thereof
C04B2235/5436 - micrometer sized
C04B2235/6567 - Treatment time
C04B2235/6581 - Total pressure below 1 atmosphere
C04B2235/76 - Crystal structural characteristics
C04B2237/12 - Metallic interlayers
C04B2237/122 - based on refractory metals
C04B2237/123 - based on iron group metals
C04B2237/124 - based on copper
C04B2237/125 - based on noble metals
C04B2237/127 - The active component for bonding being a refractory metal
C04B2237/30 - Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating
C04B2237/343 - Alumina or aluminates
C04B2237/52 - Pre-treatment of the joining surfaces
C04B2237/708 - of one or more of the interlayers
C04B2237/72 - Forming laminates or joined articles comprising at least two interlayers directly next to each other
C04B2237/76 - Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc
C04B2237/765 - at least one member being a tube
C04B2237/80 - Joining the largest surface of one substrate with a smaller surface of the other substrate
Y10S29/022 - Method or apparatus using indium
US Classifications
445 - Electric lamp or space discharge component or device manufacturing
029 - Metal working
065 - Glass manufacturing
156 - Adhesive bonding and miscellaneous chemical manufacture
220 - Receptacles
228 - Metal fusion bonding
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