with the principal constituent melting at less than 400 degrees C

Industry

CPC
B23K35/26

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B23Machine tools B23KSOLDERING OR UNSOLDERING WELDING CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting

Current Industry

B23K35/26with the principal constituent melting at less than 400 degrees C

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Solder material
- Patent number 12,296,409
- Issue date May 13, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low melting-point bonding member, method for producing same, semico...
- Patent number 12,285,823
- Issue date Apr 29, 2025
- SHINRYO CORPORATION
- Hirotoshi Nishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder joint
- Patent number 12,275,094
- Issue date Apr 15, 2025
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joined body, holding device, and electrostatic chuck
- Patent number 12,251,923
- Issue date Mar 18, 2025
- NITERRA CO., LTD.
- Osamu Yoshimoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and method for producing the anisotropi...
- Patent number 12,247,270
- Issue date Mar 11, 2025
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
SnIn solder alloys
- Patent number 12,240,060
- Issue date Mar 4, 2025
- Indium Corporation
- Francis M. Mutuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature soldering solutions for polymer substrates, printed...
- Patent number 12,233,483
- Issue date Feb 25, 2025
- Alpha Assembly Solutions Inc.
- Rahul Raut
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder materials including supercooled micro-capsules and alloyed p...
- Patent number 12,208,471
- Issue date Jan 28, 2025
- THE INDIUM CORPORATION OF AMERICA
- Martin Thuo
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Process for the production of crude solder
- Patent number 12,202,076
- Issue date Jan 21, 2025
- METALLO BELGIUM
- Valentin Casado
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,194,573
- Issue date Jan 14, 2025
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solar cell panel manufacturing method and paste for solar cell elec...
- Patent number 12,191,405
- Issue date Jan 7, 2025
- JINGAO SOLAR CO., LTD.
- Kyungdong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder coated rivet electrical connector
- Patent number 12,191,589
- Issue date Jan 7, 2025
- Aptiv Technologies AG
- William Falk
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for step-soldering
- Patent number 12,179,291
- Issue date Dec 31, 2024
- Senju Metal Industry Co., Ltd.
- Takashi Saito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy
- Patent number 12,172,242
- Issue date Dec 24, 2024
- Nihon Superior Co., Ltd.
- Takatoshi Nishimura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Light emitting diode for low temperature applications
- Patent number 12,159,961
- Issue date Dec 3, 2024
- Azenta Life Sciences, Inc.
- Aarash Navabi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux, solder paste, soldering process, method for producing soldere...
- Patent number 12,138,714
- Issue date Nov 12, 2024
- ORIGIN COMPANY, LIMITED
- Arisa Shiraishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder paste
- Patent number 12,138,715
- Issue date Nov 12, 2024
- Heraeus Deutschland GmbH & Co. KG
- Lei Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,128,493
- Issue date Oct 29, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder compositions
- Patent number 12,115,602
- Issue date Oct 15, 2024
- Alpha Assembly Solutions Inc.
- Ranjit Pandher
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder ball, solder paste, and solder joint
- Patent number 12,109,653
- Issue date Oct 8, 2024
- Senju Metal Industry Co., Ltd.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy composition suitable for use in high-tempera...
- Patent number 12,103,114
- Issue date Oct 1, 2024
- KYUNG DONG MTEC CO., LTD.
- Heung Rak Sohn
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High reliability lead-free solder alloys for harsh environment elec...
- Patent number 12,090,579
- Issue date Sep 17, 2024
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a vehicle glass assembly
- Patent number 12,091,729
- Issue date Sep 17, 2024
- ACR II GLASS AMERICA INC.
- Olivier Farreyrol
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Co-production of lead and tin products
- Patent number 12,060,626
- Issue date Aug 13, 2024
- METALLO BELGIUM
- Bert Coletti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder alloy, solder paste, solder ball, solder preform, solder joi...
- Patent number 12,053,843
- Issue date Aug 6, 2024
- Senju Metal Industry Co., Ltd.
- Shunsaku Yoshikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector
- Patent number 12,036,628
- Issue date Jul 16, 2024
- Aptiv Technologies AG
- Stephen Antaya
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
- Patent number 12,030,140
- Issue date Jul 9, 2024
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board assembly process using multiple solders and a...
- Patent number 12,035,483
- Issue date Jul 9, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sn—Cu mixed alloy solder paste, method of making the same and solde...
- Patent number 12,030,139
- Issue date Jul 9, 2024
- Robert Bosch GmbH
- Wallace Chuang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED...
- Publication number 20250153280
- Publication date May 15, 2025
- Alpha Assembly Solutions Inc.
- Rahul Raut
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLE MANUFACTURING METHOD, SOLDER PARTICLE, AND CONDUCTI...
- Publication number 20250128361
- Publication date Apr 24, 2025
- Dexerials Corporation
- Sarii YAMAGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SO...
- Publication number 20250128362
- Publication date Apr 24, 2025
- Intel Corporation
- Rui Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDED STRUCTURE
- Publication number 20250121461
- Publication date Apr 17, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- YUMI TAKAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING STRUCTURE
- Publication number 20250108463
- Publication date Apr 3, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- KIYOHIRO HINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20250083262
- Publication date Mar 13, 2025
- Resonac Corporation
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR STEP-SOLDERING
- Publication number 20250065449
- Publication date Feb 27, 2025
- SENJU METAL INDUSTRY CO., LTD.
- Takashi SAITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...
- Publication number 20250066644
- Publication date Feb 27, 2025
- Samsung Electronics Co., Ltd.
- Junghoon LEE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...
- Publication number 20250058414
- Publication date Feb 20, 2025
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste for Connection Pin
- Publication number 20250058413
- Publication date Feb 20, 2025
- DUKSAN HI-METAL CO., LTD.
- Oh Heebong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL
- Publication number 20250041977
- Publication date Feb 6, 2025
- Fuji Electric Co., Ltd.
- Kohei MITSUI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...
- Publication number 20250018509
- Publication date Jan 16, 2025
- TAMURA CORPORATION
- Takanori SHIMAZAKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive Compositions For Low Temperature Assembly Of Electronic...
- Publication number 20250010409
- Publication date Jan 9, 2025
- ORMET CIRCUITS, INC.
- YANRONG SHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...
- Publication number 20250001528
- Publication date Jan 2, 2025
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250001529
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...
- Publication number 20250006680
- Publication date Jan 2, 2025
- DUKSAN HI-METAL CO., LTD.
- Eun Kwang PARK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...
- Publication number 20250001530
- Publication date Jan 2, 2025
- Indium Corporation
- Weiping Liu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Paste, and Solder Joint
- Publication number 20240424615
- Publication date Dec 26, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Matsufuji
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...
- Publication number 20240429108
- Publication date Dec 26, 2024
- MITSUBISHI MATERIALS CORPORATION
- Shujie Fei
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...
- Publication number 20240408703
- Publication date Dec 12, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Norzafriza NITTA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WATER-SOLUBLE FLUX AND SOLDER PASTE
- Publication number 20240408705
- Publication date Dec 12, 2024
- SENJU METAL INDUSTRY CO., LTD
- Yo YAMADA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...
- Publication number 20240399512
- Publication date Dec 5, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Yokoyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...
- Publication number 20240367270
- Publication date Nov 7, 2024
- Dexerials Corporation
- Hidetsugu NAMIKI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Lead-Free Solder Ball
- Publication number 20240363571
- Publication date Oct 31, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Yoshie Yamanaka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...
- Publication number 20240342838
- Publication date Oct 17, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Shunsaku YOSHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...
- Publication number 20240341040
- Publication date Oct 10, 2024
- Dell Products L.P.
- Subramanian Vasudevan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX AND SOLDER PASTE
- Publication number 20240278360
- Publication date Aug 22, 2024
- SENJU METAL INDUSTRY CO., LTD
- Yutaka HASHIMOTO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING SHEET AND METHOD FOR PRODUCING SAME
- Publication number 20240269780
- Publication date Aug 15, 2024
- NITTO DENKO CORPORATION
- Masatoshi KATO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240263296
- Publication date Aug 8, 2024
- Chao Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

with the principal constituent melting at less than 400 degrees C

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solder material

Low melting-point bonding member, method for producing same, semico...

Solder joint

Joined body, holding device, and electrostatic chuck

Anisotropic conductive film and method for producing the anisotropi...

SnIn solder alloys

Low temperature soldering solutions for polymer substrates, printed...

Solder materials including supercooled micro-capsules and alloyed p...

Process for the production of crude solder

Solder paste

Solar cell panel manufacturing method and paste for solar cell elec...

Solder coated rivet electrical connector

Method for step-soldering

Lead-free solder alloy

Solder particles

Light emitting diode for low temperature applications

Flux, solder paste, soldering process, method for producing soldere...

Solder paste

Method of producing a vehicle glass assembly

Lead-free solder compositions

Solder alloy, solder ball, solder paste, and solder joint

Lead-free solder alloy composition suitable for use in high-tempera...

High reliability lead-free solder alloys for harsh environment elec...

Method of producing a vehicle glass assembly

Co-production of lead and tin products

Solder alloy, solder paste, solder ball, solder preform, solder joi...

Electrical connector

Lead-free solder alloy and method of manufacturing electronic devic...

Printed circuit board assembly process using multiple solders and a...

Sn—Cu mixed alloy solder paste, method of making the same and solde...

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDERING SOLUTIONS FOR POLYMER SUBSTRATES, PRINTED...

SOLDER PARTICLE MANUFACTURING METHOD, SOLDER PARTICLE, AND CONDUCTI...

MICROMETER METAL PARTICLE REINFORCED TIN-BISMUTH LOW TEMPERATURE SO...

BONDING MATERIAL AND BONDED STRUCTURE

BONDING MATERIAL AND BONDING STRUCTURE

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

METHOD FOR STEP-SOLDERING

METAL PARTICLES FOR ADHESIVE PASTE, SOLDER PASTE COMPOSITION INCLUD...

Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...

Solder Paste for Connection Pin

SOLDER MATERIAL

SOLDER ALLOY, JOINED PART, JOINING MATERIAL, SOLDER PASTE, JOINED S...

Conductive Compositions For Low Temperature Assembly Of Electronic...

SOLDER PARTICLES, SOLDER PARTICLE PRODUCTION METHOD, AND CONDUCTIVE...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

SOLDER ALLOY, SOLDER JOINT, AND SEMICONDUCTOR PACKAGE INCLUDING SOL...

HIGH RELIABILITY LEAD-FREE SOLDER ALLOYS FOR HARSH ENVIRONMENT ELEC...

Solder Alloy, Solder Ball, Solder Paste, and Solder Joint

JOINED BODY, METHOD OF MANUFACTURING JOINED BODY, AND METHOD OF EVA...

BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATE...

WATER-SOLUBLE FLUX AND SOLDER PASTE

Solder Alloy, Solder Ball, Solder Preform, Solder Paste, and Solder...

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

SOLDER PARTICLES, METHOD FOR PRODUCING SOLDER PARTICLES, AND CONDUC...

Lead-Free Solder Ball

Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joi...

PRINTED CIRCUIT BOARD ASSEMBLY PROCESS USING MULTIPLE SOLDERS AND A...

FLUX AND SOLDER PASTE

BONDING SHEET AND METHOD FOR PRODUCING SAME

SPUTTERING TARGET AND METHOD FOR MANUFACTURING THE SAME