3830677

Information

• Patent Grant
• 3830677

• References
• Source

• Patent Number

  3,830,677

• Date Filed

  Not available

• Date Issued

  Tuesday, August 20, 1974
  50 years ago

• CPC

  • H02G1/1287 - by means of a solvent

• US Classifications

  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 216 - Etching a substrate: processes