3876461

Information

• Patent Grant
• 3876461

• References
• Source

• Patent Number

  3,876,461

• Date Filed

  Not available

• Date Issued

  Tuesday, April 8, 1975
  49 years ago

• CPC

  • H01L21/56 - Encapsulations
  • C08G59/448 - Lactames
  • H01L2924/0002 - Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
  • Y10S156/93 - Semiconductive product delaminating
  • Y10T29/49121 - Beam lead frame or beam lead device
  • Y10T156/11 - Methods of delaminating, per se

• US Classifications

  • 029 - Metal working
  • 156 - Adhesive bonding and miscellaneous chemical manufacture
  • 257 - Active solid-state devices
  • 427 - Coating processes
  • 438 - Semiconductor device manufacturing: process