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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/56Encapsulations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing semiconductor device
- Patent number 12,272,625
- Issue date Apr 8, 2025
- Mitsubishi Electric Corporation
- Yasutaka Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous nested interposer package for IC chips
- Patent number 12,272,656
- Issue date Apr 8, 2025
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 12,272,671
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 12,272,674
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic textile assembly having electronic componentry which is...
- Patent number 12,272,611
- Issue date Apr 8, 2025
- University of Southampton
- Stephen Paul Beeby
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Grant
Package and manufacturing method thereof
- Patent number 12,272,622
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having lead connecting a semiconductor chip to...
- Patent number 12,272,624
- Issue date Apr 8, 2025
- Mitsubishi Electric Corporation
- Masaomi Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-bump sidewall protection
- Patent number 12,272,663
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive members atop semiconductor packages
- Patent number 12,272,626
- Issue date Apr 8, 2025
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with conductive pillars and reinforcin...
- Patent number 12,272,687
- Issue date Apr 8, 2025
- Advanced Semiconductor Engineering, Inc.
- Ya Fang Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,272,655
- Issue date Apr 8, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating structures for semiconductor devices and methods o...
- Patent number 12,272,616
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 12,266,584
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided coolable semiconductor package
- Patent number 12,266,586
- Issue date Apr 1, 2025
- Infineon Technologies AG
- Juergen Hoegerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked dies and methods for forming bonded structures
- Patent number 12,266,650
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated devices in semiconductor packages and methods of forming...
- Patent number 12,266,619
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with isolated semiconductor die and el...
- Patent number 12,266,595
- Issue date Apr 1, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device with substrate for el...
- Patent number 12,266,649
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Wu-Der Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, substrate holding apparatus, molding a...
- Patent number 12,263,634
- Issue date Apr 1, 2025
- Canon Kabushiki Kaisha
- Hiroshi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer material in a redistribution structure of a semiconductor p...
- Patent number 12,265,330
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,266,673
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and manufacturing methods thereof
- Patent number 12,266,847
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yung-Ping Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure
- Patent number 12,266,616
- Issue date Apr 1, 2025
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, electronic device, and chip package preparation method
- Patent number 12,266,617
- Issue date Apr 1, 2025
- Huawei Technologies Co., Ltd.
- Nan Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,266,618
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stack structure and manufacturing method thereof
- Patent number 12,266,637
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device including forming a first...
- Patent number 12,266,612
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF
- Publication number 20250118575
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME
- Publication number 20250118611
- Publication date Apr 10, 2025
- STATS ChipPAC Pte Ltd.
- NamGu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20250118695
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...
- Publication number 20250118721
- Publication date Apr 10, 2025
- iCometrue Company Ltd.
- Jin-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK
- Publication number 20250118635
- Publication date Apr 10, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118626
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118642
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hsuan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118678
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Chi Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component Comprising Structured Contacts and A Method...
- Publication number 20250118691
- Publication date Apr 10, 2025
- IMEC vzw
- Jaber Derakhshandeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250118608
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118639
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Hyunjo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE
- Publication number 20250118644
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118716
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES
- Publication number 20250118574
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...
- Publication number 20250118610
- Publication date Apr 10, 2025
- SEMIKRON DANFOSS ELEKTRONIK GMBH & CO. KG
- Markus DÜSEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE
- Publication number 20250118677
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Jin YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...
- Publication number 20250118681
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Seungmin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20250118682
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...
- Publication number 20250112200
- Publication date Apr 3, 2025
- Intel Corporation
- Adel Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...
- Publication number 20250112101
- Publication date Apr 3, 2025
- LINTEC CORPORATION
- Reina KAINUMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...
- Publication number 20250112114
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Ninad Shahane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER
- Publication number 20250112067
- Publication date Apr 3, 2025
- Intel Corporation
- Thomas L. Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DECAPSULATING PACKAGED INTEGRATED CIRCUIT
- Publication number 20250112058
- Publication date Apr 3, 2025
- Tung Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER
- Publication number 20250112182
- Publication date Apr 3, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Masamitsu Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250112095
- Publication date Apr 3, 2025
- Mitsubishi Electric Corporation
- Kazufumi OKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250112135
- Publication date Apr 3, 2025
- NEXPERIA B.V.
- Yuet Keung Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20250112137
- Publication date Apr 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...
- Publication number 20250112162
- Publication date Apr 3, 2025
- Intel Corporation
- Zheng Kang
- H01 - BASIC ELECTRIC ELEMENTS

Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Heterogeneous nested interposer package for IC chips

Semiconductor device package and method for manufacturing the same

Stacking structure, package structure and method of fabricating the...

Electronic textile assembly having electronic componentry which is...

Package and manufacturing method thereof

Semiconductor device having lead connecting a semiconductor chip to...

Metal-bump sidewall protection

Conductive members atop semiconductor packages

Semiconductor device package with conductive pillars and reinforcin...

Semiconductor devices and methods of manufacturing semiconductor de...

Direct bonded stack structures for increased reliability and improv...

Heat-dissipating structures for semiconductor devices and methods o...

Integrated circuit package and method

Double-sided coolable semiconductor package

Stacked dies and methods for forming bonded structures

Integrated devices in semiconductor packages and methods of forming...

Embedded component package structure and manufacturing method thereof

Semiconductor device package with isolated semiconductor die and el...

Method for manufacturing semiconductor device with substrate for el...

Substrate processing method, substrate holding apparatus, molding a...

Polymer material in a redistribution structure of a semiconductor p...

Semiconductor package and method of forming the same

Semiconductor packages and manufacturing methods thereof

Integrated circuit package structure

Chip package, electronic device, and chip package preparation method

Semiconductor device and method of manufacturing the same

Die stack structure and manufacturing method thereof

Method for forming a semiconductor device including forming a first...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THEREOF

ELECTRONIC PACKAGE ASSEMBLY AND A METHOD FOR FORMING THE SAME

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

PACKAGE COMPONENT AND FORMING METHOD THEREOF

LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMI...

SEMICONDUCTOR PACKAGE WITH WETTABLE FLANK

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Component Comprising Structured Contacts and A Method...

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

CIRCUIT BOARD AND ELECTRONIC DEVICE PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGES

POWER SEMICONDUCTOR MODULE COMPRISING A POTTING BODY AND PRODUCTION...

SYSTEM AND METHODS FOR A MULTI-STACK ARCHITECTURE

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTO...

PACKAGE STRUCTURE

HYBRID BONDING OF THIN DIE STRUCTURES BY SELF-ALIGNMENT ASSISTED AS...

CURABLE RESIN FILM, COMPOSITE SHEET, SEMICONDUCTOR CHIP, AND SEMICO...

SEMICONDUCTOR DEVICE PACKAGE WITH INTEGRAL THERMAL DISSIPATION STRU...

REMOVAL OF DEFECTIVE DIES ON DONOR WAFERS FOR SELECTIVE LAYER TRANSFER

METHOD FOR DECAPSULATING PACKAGED INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE WITH AN INSULATION LAYER

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE AND METHOD

DEEP CAVITY METALLIZATION AND FIDUCIAL ARRANGEMENTS FOR EMBEDDED DI...