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H01L21/56

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Current Industry

H01L21/56Encapsulations

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure having photonic die and electronic die
- Patent number 12,368,147
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame rolling
- Patent number 12,368,054
- Issue date Jul 22, 2025
- Texas Instruments Incorporated
- Amirul Afiq Bin Hud
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing electronic device
- Patent number 12,368,079
- Issue date Jul 22, 2025
- Innolux Corporation
- Cheng-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,368,116
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective film agent and processing method of workpiece
- Patent number 12,368,049
- Issue date Jul 22, 2025
- Disco Corporation
- Sho Osawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF devices with enhanced performance and methods of forming the same
- Patent number 12,368,056
- Issue date Jul 22, 2025
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method comprising formation of redistribu...
- Patent number 12,368,077
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatuses with radio-frequency line elements, and a...
- Patent number 12,368,111
- Issue date Jul 22, 2025
- Infineon Technologies AG
- Walter Hartner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including dam patterns and methods for manuf...
- Patent number 12,368,134
- Issue date Jul 22, 2025
- SK hynix Inc.
- Shin Young Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IPD modules with flexible connection scheme in packaging
- Patent number 12,368,141
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info packages including thermal dissipation blocks
- Patent number 12,368,148
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor packages
- Patent number 12,368,149
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal dissipation, packaged electronic device and manufactur...
- Patent number 12,368,126
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Cristiano Gianluca Stella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having underfill material surrounding a...
- Patent number 12,368,127
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Supporting InFO packages to reduce warpage
- Patent number 12,368,115
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-die semiconductor devices and corresp...
- Patent number 12,368,055
- Issue date Jul 22, 2025
- STMicroelectronics S.r.l.
- Paolo Crema
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including passivation...
- Patent number 12,368,090
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Diode package structure and manufacturing method thereof
- Patent number 12,369,443
- Issue date Jul 22, 2025
- Lextar Electronics Corporation
- Yu-Jing Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out package with integrated peripheral devices and methods
- Patent number 12,362,251
- Issue date Jul 15, 2025
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,362,253
- Issue date Jul 15, 2025
- Samsung Electronics Co., Ltd.
- Hyeonjeong Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices and packaged semiconduct...
- Patent number 12,362,260
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing an electronic package
- Patent number 12,362,267
- Issue date Jul 15, 2025
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with ring structure
- Patent number 12,362,197
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,362,263
- Issue date Jul 15, 2025
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,362,331
- Issue date Jul 15, 2025
- Fuji Electric Co., Ltd.
- Hayato Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making double shielding layers o...
- Patent number 12,362,287
- Issue date Jul 15, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES
- Publication number 20250236955
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT
- Publication number 20250239462
- Publication date Jul 24, 2025
- TEXAS INSTRUMENTS INCORPORATED
- NAZILA DADVAND
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250239505
- Publication date Jul 24, 2025
- STMicroelectronics International N.V.
- Ludovic FALLOURD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM
- Publication number 20250239574
- Publication date Jul 24, 2025
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...
- Publication number 20250239548
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Yung Lin Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250239463
- Publication date Jul 24, 2025
- UNITED MICROELECTRONICS CORP.
- Chien-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...
- Publication number 20250239490
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Hsuan Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...
- Publication number 20250239528
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yuan Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250239536
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250239569
- Publication date Jul 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250239491
- Publication date Jul 24, 2025
- Chipbond Technology Corporation
- Cheng-Hung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239501
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232978
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20250233115
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Manufacturing Method Thereof
- Publication number 20250233116
- Publication date Jul 17, 2025
- DIODES INCORPORATED
- Shu-Hao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20250233081
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Hoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250233089
- Publication date Jul 17, 2025
- Advanced Semiconductor Engineering, Inc.
- Jenchun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS
- Publication number 20250232979
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND PREPARING METHOD THEREOF
- Publication number 20250233033
- Publication date Jul 17, 2025
- TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
- HUNG-TA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
- Publication number 20250229512
- Publication date Jul 17, 2025
- AGC Inc.
- Tetsuo ABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SCALE ELECTROPLATED POROUS COATING FOR IMMERSION COOLING OF E...
- Publication number 20250233049
- Publication date Jul 17, 2025
- Systemex Énergies Inc.
- Julien Sylvestre
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...
- Publication number 20250233035
- Publication date Jul 17, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Kyeong Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20250233111
- Publication date Jul 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE
- Publication number 20250233301
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONSTRUCTIONS AND METHODS FOR MAKING THE SAME
- Publication number 20250228046
- Publication date Jul 10, 2025
- BRIDGELUX, INC.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250226326
- Publication date Jul 10, 2025
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20250226238
- Publication date Jul 10, 2025
- Resonac Corporation
- Keiichi HATAKEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...
- Publication number 20250226583
- Publication date Jul 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATCH-TYPE SUBSTRATE PROCESSING APPARATUS
- Publication number 20250226252
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- Sekeun KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Encapsulations

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor structure having photonic die and electronic die

Package structure including stacked pillar portions and method for...

Lead frame rolling

Method for manufacturing electronic device

Device bonding apparatus and method of manufacturing a package usin...

Electronic package and manufacturing method thereof

Protective film agent and processing method of workpiece

RF devices with enhanced performance and methods of forming the same

Semiconductor package and method comprising formation of redistribu...

Electronic package comprising conductive layer connected electrode...

Semiconductor apparatuses with radio-frequency line elements, and a...

Semiconductor packages including dam patterns and methods for manuf...

IPD modules with flexible connection scheme in packaging

Info packages including thermal dissipation blocks

Methods of forming semiconductor packages

Package structure and manufacturing method thereof

High thermal dissipation, packaged electronic device and manufactur...

Semiconductor chip package having underfill material surrounding a...

Supporting InFO packages to reduce warpage

Method of manufacturing multi-die semiconductor devices and corresp...

Method of manufacturing semiconductor device including passivation...

Diode package structure and manufacturing method thereof

Fan out package with integrated peripheral devices and methods

Semiconductor package and method of fabricating the same

Methods of packaging semiconductor devices and packaged semiconduct...

Electronic package and method for manufacturing an electronic package

Semiconductor die package with ring structure

Electronic package and method of fabricating the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of making double shielding layers o...

Patents Applicationslast 30 patents

CHEMICALLY ANCHORED MOLD COMPOUNDS IN SEMICONDUCTOR PACKAGES

IMMERSION PLATING PROCESS FOR AN INTEGRATED CIRCUIT

METHOD FOR MANUFACTURING ELECTRONIC COMPONENTS

FRONT-TO-FRONT BONDING IN A STACKED MEMORY SYSTEM

BONDED DEVICE STRUCTURES WITH IMPROVED STRESS DISTRIBUTION AND REDU...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

DIE EDGE STRUCTURE FOR MOLDING COMPOUND FILLING AND THE METHODS OF...

SEMICONDUCTOR DEVICE HAVING A HEAT DISSIPATION STRUCTURE CONNECTED...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

CHIP STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

Semiconductor Packages and Methods of Forming Same

Electronic Device and Manufacturing Method Thereof

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRESS BALANCE STRUCTURES AND RELATED METHODS

PACKAGING STRUCTURE AND PREPARING METHOD THEREOF

FILM AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE

MULTI-SCALE ELECTROPLATED POROUS COATING FOR IMMERSION COOLING OF E...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

ANTENNA IN PACKAGE HAVING ANTENNA ON PACKAGE SUBSTRATE

LIGHT EMITTING DIODE CONSTRUCTIONS AND METHODS FOR MAKING THE SAME

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

ANTENNA PACKAGE USING BALL ATTACH ARRAY TO CONNECT ANTENNA AND BASE...

BATCH-TYPE SUBSTRATE PROCESSING APPARATUS

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF