3879900

Information

• Patent Grant
• 3879900

• References
• Source

• Patent Number

  3,879,900

• Date Filed

  Not available

• Date Issued

  Tuesday, April 29, 1975
  49 years ago

• CPC

  • H01L21/67138 - Apparatus for wiring semiconductor or solid state device
  • B21G1/006 - Special treatments of pins or needles
  • B23K20/26 - Auxiliary equipment

• US Classifications

  • 451 - Abrading