75733700 - COPPER CORE CSP

Information

  • Trademark
  • 75733700
  • Serial Number
    75733700
  • Filing Date
    June 22, 1999
    25 years ago
  • Transaction Date
    May 11, 2008
    16 years ago
  • Status Date
    April 11, 2002
    22 years ago
  • Location Date
    May 22, 2002
    22 years ago
  • First Use Anywhere Date
    June 22, 1999
    25 years ago
  • Status Code
    602
  • Current Location
    FILE REPOSITORY (FRANCONIA)
    Employee Name
    FIRST, VIVIAN M
  • Attorney Docket Number
    68,700-002
    Attorney Name
    RANDY W TUNG
    Law Office Assigned Location Code
    L40
  • Owners
Mark Drawing Code
1000
Mark Identification
COPPER CORE CSP
Case File Statements
  • GS0091: ELECTRONIC COMPONENTS, NAMELY, SOLDER BUMPED SEMICONDUCTOR SILICON CHIPS AND WAFERS; SOLDER BUMPED ELECTRONIC SUBSTRATES FOR USE IN FURTHER MANUFACTURE OF ELECTRONICS; AND SOLDER BUMPED ELECTRICAL CIRCUIT BOARDS
Case File Event Statements
  • 4/11/2002 - 22 years ago
    8 - ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Type: ABN2
  • 8/24/2001 - 23 years ago
    7 - DISAPPROVAL - AMENDMENT TO USE MAILED Type: CNRU
  • 6/18/2001 - 23 years ago
    6 - AMENDMENT TO USE PROCESSING COMPLETE Type: AUPC
  • 3/15/2001 - 23 years ago
    5 - USE AMENDMENT FILED Type: IUAF
  • 9/21/2000 - 24 years ago
    4 - NON-FINAL ACTION MAILED Type: CNRT
  • 5/26/2000 - 24 years ago
    3 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 12/3/1999 - 25 years ago
    2 - NON-FINAL ACTION MAILED Type: CNRT
  • 11/16/1999 - 25 years ago
    1 - ASSIGNED TO EXAMINER Type: DOCK