APTOS, INC

Organization

NEWBURGH, NY, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Flexible multi-chip module and method of making the same
- Patent number 7,141,875
- Issue date Nov 28, 2006
- Aptos Corp
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer scale integration packaging and method of making and using th...
- Patent number 7,078,272
- Issue date Jul 18, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming copper bump antioxidation surface
- Patent number 7,008,867
- Issue date Mar 7, 2006
- Aptos Corporation
- Kuo Lung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an ultimate low dielectric device
- Patent number 6,913,946
- Issue date Jul 5, 2005
- Aptos Corporation
- Charles Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for bubble-free application of a resin to a su...
- Patent number 6,846,360
- Issue date Jan 25, 2005
- Aptos Corporation
- Dino Lei
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Flat-top bumping structure and preparation method
- Patent number 6,784,089
- Issue date Aug 31, 2004
- Aptos Corporation
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked paired die package and method of making the same
- Patent number 6,674,173
- Issue date Jan 6, 2004
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming patterned polyimide layer
- Patent number 6,635,585
- Issue date Oct 21, 2003
- Aptos Corporation
- Nguyen Khe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic fabrication having formed therein terminal electrod...
- Patent number 6,544,878
- Issue date Apr 8, 2003
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic fabrication having formed therein terminal electrod...
- Patent number 6,448,171
- Issue date Sep 10, 2002
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to make a tall solder ball by placing a eutectic solder bal...
- Patent number 6,424,037
- Issue date Jul 23, 2002
- Aptos Corporation
- Chung W Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a microelectronic fabrication having formed...
- Patent number 6,362,087
- Issue date Mar 26, 2002
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic fabrication having formed therein terminal electrod...
- Patent number 6,316,831
- Issue date Nov 13, 2001
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to make a tall solder ball by placing a eutectic solder bal...
- Patent number 6,281,041
- Issue date Aug 28, 2001
- Aptos Corporation
- Chung W Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer scale integration packaging and method of making and using th...
- Publication number 20060063311
- Publication date Mar 23, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level mounting frame with passive components integration for...
- Publication number 20060001145
- Publication date Jan 5, 2006
- Aptos Corporation
- Chi-Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible multi-chip module and method of making the same
- Publication number 20050227412
- Publication date Oct 13, 2005
- Aptos Corporation
- Min Chih Hsuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level mounting frame for ball grid array packaging, and metho...
- Publication number 20050224968
- Publication date Oct 13, 2005
- Aptos Corporation
- Chi Shen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS micro-cap wafer level chip scale package
- Publication number 20040256719
- Publication date Dec 23, 2004
- Aptos Corporation
- Kuo-Lung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Ultimate low dielectric device and method of making the same
- Publication number 20040253801
- Publication date Dec 16, 2004
- Aptos Corporation
- Charles Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming copper bump antioxidation surface
- Publication number 20040166661
- Publication date Aug 26, 2004
- Aptos Corporation
- Kuo Lung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS wafer level chip scale package
- Publication number 20040166662
- Publication date Aug 26, 2004
- Aptos Corporation
- Kuo-Lung Lei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Apparatus and method for bubble-free application of a resin to a su...
- Publication number 20040134420
- Publication date Jul 15, 2004
- Aptos Corporation
- Kuolung Lei
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FLAT-TOP BUMPING STRUCTURE AND PREPARATION METHOD
- Publication number 20040137707
- Publication date Jul 15, 2004
- Aptos Corporation
- Kuolung Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC FABRICATION HAVING FORMED THEREIN TERMINAL ELECTROD...
- Publication number 20030049924
- Publication date Mar 13, 2003
- Aptos Corporation
- Tsing-Chow Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to make a tall solder ball by placing a eutectic solder bal...
- Publication number 20020025599
- Publication date Feb 28, 2002
- Aptos Corporation
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
86686982 - APTOS
- Serial number 86686982
- Registration number 4976588
- Filing date Jul 8, 2015
- Aptos, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
86687143 - APTOS
- Serial number 86687143
- Registration number 4976589
- Filing date Jul 8, 2015
- Aptos, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75733700 - COPPER CORE CSP
- Serial number 75733700
- Filing date Jun 22, 1999
- APTOS Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75001109 - (FC)2
- Serial number 75001109
- Filing date Oct 3, 1995
- APTOS Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Organization

Patents Grantslast 30 patents

Flexible multi-chip module and method of making the same

Wafer scale integration packaging and method of making and using th...

Method for forming copper bump antioxidation surface

Method of making an ultimate low dielectric device

Apparatus and method for bubble-free application of a resin to a su...

Flat-top bumping structure and preparation method

Stacked paired die package and method of making the same

Method for forming patterned polyimide layer

Microelectronic fabrication having formed therein terminal electrod...

Microelectronic fabrication having formed therein terminal electrod...

Process to make a tall solder ball by placing a eutectic solder bal...

Method for fabricating a microelectronic fabrication having formed...

Microelectronic fabrication having formed therein terminal electrod...

Process to make a tall solder ball by placing a eutectic solder bal...

Patents Applicationslast 30 patents

Wafer scale integration packaging and method of making and using th...

Wafer level mounting frame with passive components integration for...

Flexible multi-chip module and method of making the same

Wafer level mounting frame for ball grid array packaging, and metho...

MEMS micro-cap wafer level chip scale package

Ultimate low dielectric device and method of making the same

Method for forming copper bump antioxidation surface

MEMS wafer level chip scale package

Apparatus and method for bubble-free application of a resin to a su...

FLAT-TOP BUMPING STRUCTURE AND PREPARATION METHOD

MICROELECTRONIC FABRICATION HAVING FORMED THEREIN TERMINAL ELECTROD...

Process to make a tall solder ball by placing a eutectic solder bal...

Trademarklast 30 trademarks

86686982 - APTOS

86687143 - APTOS

75733700 - COPPER CORE CSP

75001109 - (FC)2