76330816 - CU.P BOND

Information

• Trademark
• 76330816

• Source

• Serial Number

  76330816

• International Classifications

  • 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
  • 40 - Treatment of materials

• Filing Date

  October 29, 2001
  23 years ago

• Transaction Date

  July 22, 2011
  13 years ago

• Status Date

  September 17, 2002
  22 years ago

• Location Date

  September 18, 2002
  22 years ago

• Status Code

  602

• Current Location

  FILE REPOSITORY (FRANCONIA)

  Employee Name

  CLARK, ROBERT C

• Attorney Name

  Lawrence N. Ginsberg

  Law Office Assigned Location Code

  L80

• Owners

  • Advanpack Solutions Pte Ltd

Case File Statements

• GS0091: Conductive interconnect on, and extending from, an integrated circuit or semiconductor wafer; flip chip interconnect; pillar bump or interconnect; integrated circuit interconnect
• GS0401: Manufacture for others, namely, forming conductive material on an integrated circuit or semiconductor wafer; semiconductor bumping services; electroplating conductive material on integrated circuits or semiconductor wafers; integrated circuit packaging services; pillar bumping services
• PM0000: CUP BOND

Case File Event Statements

• 9/17/2002 - 22 years ago

  3 - ABANDONMENT - FAILURE TO RESPOND OR LATE RESPONSE Type: ABN2

• 1/15/2002 - 23 years ago

  2 - NON-FINAL ACTION MAILED Type: CNRT

• 1/3/2002 - 23 years ago

  1 - ASSIGNED TO EXAMINER Type: DOCK