Advanpack Solutions Pte Ltd

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and semiconductor package device using the...
- Patent number 10,763,133
- Issue date Sep 1, 2020
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate for semiconductor packaging
- Patent number 10,446,457
- Issue date Oct 15, 2019
- Advanpack Solutions PTE LTD
- Shoa Siong Lim
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,154,588
- Issue date Dec 11, 2018
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package device
- Patent number 10,109,503
- Issue date Oct 23, 2018
- Advanpack Solutions PTE LTD
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer substrate for semiconductor packaging
- Patent number 10,049,950
- Issue date Aug 14, 2018
- Advanpack Solutions PTE LTD
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package substrate and package manufacturing...
- Patent number 9,892,916
- Issue date Feb 13, 2018
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,847,268
- Issue date Dec 19, 2017
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 9,754,899
- Issue date Sep 5, 2017
- Advanpack Solutions PTE LTD
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,723,717
- Issue date Aug 1, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of substrate structure having embedded interco...
- Patent number 9,653,323
- Issue date May 16, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Semiconductor package
- Patent number 9,583,449
- Issue date Feb 28, 2017
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device carrier for fine pitch packaging miniaturizati...
- Patent number 9,396,982
- Issue date Jul 19, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier, package carrier manufacturing method, package stru...
- Patent number 9,379,044
- Issue date Jun 28, 2016
- Advanpack Solutions PTE LTD
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and manufacturing method thereof
- Patent number 9,362,206
- Issue date Jun 7, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of forming an etch-back type semiconductor pac...
- Patent number 9,305,868
- Issue date Apr 5, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package device, and manufacturin...
- Patent number 9,301,391
- Issue date Mar 29, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor element for package miniaturization
- Patent number 9,287,157
- Issue date Mar 15, 2016
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor element
- Patent number 9,269,601
- Issue date Feb 23, 2016
- Advanpack Solutions PTE LTD
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device carrier and semiconductor package using the same
- Patent number 9,219,027
- Issue date Dec 22, 2015
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Manufacturing method for semiconductor package
- Patent number 9,136,215
- Issue date Sep 15, 2015
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for encapsulation of semiconductor dies
- Patent number 9,082,775
- Issue date Jul 14, 2015
- Advanpack Solutions PTE LTD
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods of semiconductor substrate, package and device
- Patent number 9,059,050
- Issue date Jun 16, 2015
- Advanpack Solutions Pte. Ltd.
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch-back type semiconductor package, substrate and manufacturing m...
- Patent number 8,917,521
- Issue date Dec 23, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for fine pitch semiconductor devices and manufactu...
- Patent number 8,846,519
- Issue date Sep 30, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,796,844
- Issue date Aug 5, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure
- Patent number 8,766,438
- Issue date Jul 1, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor device carrier and semicondu...
- Patent number 8,709,874
- Issue date Apr 29, 2014
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor substrate, package and device
- Patent number 8,664,750
- Issue date Mar 4, 2014
- Advanpack Solutions Pte. Ltd.
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for fine pitch semiconductor devices and manufactu...
- Patent number 8,207,608
- Issue date Jun 26, 2012
- Advanpack Solutions PTE LTD
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package for fine pitch miniaturization and manufactur...
- Patent number 7,795,071
- Issue date Sep 14, 2010
- Advanpack Solutions PTE LTD
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...
- Publication number 20190035643
- Publication date Jan 31, 2019
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Substrate For Semiconductor Packaging
- Publication number 20180323121
- Publication date Nov 8, 2018
- Advanpack Solutions Pte Ltd
- Shoa Siong LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Substrate
- Publication number 20180108584
- Publication date Apr 19, 2018
- Advanpack Solutions Pte Ltd
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Assembly and Method of Fabricating a Semiconductor St...
- Publication number 20170330842
- Publication date Nov 16, 2017
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20170303399
- Publication date Oct 19, 2017
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160329306
- Publication date Nov 10, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...
- Publication number 20160293416
- Publication date Oct 6, 2016
- Advanpack Solutions Pte Ltd
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20160268225
- Publication date Sep 15, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SUBSTRATE STRUCTURE
- Publication number 20160189981
- Publication date Jun 30, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160118349
- Publication date Apr 28, 2016
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Structure and Method of Fabricating the Same
- Publication number 20160013139
- Publication date Jan 14, 2016
- Advanpack Solutions Pte Ltd
- Shoa Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150287673
- Publication date Oct 8, 2015
- Advanpack Solutions Pte Ltd
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Layer Substrate For Semiconductor Packaging
- Publication number 20150155214
- Publication date Jun 4, 2015
- Advanpack Solutions Pte Ltd
- Shoa Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20150111345
- Publication date Apr 23, 2015
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20140299984
- Publication date Oct 9, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20140167240
- Publication date Jun 19, 2014
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHODS OF SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE
- Publication number 20140134806
- Publication date May 15, 2014
- ADVANPACK SOLUTIONS PTE. LTD.
- Shoa-Siong Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...
- Publication number 20130175707
- Publication date Jul 11, 2013
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...
- Publication number 20130161809
- Publication date Jun 27, 2013
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PACKAGE CARRIER, PACKAGE CARRIER MANUFACTURING METHOD, PACKAGE STRU...
- Publication number 20130113099
- Publication date May 9, 2013
- Advanpack Solutions Pte Ltd
- Shoa-Siong Raymond Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...
- Publication number 20130020710
- Publication date Jan 24, 2013
- Advanpack Solutions Pte Ltd
- Jimmy Hwee-Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD THEREOF
- Publication number 20120220118
- Publication date Aug 30, 2012
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CARRIER AND MANUFACTU...
- Publication number 20120058604
- Publication date Mar 8, 2012
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System For Encapsulation Of Semiconductor Dies
- Publication number 20110271902
- Publication date Nov 10, 2011
- Advanpack Solutions Pte Ltd
- Amlan Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...
- Publication number 20110267789
- Publication date Nov 3, 2011
- Advanpack Solutions Pte Ltd
- Hwee-Seng Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Interconnection Structure and Semiconductor Pack...
- Publication number 20110049708
- Publication date Mar 3, 2011
- Advanpack Solutions Pte. Ltd.
- Lim Shoa Siong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20100264526
- Publication date Oct 21, 2010
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090291530
- Publication date Nov 26, 2009
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and manufacturing method thereof
- Publication number 20090102043
- Publication date Apr 23, 2009
- Advanpack Solutions Pte Ltd
- Chew Hwee-Seng Jimmy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL BONDING PROCESS FOR CHIP PACKAGING
- Publication number 20080248610
- Publication date Oct 9, 2008
- Advanpack Solutions Pte Ltd
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
76360995 - CU.P BUMP
- Serial number 76360995
- Filing date Jan 22, 2002
- Advanpack Solutions Pte Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76330816 - CU.P BOND
- Serial number 76330816
- Filing date Oct 29, 2001
- Advanpack Solutions Pte Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Advanpack Solutions Pte Ltd

Organization

Patents Grantslast 30 patents

Semiconductor structure and semiconductor package device using the...

Multi-layer substrate for semiconductor packaging

Manufacturing method of semiconductor package

Method of manufacturing semiconductor package device

Multi-layer substrate for semiconductor packaging

Manufacturing method of package substrate and package manufacturing...

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of fabricating the same

Substrate structure, semiconductor package device, and manufacturin...

Manufacturing method of substrate structure having embedded interco...

Semiconductor package

Semiconductor device carrier for fine pitch packaging miniaturizati...

Package carrier, package carrier manufacturing method, package stru...

Chip and manufacturing method thereof

Manufacturing method of forming an etch-back type semiconductor pac...

Substrate structure, semiconductor package device, and manufacturin...

Semiconductor element for package miniaturization

Method of manufacturing semiconductor element

Semiconductor device carrier and semiconductor package using the same

Manufacturing method for semiconductor package

System for encapsulation of semiconductor dies

Manufacturing methods of semiconductor substrate, package and device

Etch-back type semiconductor package, substrate and manufacturing m...

Interconnections for fine pitch semiconductor devices and manufactu...

Package structure

Package structure

Manufacturing method for semiconductor device carrier and semicondu...

Semiconductor substrate, package and device

Interconnections for fine pitch semiconductor devices and manufactu...

Semiconductor package for fine pitch miniaturization and manufactur...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR PACKAGE DEVICE USING THE...

Multi-Layer Substrate For Semiconductor Packaging

Semiconductor Substrate

Semiconductor Assembly and Method of Fabricating a Semiconductor St...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE SUBSTRATE AND PACKAGE MANUFACTURING...

CHIP AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF SUBSTRATE STRUCTURE

SEMICONDUCTOR PACKAGE

Semiconductor Structure and Method of Fabricating the Same

SEMICONDUCTOR PACKAGE

Multi-Layer Substrate For Semiconductor Packaging

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

CHIP AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME

MANUFACTURING METHODS OF SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE DEVICE, AND MANUFACTURIN...

PACKAGE CARRIER, PACKAGE CARRIER MANUFACTURING METHOD, PACKAGE STRU...

SEMICONDUCTOR SUBSTRATE, PACKAGE AND DEVICE AND MANUFACTURING METHO...

CHIP AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE CARRIER AND MANUFACTU...

System For Encapsulation Of Semiconductor Dies

ETCH-BACK TYPE SEMICONDUCTOR PACKAGE, SUBSTRATE AND MANUFACTURING M...

Semiconductor Chip Interconnection Structure and Semiconductor Pack...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor package and manufacturing method thereof

THERMAL BONDING PROCESS FOR CHIP PACKAGING

Trademarklast 30 trademarks

76360995 - CU.P BUMP

76330816 - CU.P BOND