TREA

79364266 - BONDTECH

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Information

  • Trademark
  • 79364266
  • Serial Number
    79364266
  • Registration Number
    7525561
  • Filing Date
    July 27, 2022
    2 years ago
  • Registration Date
    October 08, 2024
    2 months ago
  • Transaction Date
    October 08, 2024
    2 months ago
  • Status Date
    October 08, 2024
    2 months ago
  • Published for Opposition Date
    July 23, 2024
    5 months ago
  • Location Date
    October 07, 2024
    2 months ago
  • Status Code
    700
  • Current Location
    FILE REPOSITORY (FRANCONIA)
    Employee Name
    MONINGHOFF, KIM
  • Attorney Docket Number
    SY7AK-06-TM
    Attorney Name
    Shintaro Yamada
  • Owners
Information
Mark Drawing Code
3
Mark Identification
BONDTECH
Case File Statements
  • DM0000: The mark consists of the stylized wording "BONDTECH" combined with an oval outline.
  • GS0071: Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; machine couplings and transmission components and machine elements in the nature of shock prevention devices for semiconductor manufacturing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and semiconductor exposure apparatuses for use in manufacture, and structural components thereof; positioning devices for semiconductor manufacturing equipment, namely, ball transfer units, and components thereof, namely, bearings, as parts of machines; hydraulic and pneumatic controls for semiconductor manufacturing equipment, and components thereof, namely, hydraulic valves being parts of machines, and oil-water separators for pneumatic controls being parts of machines; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines and exposure apparatuses for use in manufacture; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; machines for nanoimprint lithography (NIL) for semiconductor manufacturing; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing and marking machines and components and appendages in the nature of parts thereof; equipment for cleaning microelectromechanical systems (MEMS), namely, dust removing installations for cleaning purposes, and components and appendages in the nature of parts thereof; cleaning devices for semiconductor manufacturing, namely, cleaning machines for semiconductor manufacturing machines; devices in the nature of machines for mounting IC chips on circuit boards; plasma etching machines; semiconductor exposure devices, namely, apparatus for use in manufacture; semiconductor cutting devices being parts of machines; semiconductor polishing devices being parts of machines; semiconductor plating devices being parts of machines; semiconductor etching devices being parts of machines; semiconductor thin-film formation devices being parts of machines; none of the aforementioned goods being 3D printers or machines for moulding plastics, or parts or fittings thereof
  • GS0371: Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of positioning devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of control devices for semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of machines for nanoimprint lithography (NIL) for semiconductor manufacturing, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of equipment for cleaning microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of cleaning devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of wafer foreign matter inspection devices for semiconductor manufacturing, and providing information related thereto; repair and maintenance of plasma etching machines, and providing information related thereto; repair and maintenance of semiconductor exposure devices, and providing information related thereto; repair and maintenance of semiconductor cutoff devices, and providing information related thereto; repair and maintenance of semiconductor polishing devices, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor etching devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of semiconductor drying devices, and providing information related thereto; cleaning of machines and apparatuses for semiconductor manufacturing; cleaning of semiconductor manufacturing equipment; installation work of semiconductor testing equipment, and providing information related thereto; installation work of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto; installation work, repair, and maintenance of computer hardware, and providing information related thereto; none of the aforementioned services being intended for 3D printers or for machines for moulding plastics, or parts thereof
  • DS0000: "BOND TECH" for Semiconductor manufacturing equipment, namely, semiconductor manufacturing machines, and semiconductor wafer processing equipment; semiconductor manufacturing machines and components thereof; semiconductor manufacturing machines and structural components thereof; machines for manufacturing semiconductor equipment, semiconductor manufacturing machine components and appendages being parts of semiconductor manufacturing machines; semiconductor wafer processing machines and equipment, and structural components thereof; robots for manufacturing semiconductors, and structural components and appendages in the nature of structural parts thereof; semiconductor wafer processing equipment and structural components thereof; wafer manufacturing equipment for semiconductor manufacturing; semiconductor element manufacturing machines; semiconductor element manufacturing equipment, namely, machines therefor; integrated circuit manufacturing equipment, namely, machines therefor, and components thereof; stacked semiconductor chips manufacturing equipment, namely, machines for manufacturing stacked semiconductor chips; equipment for manufacturing and processing microelectromechanical systems (MEMS), namely, electromechanical manufacturing machines and components and appendages in the nature of parts thereof; semiconductor plating devices being parts of machines; semiconductor thin-film formation devices being parts of machines, in International Class 7, and Repair and maintenance of semiconductor manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines, and providing information related thereto; repair and maintenance of semiconductor manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor product manufacturing equipment, and providing information related thereto; repair and maintenance of semiconductor processing machines and apparatuses, and providing information related thereto; repair and maintenance of robots for manufacturing semiconductors, and providing information related thereto; repair and maintenance of semiconductor wafer processing equipment, and providing information related thereto; repair and maintenance of wafer manufacturing equipment for semiconductor manufacturing, and providing information related thereto; repair and maintenance of semiconductor element manufacturing machines and apparatuses, and providing information related thereto; repair and maintenance of semiconductor element manufacturing equipment, and providing information related thereto; repair and maintenance of integrated circuit manufacturing equipment, and providing information related thereto; repair and maintenance of stacked semiconductor chips manufacturing equipment, and providing information related thereto; repair and maintenance of equipment for manufacturing and processing microelectromechanical systems (MEMS), and providing information related thereto; repair and maintenance of devices for mounting IC chips on circuit boards, and providing information related thereto; repair and maintenance of semiconductor plating devices, and providing information related thereto; repair and maintenance of semiconductor thin-film formation devices, and providing information related thereto; repair and maintenance of electronic machines and apparatuses, and providing information related thereto in International Class 37
Case File Event Statements
  • 3/3/2023 - a year ago
    2 - NEW APPLICATION OFFICE SUPPLIED DATA ENTERED Type: NWOS
  • 3/2/2023 - a year ago
    1 - SN ASSIGNED FOR SECT 66A APPL FROM IB Type: REPR
  • 3/7/2023 - a year ago
    3 - APPLICATION FILING RECEIPT MAILED Type: MAFR
  • 5/15/2023 - a year ago
    4 - ASSIGNED TO EXAMINER Type: DOCK
  • 5/22/2023 - a year ago
    5 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 5/23/2023 - a year ago
    6 - NON-FINAL ACTION (IB REFUSAL) PREPARED FOR REVIEW Type: RFCR
  • 7/5/2023 - a year ago
    7 - REFUSAL PROCESSED BY MPU Type: RFRR
  • 7/5/2023 - a year ago
    8 - NON-FINAL ACTION MAILED - REFUSAL SENT TO IB Type: RFCS
  • 7/26/2023 - a year ago
    9 - REFUSAL PROCESSED BY IB Type: RFNT
  • 7/30/2023 - a year ago
    10 - LIMITATION OF GOODS RECEIVED FROM IB Type: LIMG
  • 10/25/2023 - a year ago
    11 - LIMITATION FROM THE IB - REQUEST EXAM REVIEW Type: LIME
  • 10/25/2023 - a year ago
    12 - ATTORNEY REVIEW COMPLETED Type: ATRV
  • 12/21/2023 - a year ago
    13 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 12/21/2023 - a year ago
    14 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 12/22/2023 - a year ago
    15 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 1/9/2024 - 11 months ago
    16 - NON-FINAL ACTION WRITTEN Type: CNRT
  • 1/9/2024 - 11 months ago
    17 - NON-FINAL ACTION E-MAILED Type: GNRT
  • 1/9/2024 - 11 months ago
    18 - NOTIFICATION OF NON-FINAL ACTION E-MAILED Type: GNRN
  • 6/17/2024 - 6 months ago
    21 - TEAS/EMAIL CORRESPONDENCE ENTERED Type: TEME
  • 6/17/2024 - 6 months ago
    20 - CORRESPONDENCE RECEIVED IN LAW OFFICE Type: CRFA
  • 6/17/2024 - 6 months ago
    19 - TEAS RESPONSE TO OFFICE ACTION RECEIVED Type: TROA
  • 6/20/2024 - 6 months ago
    22 - APPROVED FOR PUB - PRINCIPAL REGISTER Type: CNSA
  • 7/3/2024 - 5 months ago
    23 - NOTIFICATION OF NOTICE OF PUBLICATION E-MAILED Type: NONP
  • 7/23/2024 - 5 months ago
    24 - PUBLISHED FOR OPPOSITION Type: PUBO
  • 7/23/2024 - 5 months ago
    25 - OFFICIAL GAZETTE PUBLICATION CONFIRMATION E-MAILED Type: NPUB
  • 8/17/2024 - 4 months ago
    28 - NOTIFICATION OF POSSIBLE OPPOSITION - PROCESSED BY IB Type: OPNX
  • 10/8/2024 - 2 months ago
    29 - REGISTERED-PRINCIPAL REGISTER Type: R.PR
  • 10/8/2024 - 2 months ago
    30 - NOTICE OF REGISTRATION CONFIRMATION EMAILED Type: NRCC
  • 7/31/2024 - 4 months ago
    26 - NOTIFICATION OF POSSIBLE OPPOSITION CREATED, TO BE SENT TO IB Type: OPNR
  • 7/31/2024 - 4 months ago
    27 - NOTIFICATION OF POSSIBLE OPPOSITION SENT TO IB Type: OPNS