BONDTECH CO., LTD.

Organization

Uji-City, Kyoto, JP

Organizations

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Resin shaping device
- Patent number 12,341,036
- Issue date Jun 24, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 12,261,147
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system and component mounting method
- Patent number 12,261,070
- Issue date Mar 25, 2025
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding device
- Patent number 12,094,747
- Issue date Sep 17, 2024
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate joining method, substrate joining system and method for c...
- Patent number 11,837,444
- Issue date Dec 5, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component mounting system
- Patent number 11,587,804
- Issue date Feb 21, 2023
- BONDTECH CO., LTD.
- Akira Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding substrates together, and substrate bonding device
- Patent number 10,580,752
- Issue date Mar 3, 2020
- BONDTECH CO., LTD.
- Akira Yamauchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 10,204,785
- Issue date Feb 12, 2019
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate bonding apparatus and substrate bonding method
- Patent number 9,870,922
- Issue date Jan 16, 2018
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding-substrate fabrication method, bonding substrate, substrate...
- Patent number 9,601,350
- Issue date Mar 21, 2017
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure application apparatus and pressure application method
- Patent number 9,379,082
- Issue date Jun 28, 2016
- BONDTECH CO., LTD.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure application apparatus and pressure application method
- Patent number 9,243,894
- Issue date Jan 26, 2016
- BONDTECH CO., LTD.
- Akira Yamauchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip-on-wafer bonding method and bonding device, and structure comp...
- Patent number 9,142,532
- Issue date Sep 22, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,651,363
- Issue date Feb 18, 2014
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 8,091,764
- Issue date Jan 10, 2012
- Bondtech, Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Joining method and device produced by this method and joining unit
- Patent number 7,784,670
- Issue date Aug 31, 2010
- Bondtech Inc.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding method, device produced by this method, and bonding device
- Patent number 7,645,681
- Issue date Jan 12, 2010
- Bondtech, Inc.
- Masuaki Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM
- Publication number 20240304594
- Publication date Sep 12, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240174457
- Publication date May 30, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20240162063
- Publication date May 16, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079373
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20240079374
- Publication date Mar 7, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDER, AND BONDING SYSTEM
- Publication number 20240066624
- Publication date Feb 29, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM
- Publication number 20240009984
- Publication date Jan 11, 2024
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
CHIP BONDING SYSTEM AND CHIP BONDING METHOD
- Publication number 20230307284
- Publication date Sep 28, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20230154770
- Publication date May 18, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...
- Publication number 20230136771
- Publication date May 4, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE
- Publication number 20230030272
- Publication date Feb 2, 2023
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING DEVICE
- Publication number 20210320024
- Publication date Oct 14, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD
- Publication number 20210313211
- Publication date Oct 7, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210265300
- Publication date Aug 26, 2021
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...
- Publication number 20200006099
- Publication date Jan 2, 2020
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20180068854
- Publication date Mar 8, 2018
- BONDTECH CO., LTD.
- Tadatomo SUGA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE
- Publication number 20170221856
- Publication date Aug 3, 2017
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD
- Publication number 20170047225
- Publication date Feb 16, 2017
- BONDTECH CO., LTD.
- Tadatomo SUGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD
- Publication number 20160084638
- Publication date Mar 24, 2016
- BONDTECH CO., LTD.
- Akira YAMAUCHI
- G01 - MEASURING TESTING
Information Patent Application
CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...
- Publication number 20150048523
- Publication date Feb 19, 2015
- BONDTECH CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140048805
- Publication date Feb 20, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...
- Publication number 20140037945
- Publication date Feb 6, 2014
- LAN TECHNICAL SERVICE CO., LTD.
- Tadatomo Suga
- B32 - LAYERED PRODUCTS
Information Patent Application
PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD
- Publication number 20120127485
- Publication date May 24, 2012
- BONDTECH CO., LTD.
- Akira Yamauchi
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20120104076
- Publication date May 3, 2012
- TADATOMO SUGA
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT
- Publication number 20100252615
- Publication date Oct 7, 2010
- Bondtech, Inc
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Joining Method and Device Produced by this Method and Joining Unit
- Publication number 20080245843
- Publication date Oct 9, 2008
- BONDTECH INC.
- Tadatomo Suga
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method, device formed by such method, surface activating un...
- Publication number 20070110917
- Publication date May 17, 2007
- Bondtech, Inc
- Masuaki Okada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding method, device produced by this method, and bonding device
- Publication number 20070111471
- Publication date May 17, 2007
- Bondtech, Inc
- Masuaki Okada
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Trademarklast 30 trademarks

Information Trademark
98857478 - BONDTECH
- Serial number 98857478
- Filing date Nov 17, 2024
- Bondtech Corporation
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
98857477 - MAGNETGAS
- Serial number 98857477
- Filing date Nov 17, 2024
- Bondtech Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
79364266 - BONDTECH
- Serial number 79364266
- Registration number 7525561
- Filing date Jul 27, 2022
- Bondtech Co., Ltd.
- 7 - Machines and machine tools
Information Trademark
86323638 - BONDTECH
- Serial number 86323638
- Registration number 4742361
- Filing date Jun 29, 2014
- Bondtech Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth

BONDTECH CO., LTD.

Organization

Patents Grantslast 30 patents

Resin shaping device

Bonding system and bonding method

Component mounting system and component mounting method

Substrate bonding device

Substrate joining method, substrate joining system and method for c...

Component mounting system

Method for bonding substrates together, and substrate bonding device

Substrate bonding apparatus and substrate bonding method

Substrate bonding apparatus and substrate bonding method

Bonding-substrate fabrication method, bonding substrate, substrate...

Pressure application apparatus and pressure application method

Pressure application apparatus and pressure application method

Chip-on-wafer bonding method and bonding device, and structure comp...

Joining method and device produced by this method and joining unit

Joining method and device produced by this method and joining unit

Joining method and device produced by this method and joining unit

Bonding method, device produced by this method, and bonding device

Patents Applicationslast 30 patents

BONDING METHOD, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING SYSTEM

BONDING SYSTEM AND BONDING METHOD

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING SYSTEM AND BONDING METHOD

BONDING METHOD, BONDER, AND BONDING SYSTEM

SUBSTRATE BONDING METHOD AND SUBSTRATE BONDING SYSTEM

CHIP BONDING SYSTEM AND CHIP BONDING METHOD

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

SUBSTRATE JOINING METHOD, SUBSTRATE JOINING SYSTEM AND METHOD FOR C...

BONDING METHOD, BONDED ARTICLE, AND BONDING DEVICE

SUBSTRATE BONDING DEVICE

COMPONENT MOUNTING SYSTEM AND COMPONENT MOUNTING METHOD

BONDING SYSTEM AND BONDING METHOD

COMPONENT MOUNTING SYSTEM, RESIN SHAPING DEVICE, RESIN PLACING DEVI...

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

METHOD FOR BONDING SUBSTRATES TOGETHER, AND SUBSTRATE BONDING DEVICE

SUBSTRATE BONDING APPARATUS AND SUBSTRATE BONDING METHOD

PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD

CHIP-ON-WAFER BONDING METHOD AND BONDING DEVICE, AND STRUCTURE COMP...

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

BONDING-SUBSTRATE FABRICATION METHOD, BONDING SUBSTRATE, SUBSTRATE...

PRESSURE APPLICATION APPARATUS AND PRESSURE APPLICATION METHOD

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

JOINING METHOD AND DEVICE PRODUCED BY THIS METHOD AND JOINING UNIT

Joining Method and Device Produced by this Method and Joining Unit

Bonding method, device formed by such method, surface activating un...

Bonding method, device produced by this method, and bonding device

Trademarklast 30 trademarks

98857478 - BONDTECH

98857477 - MAGNETGAS

79364266 - BONDTECH

86323638 - BONDTECH